The category is 'Memory'
Memory (497)
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- Power Supplies:
1.5/1.8,1.8 V
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Access Time-Max | Base Product Number | Brand | Clock Frequency-Max (fCLK) | Data Rate Architecture | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Architecture | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Product Type | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Product Category | Memory Organization | Length | Width | Radiation Hardening |
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![]() | Mfr Part No GS8662TT11BD-350I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-165 | YES | 165 | 0.45 ns | GSI Technology | 350 MHz | 15 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8662TT11BD-350I | 350 MHz | + 85 C | DDR | - 40 C | Yes | SMD/SMT | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.23 | No | 1.9 V | 1.7 V | 1.8 V | SigmaDDR-II+ | Tray | GS8662TT11BD | e0 | No | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 72 Mbit | SYNCHRONOUS | 600 mA | 8 M x 9 | 3-STATE | 1.4 mm | 9 | SRAM | 0.24 A | 72 | PARALLEL | COMMON | DDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8342Q36AE-250M | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | YES | 165 | 0.45 ns | 250 MHz | GSI TECHNOLOGY | GSI Technology | GS8342Q36AE-250M | 1048576 words | 1000000 | 125 °C | -55 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | 5.8 | Compliant | No | 1.8 V | Bulk | 3A991.B.2.B | 125 °C | -55 °C | PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 1 | 1 mm | unknown | 165 | R-PBGA-B165 | Not Qualified | 1.8 V | 1.9 V | 1.5/1.8,1.8 V | MILITARY | 1.7 V | 2 | SYNCHRONOUS | 0.85 mA | 1MX36 | 3-STATE | 1.5 mm | 36 | 19 b | 36 Mb | 0.3 A | 36 | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 17 mm | 15 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8342TT20BGD-500I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | BGA-165 | YES | 165-FPBGA (15x13) | 165 | 0.45 ns | GS8342TT | GSI Technology | 500 MHz | DDR | 15 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8342TT20BGD-500I | 500 MHz | 500 MHz | 1.9 V | + 85 C | DDR | GSI Technology Inc. | 1.7 V | - 40 C | Yes | Surface Mount | SMD/SMT | 18 Bit | 2 MWords | 2000000 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | Active | NOT SPECIFIED | 4.9 | Details | Yes | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaDDR-II+ | 1.8000 V | Industrial grade | -40 to 100 °C | Tray | GS8342TT20BGD | 3A991.B.2.B | SigmaQuad-II+ | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | SRAM - Quad Port, Synchronous | 1.7V ~ 1.9V | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 36 Mbit | 1 | SYNCHRONOUS | 500 MHz | 740 mA | 450 ps | SRAM | Parallel | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | - | 20 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | SRAM | 2M x 18 | 15 mm | 13 mm | ||||||||||
![]() | Mfr Part No GS8342QT19BGD-333I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | BGA-165 | YES | 165-FPBGA (15x13) | 165 | 0.45 ns | GS8342Q | GSI Technology | 333 MHz | QDR | 15 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8342QT19BGD-333I | 333 MHz | 333 MHz | 1.9 V | + 85 C | DDR | GSI Technology Inc. | 1.7 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 18 Bit | 2 MWords | 2000000 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | Active | NOT SPECIFIED | 5.22 | Details | Yes | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II+ | 1.8000 V | Industrial grade | -40 to 100 °C | Tray | GS8342QT19BGD | e1 | Yes | 3A991.B.2.B | SigmaQuad-II+ B2 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | SRAM - Quad Port, Synchronous | 1.7V ~ 1.9V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.8 V | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 36 Mbit | 2 | SYNCHRONOUS | 333 MHz | 895 mA | SRAM | Parallel | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | - | 20 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | SRAM | 2M x 18 | 15 mm | 13 mm | No | |||
