The category is 'Memory'
Memory (241)
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BGA-209
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of Terminals | Access Time-Max | Brand | Clock Frequency-Max (fCLK) | Data Rate Architecture | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Operating Mode | Supply Current-Max | Access Time | Architecture | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Product Type | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Product Category | Length | Width | Radiation Hardening |
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![]() | Mfr Part No GS8642Z72C-167I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 8 ns | GSI Technology | 167 MHz | SDR | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8642Z72C-167I | 167 MHz | 125@Flow-Through/167@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 72 Bit | 1 MWords | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA209,11X19,40 | BGA209,11X19,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.18 | Compliant | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | NBT SRAM | 2.5, 3.3 V | Industrial grade | -40 to 85 °C | Tray | GS8642Z72C | No | 3A991.B.2.B | NBT Pipeline/Flow Through | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | 2.5/3.3 V | INDUSTRIAL | 2.3 V | 72 Mbit | 8 | SYNCHRONOUS | 280 mA, 360 mA | 8 ns | Flow-Through/Pipelined | 1 M x 72 | 3-STATE | 1.7 mm | 72 | 20 Bit | SRAM | 72 Mbit | 0.12 A | 75497472 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | SRAM | 22 mm | 14 mm | No | ||||
![]() | Mfr Part No GS8162Z72CGC-150I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 7.5 ns | GSI Technology | SDR | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8162Z72CGC-150I | 150 MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.17 | Compliant | Yes | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | NBT SRAM | 2.5, 3.3 V | Industrial grade | -40 to 85 °C | Tray | GS8162Z72CGC | e1 | Yes | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | INDUSTRIAL | 2.3 V | 18 Mbit | 8 | SYNCHRONOUS | 220 mA, 240 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | ZBT SRAM | SRAM | 22 mm | 14 mm | No | ||||||||||
![]() | Mfr Part No GS864272C-250M | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 14 | Parallel | GSI Technology | 250 MHz | 153@Flow-Through/250@Pipelined MHz | 2.7, 3.6 V | + 125 C | SDR | 2.3, 3 V | - 55 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 1 MWords | Compliant | FBGA | 3.6 V | 2.3 V | Synchronous | SyncBurst | 2.5, 3.3 V | Military grade | -55 to 125 °C | Bulk | GS864272C | SCD/DCD Pipeline/Flow Through | 125 °C | -55 °C | Memory & Data Storage | 209 | 72 Mbit | 8 | 360 mA, 500 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 72 | 20 Bit | SRAM | 72 Mbit | Military | SRAM | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8162Z72CGC-150 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 7.5 ns | GSI Technology | SDR | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8162Z72CGC-150 | 150 MHz | 133.3@Flow-Through/150@Pipelined MHz | 2.7, 3.6 V | + 70 C | SDR | 2.3, 3 V | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | 256000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.17 | Details | Yes | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | NBT SRAM | 2.5, 3.3 V | Commercial grade | 0 to 70 °C | Tray | GS8162Z72CGC | e1 | Yes | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | COMMERCIAL | 2.3 V | 18 Mbit | 8 | SYNCHRONOUS | 210 mA, 230 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | ZBT SRAM | SRAM | 22 mm | 14 mm | |||||||||||||
