The category is 'Memory'

  • All Manufacturers
  • Access Time-Max
  • Additional Feature
  • Clock Frequency-Max (fCLK)
  • ECCN Code
  • HTS Code
  • I/O Type
  • Ihs Manufacturer
  • JESD-30 Code
  • JESD-609 Code
  • Length
  • Manufacturer Part Number
  • Power Supplies
  • Power Supplies:

    1.5/1.8 V

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Mount

Surface Mount

Number of Pins

Number of Terminals

Access Time-Max

Clock Frequency-Max (fCLK)

Ihs Manufacturer

Manufacturer

Manufacturer Part Number

Memory Types

Moisture Sensitivity Levels

Number of Words

Number of Words Code

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Supply Voltage-Nom (Vsup)

Packaging

JESD-609 Code

Pbfree Code

ECCN Code

Terminal Finish

Max Operating Temperature

Min Operating Temperature

Additional Feature

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Frequency

Pin Count

JESD-30 Code

Qualification Status

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Interface

Max Supply Voltage

Min Supply Voltage

Memory Size

Number of Ports

Nominal Supply Current

Operating Mode

Supply Current-Max

Access Time

Organization

Output Characteristics

Seated Height-Max

Memory Width

Address Bus Width

Density

Standby Current-Max

Memory Density

Max Frequency

Parallel/Serial

I/O Type

Sync/Async

Word Size

Memory IC Type

Standby Voltage-Min

Length

Width

Lead Free

CYD18S36V18-167BBXC

Mfr Part No

CYD18S36V18-167BBXC

Cypress Semiconductor Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

YES

256

256

11 ns

167 MHz

CYPRESS SEMICONDUCTOR CORP

Cypress Semiconductor

CYD18S36V18-167BBXC

SDR

3

512000

512000

70 °C

PLASTIC/EPOXY

LBGA

LBGA, BGA256,16X16,40

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

Active

BGA

20

5.64

Compliant

Yes

1.5 V

Bulk

e1

Yes

3A991.B.2.A

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V

8542.32.00.41

SRAMs

CMOS

BOTTOM

BALL

260

1

1 mm

compliant

66.7 MHz

256

S-PBGA-B256

Not Qualified

1.8 V

1.58 V

1.5/1.8 V

COMMERCIAL

1.42 V

Parallel

1.9 V

1.7 V

2.3 MB

2

720 mA

SYNCHRONOUS

0.72 mA

4 ns

512KX36

3-STATE

1.7 mm

36

19 b

18 Mb

0.3 A

18874368 bit

167 MHz

PARALLEL

COMMON

Synchronous

36 b

DUAL-PORT SRAM

1.4 V

19 mm

19 mm

Lead Free

CYD18S36V18-200BBXC

Mfr Part No

CYD18S36V18-200BBXC

Cypress Semiconductor Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

YES

256

256

9 ns

200 MHz

CYPRESS SEMICONDUCTOR CORP

Cypress Semiconductor

CYD18S36V18-200BBXC

SDR

3

512000

512000

70 °C

PLASTIC/EPOXY

LBGA

LBGA, BGA256,16X16,40

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

Active

BGA

20

5.56

Compliant

Yes

1.5 V

Bulk

e1

Yes

3A991.B.2.A

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V

8542.32.00.41

SRAMs

CMOS

BOTTOM

BALL

260

1

1 mm

compliant

200 MHz

256

S-PBGA-B256

Not Qualified

1.8 V

1.58 V

1.5/1.8 V

COMMERCIAL

1.42 V

Parallel

1.9 V

1.7 V

2.3 MB

2

800 mA

SYNCHRONOUS

0.8 mA

3.3 ns

512KX36

3-STATE

1.7 mm

36

38 b

18 Mb

0.3 A

18874368 bit

200 MHz

PARALLEL

COMMON

Synchronous

36 b

DUAL-PORT SRAM

1.4 V

19 mm

19 mm

Lead Free

CYD18S36V18-167BBXI

Mfr Part No

CYD18S36V18-167BBXI

Cypress Semiconductor Datasheet

-

-

Min: 1

Mult: 1

YES

256

256

11 ns

167 MHz

CYPRESS SEMICONDUCTOR CORP

Cypress Semiconductor

CYD18S36V18-167BBXI

SDR

3

524288 words

512000

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

LBGA, BGA256,16X16,40

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

Active

BGA

20

5.53

Compliant

Yes

1.5 V

Bulk

e1

Yes

3A991.B.2.A

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V

8542.32.00.41

SRAMs

CMOS

BOTTOM

BALL

260

1

1 mm

compliant

167 MHz

256

S-PBGA-B256

Not Qualified

1.8 V

1.58 V

1.5/1.8 V

INDUSTRIAL

1.42 V

Parallel

1.9 V

1.7 V

2.3 MB

2

SYNCHRONOUS

0.78 mA

4 ns

512KX36

3-STATE

1.7 mm

36

38 b

18 Mb

0.35 A

18874368 bit

167 MHz

PARALLEL

COMMON

DUAL-PORT SRAM

1.4 V

19 mm

19 mm

Lead Free

CYD18S36V18-167BBC

Mfr Part No

CYD18S36V18-167BBC

Cypress Semiconductor Datasheet

-

-

Min: 1

Mult: 1

YES

256

11 ns

167 MHz

CYPRESS SEMICONDUCTOR CORP

Cypress Semiconductor

CYD18S36V18-167BBC

3

524288 words

512000

70 °C

PLASTIC/EPOXY

LBGA

LBGA, BGA256,16X16,40

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

Obsolete

BGA

30

5.67

No

1.5 V

e0

No

3A991.B.2.A

Tin/Lead (Sn/Pb)

PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V

8542.32.00.41

SRAMs

CMOS

BOTTOM

BALL

225

1

1 mm

compliant

256

S-PBGA-B256

Not Qualified

1.58 V

1.5/1.8 V

COMMERCIAL

1.42 V

2

SYNCHRONOUS

0.72 mA

512KX36

3-STATE

1.7 mm

36

0.3 A

18874368 bit

PARALLEL

COMMON

DUAL-PORT SRAM

1.4 V

19 mm

19 mm