![]() | Mfr Part No GS8662Q36BD-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-165 | YES | 165 | 0.45 ns | 200 MHz | QDR | GSI TECHNOLOGY | Parallel | GSI Technology | GS8662Q36BD-200 | 200 MHz | 200 MHz | 1.9 V | + 70 C | 1.7 V | 0 C | Surface Mount | SMD/SMT | 36 Bit | 2 MWords | 2000000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.34 | No | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | 1.8000 V | Commercial grade | 0 to 85 °C | e0 | No | 3A991.B.2.B | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | 72 Mbit | 2 | SYNCHRONOUS | 740 mA | Pipelined | 2 M x 36 | 3-STATE | 1.4 mm | 36 | 20 Bit | 72 Mbit | 75497472 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8662TT07BD-450 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-165 | YES | 165 | 0.45 ns | 450 MHz | DDR | GSI TECHNOLOGY | Parallel | GSI Technology | GS8662TT07BD-450 | 450 MHz | 450 MHz | 1.9 V | + 70 C | 1.7 V | 0 C | Surface Mount | SMD/SMT | 8 Bit | 8 MWords | 8000000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.22 | No | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | 1.8000 V | Commercial grade | 0 to 70 °C | e0 | No | 3A991.B.2.B | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | 72 Mbit | 1 | SYNCHRONOUS | 695 mA | Pipelined | 8 M x 8 | 3-STATE | 1.4 mm | 8 | 22 Bit | 72 Mbit | 0.26 A | 67108864 bit | Commercial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 15 mm | 13 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8182T37BGD-375 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | YES | 165 | 0.45 ns | 375 MHz | GSI TECHNOLOGY | GSI Technology | GS8182T37BGD-375 | 3 | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.47 | Yes | 1.8 V | e1 | Yes | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | SYNCHRONOUS | 0.54 mA | 512KX36 | 3-STATE | 1.4 mm | 36 | 0.17 A | 18874368 bit | PARALLEL | COMMON | DDR SRAM | 1.7 V | 15 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8342D37BD-450 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-165 | YES | 165 | 0.45 ns | GSI Technology | 450 MHz | QDR | 15 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8342D37BD-450 | 450 MHz | 450 MHz | 1.9 V | + 70 C | DDR | 1.7 V | 0 C | Yes | Surface Mount | SMD/SMT | 36 Bit | 1 MWords | 1000000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.22 | N | No | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II+ | 1.8000 V | Commercial grade | 0 to 85 °C | Tray | GS8342D37BD | 3A991.B.2.B | SigmaQuad-II+ B4 | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | 36 Mbit | 2 | SYNCHRONOUS | 1.015 A | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | 18 Bit | SRAM | 36 Mbit | 0.24 A | 37748736 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||
![]() | Mfr Part No GS8342DT06BD-500I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-165 | YES | 165 | 0.45 ns | GSI Technology | 500 MHz | 15 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8342DT06BD-500I | 500 MHz | 1.9 V | + 85 C | DDR | 1.7 V | - 40 C | Yes | SMD/SMT | 8 Bit | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.35 | No | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II+ | 1.8000 V | -40 to 100 °C | Tray | GS8342DT06BD | e0 | No | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 36 Mbit | SYNCHRONOUS | 865 mA | 0.45 | 4 M x 8 | 3-STATE | 1.4 mm | 8 | SRAM | 36 | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8342DT20BD-500 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-165 | YES | 165 | 0.45 ns | GSI Technology | 500 MHz | QDR | 15 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8342DT20BD-500 | 500 MHz | 500 MHz | + 70 C | DDR | 0 C | Yes | Surface Mount | SMD/SMT | 18 Bit | 2 MWords | 2000000 | 85 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.36 | N | No | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II+ | 1.8000 V | Commercial grade | 0 to 85 °C | Tray | GS8342DT20BD | e0 | No | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | OTHER | 1.7 V | 36 Mbit | 2 | SYNCHRONOUS | 855 mA | Pipelined | 2 M x 18 | 3-STATE | 1.4 mm | 18 | SRAM | 36 Mbit | 37748736 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No GS8342DT38BGD-500I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | BGA-165 | YES | 165-FPBGA (15x13) | 165 | 0.45 ns | GS8342D | GSI Technology | 500 MHz | QDR | 15 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8342DT38BGD-500I | 500 MHz | 500 MHz | 1.9 V | + 85 C | DDR | GSI Technology Inc. | 1.7 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 36 Bit | 1 MWords | 1000000 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | Active | NOT SPECIFIED | 5.36 | Details | Yes | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II+ | 1.8000 V | Industrial grade | -40 to 100 °C | Tray | GS8342DT38BGD | e1 | Yes | 3A991.B.2.B | SigmaQuad-II+ | Tin/Silver/Copper (Sn/Ag/Cu) | Memory & Data Storage | SRAM - Quad Port, Synchronous | 1.7V ~ 1.9V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 36 Mbit | 2 | SYNCHRONOUS | 500 MHz | 1.125 A | SRAM | Parallel | Pipelined | 1 M x 36 | 3-STATE | 1.4 mm | 36 | - | 18 Bit | SRAM | 36 Mbit | 37748736 bit | Industrial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | SRAM | 1M x 36 | 15 mm | 13 mm | |||||||||