![]() | Mfr Part No GS8162Z72CGC-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 21 | Parallel | GSI Technology | 200 MHz | 153.8@Flow-Through/200@Pipelined MHz | 2.7, 3.6 V | + 70 C | SDR | 2.3, 3 V | 0 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | Details | FBGA | 3.6 V | 2.3 V | Synchronous | NBT SRAM | 2.5, 3.3 V | Commercial grade | 0 to 70 °C | Tray | GS8162Z72CGC | NBT Pipeline/Flow Through | Memory & Data Storage | 209 | 18 Mbit | 8 | 230 mA, 290 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8322Z72GC-200IV | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 14 | Parallel | GSI Technology | 200 MHz | 133.3@Flow-Through/200@Pipelined MHz | 2, 2.7 V | + 85 C | SDR | 1.7, 2.3 V | - 40 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 512 kWords | Details | FBGA | 2.7 V | 1.7 V | Synchronous | NBT SRAM | 1.8, 2.5 V | Industrial grade | -40 to 85 °C | Tray | GS8322Z72GC | NBT | Memory & Data Storage | 209 | 36 Mbit | 8 | 245 mA, 340 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8322Z72C-225M | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 4.4 ns | GSI Technology | 225 MHz | SDR | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8322Z72C-225M | 225 MHz | 143@Flow-Through/225@Pipelined MHz | 2.7, 3.6 V | + 125 C | SDR | 2.3, 3 V | - 55 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 512 kWords | 512000 | 125 °C | -55 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA209,11X19,40 | BGA209,11X19,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | 5.16 | N | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | NBT SRAM | 2.5, 3.3 V | Military grade | -55 to 125 °C | Tray | GS8322Z72C | 3A991.B.2.B | NBT Pipeline/Flow Through | 125 °C | -55 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE, LATE WRITE, IT ALSO OPERATES AT 3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | 2.5/3.3 V | MILITARY | 2.3 V | 36 Mbit | 8 | SYNCHRONOUS | 300 mA, 390 mA | 7 ns | Flow-Through/Pipelined | 512 k x 72 | 3-STATE | 1.7 mm | 72 | 19 Bit | SRAM | 36 Mbit | 0.2 A | 37748736 bit | Military | PARALLEL | COMMON | ZBT SRAM | 2.3 V | SRAM | 22 mm | 14 mm | No | ||||||||
![]() | Mfr Part No GS8642Z72GC-167IV | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 8 ns | GSI Technology | SDR | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8642Z72GC-167IV | 167 MHz | 125@Flow-Through/167@Pipelined MHz | 2, 2.7 V | + 85 C | SDR | 1.7, 2.3 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 72 Bit | 1 MWords | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 1.5 | Compliant | Yes | FBGA | 2.7 V | 1.7 V | 1.8 V | Synchronous | NBT SRAM | 1.8, 2.5 V | Industrial grade | -40 to 85 °C | Tray | GS8642Z72GC | e1 | Yes | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2 V | INDUSTRIAL | 1.7 V | 72 Mbit | 8 | SYNCHRONOUS | 280 mA, 360 mA | 8 ns | Flow-Through/Pipelined | 1 M x 72 | 1.7 mm | 72 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | ZBT SRAM | SRAM | 22 mm | 14 mm | No | |||||||||
![]() | Mfr Part No GS832272C-133I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 8.5 ns | 133 MHz | SDR | GSI TECHNOLOGY | Parallel | GSI Technology | GS832272C-133I | 133 MHz | 117.6@Flow-Through/133@Pipelined MHz | 2.7, 3.6 V | + 85 C | 2.3, 3 V | - 40 C | 3 | Surface Mount | SMD/SMT | 72 Bit | 512 kWords | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA209,11X19,40 | BGA209,11X19,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.13 | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | 2.5, 3.3 V | Industrial grade | -40 to 85 °C | GS832272C | No | 3A991.B.2.B | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | 2.5/3.3 V | INDUSTRIAL | 2.3 V | 36 Mbit | 8 | SYNCHRONOUS | 0.255 mA | 8.5 ns | Flow-Through/Pipelined | 512KX72 | 3-STATE | 1.7 mm | 72 | 19 Bit | 36 Mbit | 0.08 A | 37748736 bit | Industrial | PARALLEL | COMMON | CACHE SRAM | 2.38 V | 22 mm | 14 mm | |||||||||||||||||
