The category is 'Memory'
Memory (10)
- All Manufacturers
- Data Retention Time-Min
- Endurance
- Ihs Manufacturer
- JESD-30 Code
- JESD-609 Code
- Length
- Manufacturer Part Number
- Memory Density
- Memory IC Type
- Memory Width
- Number of Terminals
- Power Supplies
- Power Supplies:
1.8/3.3 V
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Surface Mount | Number of Pins | Number of Terminals | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supply Voltage-Nom (Vsup) | Usage Level | Packaging | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Nominal Supply Current | Operating Mode | Supply Current-Max | Access Time | Organization | Output Characteristics | Seated Height-Max | Memory Width | Density | Standby Current-Max | Memory Density | Max Frequency | Screening Level | Parallel/Serial | Memory IC Type | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Data Polling | Page Size | I2C Control Byte | Reverse Pinout | Length | Width | Radiation Hardening |
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![]() | Mfr Part No BR34E02FVT-W | Rohm | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.1 MHz | ROHM CO LTD | ROHM Semiconductor | BR34E02FVT-W | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | LSSOP | LSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | Active | SOIC | NOT SPECIFIED | 5.64 | Yes | 2.5 V | e2 | Yes | EAR99 | Tin/Copper (Sn/Cu) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 3.6 V | 1.8/3.3 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.003 mA | 256X8 | 1.25 mm | 8 | 0.000002 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE/SOFTWARE | 1010DDDR | 4.4 mm | 3 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No AT34C02CU3-UU-T | Atmel | Datasheet | 12457 | - | Min: 1 Mult: 1 | Surface Mount | YES | 2 | 8 | 0.4 MHz | ATMEL CORP | Atmel Corporation | AT34C02CU3-UU-T | 1 | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | 1.50 X 2 MM, 0.50 MM PITCH, HALOGEN AND LEAD FREE, PLASTIC, BGA-8 | BGA8,2X4,40/20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 5.73 | Compliant | Yes | 3 V | Tape & Reel | e1 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 85 °C | -40 °C | 8542.32.00.51 | EEPROMs | CMOS | BOTTOM | BALL | 1 | 0.5 mm | unknown | 400 kHz | 8 | R-PBGA-B8 | Not Qualified | 5 V | 3.6 V | 1.8/3.3 V | INDUSTRIAL | 1.7 V | 2-Wire, Serial | 5.5 V | 1.7 V | 256 B | 3 mA | SYNCHRONOUS | 0.003 mA | 900 ns | 256X8 | 0.91 mm | 8 | 2 kb | 0.000003 A | 2048 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE/SOFTWARE | 1010DDDR | 2 mm | 1.5 mm | No | |||||||||||||
![]() | Mfr Part No 34VL02/MNY | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 34VL02/MNY | 1 | 256 words | 256 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | 40 | 5.41 | Yes | 2.5 V | e4 | Yes | EAR99 | NICKEL PALLADIUM GOLD | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 3.6 V | 1.8/3.3 V | OTHER | 1.5 V | SYNCHRONOUS | 0.003 mA | 256X8 | 0.8 mm | 8 | 0.000001 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 3 mm | 2 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No AT24C04D-MAHM-T | Adesto | Datasheet | - | - | Min: 1 Mult: 1 | 6 Weeks | YES | 8 | 1 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | AT24C04D-MAHM-T | 1 | 512 words | 512 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, SOLCC8,.11,20 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | 40 | 1.5 | Yes | EEPROM 1.7-3.6V, 1MHz, Ind Tmp, 8-UDFN | 1.8 V | Automotive grade | e4 | Yes | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES 1.7V AT 100 KHZ | EEPROMs | CMOS | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | R-PDSO-N8 | Not Qualified | 3.6 V | 1.8/3.3 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.001 mA | 512X8 | OPEN-DRAIN | 0.6 mm | 8 | 8e-7 A | 4096 bit | ISO/TS-16949 | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE | YES | 16 words | 1010DDMR | NO | 3 mm | 2 mm | ||||||||||||||||||||||