![]() | Mfr Part No GS8182T19BGD-400I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 165-LBGA | YES | 165-FPBGA (15x13) | 165 | 0.45 ns | GS8182T19 | 400 MHz | GSI TECHNOLOGY | GSI Technology | GS8182T19BGD-400I | Volatile | GSI Technology Inc. | 3 | 1048576 words | 1000000 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | Active | NOT SPECIFIED | 4.78 | Yes | 1.8 V | -40°C ~ 85°C (TA) | - | e1 | Yes | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | SRAM - Synchronous | 1.7V ~ 1.9V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 18Mbit | SYNCHRONOUS | 400 MHz | 0.52 mA | SRAM | Parallel | 1MX18 | 3-STATE | 1.4 mm | 18 | - | 0.185 A | 18874368 bit | PARALLEL | COMMON | DDR SRAM | 1.7 V | 1M x 18 | 15 mm | 13 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8182D19BGD-435I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-165 | YES | 165 | 0.45 ns | GSI Technology | 435 MHz | SDR | 18 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8182D19BGD-435I | 435 MHz | 435 MHz | 1.9 V | + 85 C | DDR | 1.7 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 18 Bit | 1 MWords | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.21 | Details | Yes | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II+ | 1.8000 V | Industrial grade | -40 to 85 °C | Tray | GS8182D19BGD | e1 | Yes | 3A991.B.2.B | SigmaQuad II+ | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 18 Mbit | 2 | SYNCHRONOUS | 780 mA | Pipelined | 1 M x 18 | 3-STATE | 1.4 mm | 18 | 18 Bit | SRAM | 18 Mbit | 0.2 A | 18874368 bit | Industrial | PARALLEL | SEPARATE | DDR SRAM | 1.7 V | SRAM | 15 mm | 10 mm | ||||||||||||||||||
![]() | Mfr Part No GS8662Q07BD-250 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-165 | YES | 165 | 0.45 ns | GSI Technology | 250 MHz | QDR | 15 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8662Q07BD-250 | 250 MHz | 250 MHz | + 70 C | DDR | 0 C | Yes | Surface Mount | SMD/SMT | 8 Bit | 8 MWords | 8000000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.49 | N | No | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II+ | 1.8000 V | Commercial grade | 0 to 85 °C | Tray | GS8662Q07BD | e0 | No | 3A991.B.2.B | SigmaQuad-II+ B2 | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | 72 Mbit | 2 | SYNCHRONOUS | 720 mA | Pipelined | 8 M x 8 | 3-STATE | 1.4 mm | 8 | 22 Bit | SRAM | 72 Mbit | 0.24 A | 67108864 bit | Commercial | PARALLEL | SEPARATE | DDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||
![]() | Mfr Part No GS8342T11BD-550I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-165 | YES | 165 | 0.45 ns | GSI Technology | 550 MHz | DDR | 15 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8342T11BD-550I | 550 MHz | 550 MHz | 1.9 V | + 85 C | DDR | 1.7 V | - 40 C | Yes | Surface Mount | SMD/SMT | 9 Bit | 4 MWords | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.35 | No | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaDDR-II+ | 1.8000 V | Industrial grade | -40 to 100 °C | Tray | GS8342T11BD | e0 | 3A991.B.2.B | SigmaQuad-II+ | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 36 Mbit | 1 | SYNCHRONOUS | 810 mA | Pipelined | 4 M x 9 | 3-STATE | 1.4 mm | 9 | 21 Bit | SRAM | 36 Mbit | 0.265 A | 37748736 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | SRAM | 15 mm | 13 mm | |||||||||||||||||||||