![]() | Mfr Part No GS864272GC-250IV | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 6.5 ns | GSI Technology | SDR | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS864272GC-250IV | 250 MHz | 153.8@Flow-Through/250@Pipelined MHz | 2, 2.7 V | + 85 C | SDR | 1.7, 2.3 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 72 Bit | 1 MWords | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.18 | Details | Yes | FBGA | 2.7 V | 1.7 V | 1.8 V | Synchronous | SyncBurst | 1.8, 2.5 V | Industrial grade | -40 to 85 °C | Tray | GS864272GC | e1 | Yes | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2 V | INDUSTRIAL | 1.7 V | 72 Mbit | 8 | SYNCHRONOUS | 340 mA, 480 mA | 6.5 ns | Flow-Through/Pipelined | 1 M x 72 | 1.7 mm | 72 | 20 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | ||||||||||||
![]() | Mfr Part No GS832272C-250I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 9 Weeks, 4 Days | BGA-209 | YES | 209 | 6.5 ns | GSI Technology | 250 MHz | SDR | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS832272C-250I | 250 MHz | 153.8@Flow-Through/250@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 72 Bit | 512 kWords | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA209,11X19,40 | BGA209,11X19,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 4.75 | Compliant | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | 0.887207 oz | Industrial grade | -40 to 85 °C | Tray | GS832272C | No | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | 2.5/3.3 V | INDUSTRIAL | 2.3 V | 36 Mbit | 8 | SYNCHRONOUS | 285 mA, 400 mA | 6.5 ns | Flow-Through/Pipelined | 512 k x 72 | 3-STATE | 1.7 mm | 72 | 19 Bit | SRAM | 36 Mbit | 0.08 A | 37748736 bit | Industrial | PARALLEL | COMMON | CACHE SRAM | 2.38 V | SRAM | 22 mm | 14 mm | No | |||
![]() | Mfr Part No GS8642Z72GC-167I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 8 ns | GSI Technology | 167 MHz | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8642Z72GC-167I | 167 MHz | 125@Flow-Through/167@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | 3 | SMD/SMT | 72 Bit | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA209,11X19,40 | BGA209,11X19,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.18 | Details | Yes | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | NBT SRAM | 2.5, 3.3 V | Industrial grade | -40 to 85 °C | Tray | GS8642Z72GC | e1 | Yes | 3A991.B.2.B | NBT Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | 2.5/3.3 V | INDUSTRIAL | 2.3 V | 72 Mbit | SYNCHRONOUS | 280 mA, 360 mA | 8@Flow-Through/3.5@P | 1 M x 72 | 3-STATE | 1.7 mm | 72 | SRAM | 0.12 A | 72 | Industrial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | SRAM | 22 mm | 14 mm | |||||||||||
![]() | Mfr Part No GS8322Z72C-166 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 8 ns | GSI Technology | SDR | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8322Z72C-166 | 166 MHz | 2.7, 3.6 V | + 70 C | SDR | 2.3, 3 V | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 72 Bit | 512 kWords | 512000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 1.63 | N | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | NBT SRAM | 2.5, 3.3 V | Commercial grade | 0 to 70 °C | Tray | GS8322Z72C | No | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | COMMERCIAL | 2.3 V | 36 Mbit | 8 | SYNCHRONOUS | 225 mA, 280 mA | 8 ns | Flow-Through/Pipelined | 512 k x 72 | 1.7 mm | 72 | 19 Bit | SRAM | 36 Mbit | 37748736 bit | Commercial | PARALLEL | ZBT SRAM | SRAM | 22 mm | 14 mm | ||||||||||||||||