![]() | Mfr Part No 24VL014/MNY | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24VL014/MNY | 1 | 128 words | 128 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | 40 | 5.58 | Yes | 1.8 V | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 3.6 V | 1.8/3.3 V | OTHER | 1.5 V | SYNCHRONOUS | 0.003 mA | 128X8 | 0.8 mm | 8 | 0.000001 A | 1024 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 3 mm | 2 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No 24VL024/MNY | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24VL024/MNY | 1 | 256 words | 256 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | 40 | 5.41 | Yes | 1.8 V | e4 | Yes | EAR99 | NICKEL PALLADIUM GOLD | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 3.6 V | 1.8/3.3 V | OTHER | 1.5 V | SYNCHRONOUS | 0.003 mA | 256X8 | 0.8 mm | 8 | 0.000001 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 1010DDDR | 3 mm | 2 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No 24VL024H/MNY | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.1 MHz | MICROCHIP TECHNOLOGY INC | 24VL024H/MNY | 256 words | 256 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE | Active | DFN | NOT SPECIFIED | 5.41 | Yes | 1.8 V | e4 | EAR99 | 8542.32.00.51 | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 3.6 V | 1.8/3.3 V | OTHER | 1.5 V | SYNCHRONOUS | 0.003 mA | 256X8 | 0.8 mm | 8 | 0.000001 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 3 mm | 2 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No 24VL025/MNY | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24VL025/MNY | 1 | 256 words | 256 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | 40 | 5.6 | Yes | 1.8 V | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | NO LEAD | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 3.6 V | 1.8/3.3 V | OTHER | 1.5 V | SYNCHRONOUS | 0.003 mA | 256X8 | 0.8 mm | 8 | 0.000001 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | SOFTWARE | 1010DDDR | 3 mm | 2 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No DS28E02P | Maxim Integrated | Datasheet | 8004 | - | Min: 1 Mult: 1 | 6 Weeks | YES | 6 | MAXIM INTEGRATED PRODUCTS INC | Maxim Integrated Products | DS28E02P+ | 1 | 1024 words | 1000 | 85 °C | -20 °C | PLASTIC/EPOXY | SOC | SOC, SOC6,.17 | SOC6,.17 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | NOT SPECIFIED | 5.76 | Yes | 1.8 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | C BEND | NOT SPECIFIED | 1 | 1.27 mm | compliant | 6 | R-PDSO-C6 | Not Qualified | 3.65 V | 1.8/3.3 V | OTHER | 1.75 V | ASYNCHRONOUS | 1KX1 | 1.5 mm | 1 | 1024 bit | SERIAL | EEPROM | 1-WIRE | 50000 Write/Erase Cycles | 40 | 3.94 mm | 3.76 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No DS28E02P T&R | Maxim Integrated | Datasheet | 800 | - | Min: 1 Mult: 1 | 12 Weeks | YES | 6 | MAXIM INTEGRATED PRODUCTS INC | Maxim Integrated Products | DS28E02P+T&R | 1 | 1024 words | 1000 | 85 °C | -20 °C | PLASTIC/EPOXY | SOC | SOC, SOC6,.17 | SOC6,.17 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | NOT SPECIFIED | 5.77 | Yes | 1.8 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | C BEND | NOT SPECIFIED | 1 | 1.27 mm | compliant | 6 | R-PDSO-C6 | Not Qualified | 3.65 V | 1.8/3.3 V | OTHER | 1.75 V | ASYNCHRONOUS | 1KX1 | 1.5 mm | 1 | 1024 bit | SERIAL | EEPROM | 1-WIRE | 50000 Write/Erase Cycles | 40 | 3.94 mm | 3.76 mm |
BR34E02FVT-W
Rohm
Package:Memory
Price: please inquire
AT34C02CU3-UU-T
Atmel
Package:Memory
Price: please inquire
34VL02/MNY
Microchip
Package:Memory
Price: please inquire
AT24C04D-MAHM-T
Adesto
Package:Memory
Price: please inquire
24VL014/MNY
Microchip Technology
Package:Memory
Price: please inquire
24VL024/MNY
Microchip Technology
Package:Memory
Price: please inquire
24VL024H/MNY
Microchip Technology
Package:Memory
Price: please inquire
24VL025/MNY
Microchip Technology
Package:Memory
Price: please inquire
DS28E02P
Maxim Integrated
Package:Memory
Price: please inquire
DS28E02P T&R
Maxim Integrated
Package:Memory
Price: please inquire