![]() | Mfr Part No GS8662Q10BD-250I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-165 | YES | 165 | 0.45 ns | 250 MHz | GSI TECHNOLOGY | Parallel | GSI Technology | GS8662Q10BD-250I | 250 MHz | 250 MHz | 1.9 V | + 85 C | 1.7 V | - 40 C | SMD/SMT | 9 Bit | 8 MWords | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.48 | No | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | 1.8000 V | Industrial grade | -40 to 100 °C | e0 | No | 3A991.B.2.B | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 72 Mbit | SYNCHRONOUS | 730 mA | 0.45 | 8 M x 9 | 3-STATE | 1.4 mm | 9 | 0.25 A | 72 | Industrial | PARALLEL | SEPARATE | DDR SRAM | 1.7 V | 15 mm | 13 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8342TT37BGD-400I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | YES | 165 | 0.45 ns | 400 MHz | DDR | GSI TECHNOLOGY | GSI Technology | GS8342TT37BGD-400I | 400 MHz | 1.9 V | 1.7 V | Surface Mount | 36 Bit | 1 MWords | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.22 | Yes | FBGA | 1.8 V | Synchronous | 1.8000 V | Industrial grade | -40 to 100 °C | 3A991.B.2.B | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 1 | SYNCHRONOUS | Pipelined | 1MX36 | 3-STATE | 1.4 mm | 36 | 19 Bit | 36 Mbit | 37748736 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8662Q09BGD-333 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | YES | 165 | 0.45 ns | 333 MHz | QDR | GSI TECHNOLOGY | GSI Technology | GS8662Q09BGD-333 | 333 MHz | 1.9 V | 1.7 V | Surface Mount | 9 Bit | 8 MWords | 8000000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.34 | Yes | FBGA | 1.8 V | Synchronous | 1.8000 V | Commercial grade | 0 to 85 °C | 3A991.B.2.B | PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | 2 | SYNCHRONOUS | 0.92 mA | Pipelined | 8MX9 | 3-STATE | 1.4 mm | 9 | 22 Bit | 72 Mbit | 75497472 bit | Commercial | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8662Q18BGD-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | YES | 165 | 0.45 ns | 200 MHz | GSI TECHNOLOGY | GSI Technology | GS8662Q18BGD-200 | 200 MHz | 1.9 V | 1.7 V | 3 | 18 Bit | 4194304 words | 4000000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.34 | Yes | FBGA | 1.8 V | 1.8000 V | 0 to 85 °C | e1 | Yes | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | COMMERCIAL | 1.7 V | SYNCHRONOUS | 0.6 mA | 0.45 | 4MX18 | 3-STATE | 1.4 mm | 18 | 72 | PARALLEL | SEPARATE | QDR SRAM | 1.7 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8182T19BGD-435I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | YES | 165 | 0.45 ns | 435 MHz | DDR | GSI TECHNOLOGY | GSI Technology | GS8182T19BGD-435I | 435 MHz | 3 | Surface Mount | 18 Bit | 1 MWords | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.46 | Yes | FBGA | 1.8 V | Synchronous | 1.8000 V | Industrial grade | -40 to 85 °C | e1 | Yes | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 1 | SYNCHRONOUS | 0.655 mA | Pipelined | 1MX18 | 3-STATE | 1.4 mm | 18 | 18 Mbit | 0.2 A | 18874368 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 15 mm | 13 mm |
GS8662TT11BD-350I
GSI Technology
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GS8342Q36AE-250M
GSI Technology
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GS8342TT20BGD-500I
GSI Technology
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GS8342QT19BGD-333I
GSI Technology
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GS8662Q36BD-200
GSI Technology
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GS8662TT07BD-450
GSI Technology
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GS8182T37BGD-375
GSI Technology
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GS8342D37BD-450
GSI Technology
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GS8342DT06BD-500I
GSI Technology
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GS8342DT20BD-500
GSI Technology
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GS8342DT38BGD-500I
GSI Technology
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GS8182T19BGD-400I
GSI Technology
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GS8182D19BGD-435I
GSI Technology
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GS8662Q07BD-250
GSI Technology
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GS8342T11BD-550I
GSI Technology
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GS8662Q10BD-250I
GSI Technology
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GS8342TT37BGD-400I
GSI Technology
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GS8662Q09BGD-333
GSI Technology
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GS8662Q18BGD-200
GSI Technology
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GS8182T19BGD-435I
GSI Technology
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