![]() | Mfr Part No GS816272CGC-333I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 21 | Parallel | GSI Technology | 333 MHz | 222.2@Flow-Through/333@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | Details | FBGA | 3.6 V | 2.3 V | Synchronous | SyncBurst | 2.5, 3.3 V | Industrial grade | -40 to 85 °C | Tray | GS816272CGC | Pipeline/Flow Through | Memory & Data Storage | 209 | 18 Mbit | 8 | 330 mA, 400 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS832272C-225V | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 7 ns | GSI Technology | SDR | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS832272C-225V | 225 MHz | 142.8@Flow-Through/225@Pipelined MHz | 2, 2.7 V | + 70 C | SDR | 1.7, 2.3 V | 0 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 512 kWords | 512000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.14 | N | No | FBGA | 2.7 V | 1.7 V | 1.8 V | Synchronous | SyncBurst | 1.8, 2.5 V | Commercial grade | 0 to 70 °C | Tray | GS832272C | No | 3A991.B.2.B | Synchronous Burst | FLOW-THROUGH OR PIELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2 V | COMMERCIAL | 1.7 V | 36 Mbit | 8 | SYNCHRONOUS | 255 mA, 350 mA | 7 ns | Flow-Through/Pipelined | 512 k x 72 | 1.7 mm | 72 | 19 Bit | SRAM | 36 Mbit | 37748736 bit | Commercial | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | ||||||||||||||||
![]() | Mfr Part No GS8322Z72GC-200V | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 14 | Parallel | GSI Technology | 200 MHz | 133.3@Flow-Through/200@Pipelined MHz | 2, 2.7 V | + 70 C | SDR | 1.7, 2.3 V | 0 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 512 kWords | Details | FBGA | 2.7 V | 1.7 V | Synchronous | NBT SRAM | 1.8, 2.5 V | Commercial grade | 0 to 70 °C | Tray | GS8322Z72GC | NBT | Memory & Data Storage | 209 | 36 Mbit | 8 | 235 mA, 320 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8322Z72C-150V | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 14 | Parallel | GSI Technology | 150 MHz | 117.6@Flow-Through/150@Pipelined MHz | 2, 2.7 V | + 70 C | SDR | 1.7, 2.3 V | 0 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 512 kWords | N | FBGA | 2.7 V | 1.7 V | Synchronous | NBT SRAM | 1.8, 2.5 V | Commercial grade | 0 to 70 °C | Tray | GS8322Z72C | NBT | Memory & Data Storage | 209 | 36 Mbit | 8 | 210 mA, 260 mA | 8.5 ns | Flow-Through/Pipelined | 512 k x 72 | 19 Bit | SRAM | 36 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816273CGC-250I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 21 | Parallel | GSI Technology | 250 MHz | 250 MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | Details | FBGA | 3.6 V | 2.3 V | Synchronous | SyncBurst | 2.5, 3.3 V | Industrial grade | -40 to 85 °C | Tray | GS816273CGC | Pipeline | Memory & Data Storage | 209 | 18 Mbit | 8 | 360 mA | 5.5 ns | Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Industrial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816272CC-250V | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 5.5 ns | GSI Technology | SDR | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816272CC-250V | 250 MHz | 181.8@Flow-Through/250@Pipelined MHz | 2, 2.7 V | + 70 C | SDR | 1.7, 2.3 V | 0 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | 256000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.16 | N | No | BGA | 2.7 V | 1.7 V | 1.8 V | Synchronous | SyncBurst | 1.8, 2.5 V | Commercial grade | 0 to 70 °C | Tray | GS816272CC | No | 3A991.B.2.B | SCD/DCD | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2 V | COMMERCIAL | 1.7 V | 18 Mbit | 8 | SYNCHRONOUS | 265 mA, 350 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | ||||||||||||||||
![]() | Mfr Part No GS816272CGC-300I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 5 ns | GSI Technology | SDR | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816272CGC-300I | 300 MHz | 200@Flow-Through/300@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.16 | Details | Yes | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | Industrial grade | -40 to 85 °C | Tray | GS816272CGC | e1 | Yes | 3A991.B.2.B | Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | INDUSTRIAL | 2.3 V | 18 Mbit | 8 | SYNCHRONOUS | 300 mA, 375 mA | 5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm |
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GS816272CGC-300I
GSI Technology
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