The category is 'Memory'
Memory (17)
- All Manufacturers
- Data Retention Time-Min
- Endurance
- Ihs Manufacturer
- JESD-30 Code
- Memory Density
- Memory IC Type
- Memory Width
- Number of Terminals
- Number of Words
- Number of Words Code
- Operating Temperature-Min
- Power Supplies
- Power Supplies:
1.8/5 V
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Dielectric Material | Number of Terminals | Shell Material, Finish | Active Read Current - Max | Brand | Clock Frequency-Max (fCLK) | Contact Materials | Data Retention | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of Words | Number of Words Code | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part # Aliases | Part Life Cycle Code | Part Package Code | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Unit Weight | Voltage Rating AC | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Part Status | Number of Terminations | Termination | ECCN Code | Temperature Coefficient | Connector Type | Resistance | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | Applications | Number of Rows | Power (Watts) | Additional Feature | HTS Code | Capacitance | Subcategory | Power Rating | Contact Type | Current Rating (Amps) | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | Contact Finish | JESD-30 Code | Qualification Status | Operating Supply Voltage | Failure Rate | Lead Spacing | Supply Voltage-Max (Vsup) | Power Supplies | Wire Gauge | Temperature Grade | Supply Voltage-Min (Vsup) | Flange Feature | Memory Size | Operating Supply Current | Connector Style | Operating Mode | Supply Current-Max | Contact Form | Shell Size, Connector Layout | Organization | Seated Height-Max | Memory Width | Product Type | Density | Standby Current-Max | Memory Density | Screening Level | Access Time (Max) | Parallel/Serial | Memory IC Type | Backset Spacing | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Alternate Memory Width | I2C Control Byte | Features | Supply Current | Product Category | Height | Height Seated (Max) | Length | Width | Contact Finish Thickness | Material Flammability Rating | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No 24FC256-E/SN | Microchip | Datasheet | 1602 | - | Min: 1 Mult: 1 | 14 Weeks | YES | 8 | 1 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 24FC256-E/SN | 3 | 32768 words | 32000 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | 40 | 5.37 | Yes | 4.5 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 1.8/5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 0.003 mA | 32KX8 | 1.75 mm | 8 | 0.000005 A | 262144 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR24T64NUX-WGTR | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | ROHM CO LTD | BR24T64NUX-WGTR | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, VSON-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | SOIC | NOT SPECIFIED | 5.59 | Non-Compliant | Yes | 2.5 V | Yes | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.002 mA | 8KX8 | 0.6 mm | 8 | 0.000002 A | 65536 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE | 1010DDDR | 3 mm | 2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 24AA16H-I/MNY | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24AA16H-I/MNY | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, SOLCC8,.11,20 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE | Active | DFN | 5.37 | Yes | 2.5 V | EAR99 | 8542.32.00.51 | DUAL | NO LEAD | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.003 mA | 256X8 | 0.8 mm | 8 | 0.000001 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010MMMR | 3 mm | 2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR24T04-W | ROHM Semiconductor | Datasheet | 1588 | - | Min: 1 Mult: 1 | NO | 8 | 0.4 MHz | 40 | ROHM CO LTD | Serial (2-Wire) | ROHM Semiconductor | BR24T04-W | 1 | Through Hole | 512 words | 512 | 5.5(V) | 1.6(V) | 1.8/2.5/3.3/5(V) | -40C to 85C | 85C | -40C | Industrial | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | DIP-T | Obsolete | Yes | No | NOT SPECIFIED | 8.5 | Yes | 2.5 V | Rail/Tube | e3 | Yes | Matte Tin (Sn) | EEPROMs | CMOS | DUAL | THROUGH-HOLE | 225 | 1 | 2.54 mm | compliant | 0.4(MHz) | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.6 V | SYNCHRONOUS | 0.002 mA | 512x8 | 4.21 mm | 8 | 4096(Bit) | 0.000002 A | 4096 bit | 900(ns) | SERIAL | EEPROM | 1.6 TO 5.5 | I2C | 1000000 Write/Erase Cycles | 5 ms | 40 | Yes | 1010DDMR | 2(mA) | 9.3 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR24T08FVM-WGTR | ROHM Semicon | Datasheet | 24000 |
| Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | ROHM CO LTD | ROHM Semiconductor | BR24T08FVM-WGTR | 1024 words | 1000 | 85 °C | -40 °C | PLASTIC/EPOXY | VSSOP | HALOGEN FREE AND ROHS COMPLIANT, MSOP-8 | TSSOP8,.16 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | Active | MSOP | NOT SPECIFIED | 5.58 | Yes | 2.5 V | Yes | EEPROMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.002 mA | 1KX8 | 0.9 mm | 8 | 0.000002 A | 8192 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE | 1010DMMR | 2.9 mm | 2.8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CAT24AA08TDI-G | ON Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 5 | ON SEMICONDUCTOR | CAT24AA08TDI-G | 1024 words | 1000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP | TSOP, TSOP5/6,.11,37 | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Active | 5.79 | Yes | DUAL | GULL WING | 0.95 mm | compliant | R-PDSO-G5 | Not Qualified | 1.8/5 V | INDUSTRIAL | 0.001 mA | 1KX8 | 8 | 0.000001 A | 8192 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 100 | HARDWARE | 10100MMR | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DS28CN01U-A00 | Maxim Integrated | Datasheet | 12585 | - | Min: 1 Mult: 1 | 6 Weeks | USOP-8 | YES | 8 | 500 uA | Maxim Integrated | 0.4 MHz | 40 Year | 100 | MAXIM INTEGRATED PRODUCTS INC | 2-Wire, I2C | DS28CN01U-A00+ | 400 kHz | + 85 C | - 40 C | 1 | SMD/SMT | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.19 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | DS28CN01U | Not Recommended | SOIC | 30 | 5.44 | Details | Yes | 1Kb I2C/SMBus EEPROM with SHA-1 Engine | 5.5 V | 1.62 V | 2 V | 0.006173 oz | DS28CN01U | e3 | Yes | EAR99 | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.62 V | 1 kbit | 500 uA | SYNCHRONOUS | 0.0005 mA | 256X4 | 1.1 mm | 4 | EEPROM | 0.0000055 A | 1024 bit | SERIAL | EEPROM | 3 V | 200000 Write/Erase Cycles | 40 | EEPROM | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR24T512F-WE2 | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Axial | YES | Axial | 8 | 0.4 MHz | ROHM CO LTD | ROHM Semiconductor | BR24T512F-WE2 | 1 | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Contact Manufacturer | NOT SPECIFIED | 5.52 | Yes | 2.5 V | -55°C ~ 175°C | Bulk | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±0.25% | e3 | Yes | Active | 2 | ±50ppm/°C | 187 kOhms | Matte Tin (Sn) | Metal Film | 0.5W, 1/2W | EEPROMs | CMOS | DUAL | GULL WING | 225 | 1 | 1.27 mm | compliant | R-PDSO-G8 | Not Qualified | -- | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.0045 mA | 64KX8 | 1.71 mm | 8 | 0.000003 A | 524288 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE | 1010DDDR | Flame Retardant Coating, Moisture Resistant, Safety | -- | 5 mm | 4.4 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR24T1MF-WE2 | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | ROHM CO LTD | ROHM Semiconductor | BR24T1MF-WE2 | 1 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Contact Manufacturer | NOT SPECIFIED | 5.52 | Yes | 2.5 V | e3 | Yes | Matte Tin (Sn) | EEPROMs | CMOS | DUAL | GULL WING | 225 | 1 | 1.27 mm | compliant | R-PDSO-G8 | Not Qualified | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.0045 mA | 128KX8 | 1.71 mm | 8 | 0.000003 A | 1048576 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE | 1010DDMR | 5 mm | 4.4 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR24T01NUX-WGTR | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | ROHM CO LTD | ROHM Semiconductor | BR24T01NUX-WGTR | Panduit Corp | 128 words | 128 | 85 °C | -40 °C | Bulk | PLASTIC/EPOXY | HVSON | 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, VSON-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | SOIC | Obsolete | NOT SPECIFIED | 5.61 | Yes | 2.5 V | - | Yes | EEPROMs | CMOS | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.002 mA | 128X8 | 0.6 mm | 8 | 0.000002 A | 1024 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE | 1010DDDR | 3 mm | 2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR24T16F-WGE2 | ROHM Semiconductor | Datasheet | 1759 | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | ROHM CO LTD | ROHM Semiconductor | BR24T16F-WGE2 | 2048 words | 2000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | NOT SPECIFIED | 5.48 | Yes | 2.5 V | Yes | SEATED HT-CALCULATED | EEPROMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.002 mA | 2KX8 | 1.71 mm | 8 | 0.000002 A | 16384 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE | 1010MMMR | 5 mm | 4.4 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR24T04NUX-WGTR | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | ROHM CO LTD | ROHM Semiconductor | BR24T04NUX-WGTR | 512 words | 512 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, VSON-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | SOIC | NOT SPECIFIED | 5.59 | Yes | 2.5 V | 150 V | 0.5 % | Yes | 25 ppm/°C | 33.6 kΩ | 155 °C | -55 °C | Thin Film | EEPROMs | 250 mW | CMOS | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.002 mA | 512X8 | 0.6 mm | 8 | 0.000002 A | 4096 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE | 1010DDMR | 650 µm | 3 mm | 2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR24T04FVJ-WGE2 | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | ROHM CO LTD | ROHM Semiconductor | BR24T04FVJ-WGE2 | 512 words | 512 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | HALOGEN FREE AND ROHS COMPLIANT, TSSOP-8 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | SOIC | NOT SPECIFIED | 5.59 | Yes | 2.5 V | Yes | EEPROMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.002 mA | 512X8 | 1.1 mm | 8 | 0.000002 A | 4096 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE | 1010DDMR | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR93G46-3 | ROHM Semiconductor | Datasheet | 1272 | - | Min: 1 Mult: 1 | Panel Mount | NO | Polyester Thermoplastic, Glass Filled | 8 | - | 3 MHz | Copper Alloy | 40 | ROHM CO LTD | Serial (3-Wire) | ROHM Semiconductor | BR93G46-3 | ITT Cannon, LLC | Through Hole | 64 words | 64 | 5.5(V) | 1.7(V) | 1.8/2.5/3.3/5(V) | -40C to 85C | 85C | -40C | Industrial | 85 °C | -40 °C | Bulk | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | DIP-T | Obsolete | Active | Yes | No | NOT SPECIFIED | 7.71 | Yes | 5 V | - | -65°C ~ 125°C | Rail/Tube | MDVB | Solder Cup | Receptacle, Female Sockets | 25 | - | 2 | ALSO OPERATES AT 1.7V WITH 1MHZ AND 2.5V WITH 2MHZ AND SEATED HT-CALCULATED | EEPROMs | Signal | 3A | CMOS | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | - | 2.54 mm | compliant | 3(MHz) | 8 | Gold | R-PDIP-T8 | Not Qualified | 5.5 V | 1.8/5 V | 24-32 AWG | INDUSTRIAL | 4.5 V | Mating Side, Female Screwlock (2-56) | D-Type, Micro-D | SYNCHRONOUS | 0.003 mA | - | 0.050 Pitch x 0.043 Row to Row | 128x8/64x16 | 4.21 mm | 16 | 1024(Bit) | 0.000002 A | 1024 bit | 200(ns) | SERIAL | EEPROM | - | 1.7 TO 5.5 | 3-WIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | Yes | 8 | - | 3(mA) | 9.3 mm | 7.62 mm | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR24T64F-WGE2 | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Chassis, Stud Mount | Radial, Can | YES | Polypropylene (PP), Metallized | 8 | 0.4 MHz | ROHM CO LTD | ROHM Semiconductor | BR24T64F-WGE2 | EPCOS - TDK Electronics | 8192 words | 8000 | 85 °C | -40 °C | Bulk | PLASTIC/EPOXY | SOP | HALOGEN FREE AND ROHS COMPLIANT, SOP-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | Active | NOT SPECIFIED | 5.47 | Yes | 2.5 V | 720V | 1800V (1.8kV) | -40°C ~ 70°C | MKD AC - Single Phase | 3.346 Dia (85.00mm) | ±5% | Yes | Threaded, Male | General Purpose | SEATED HT-CALCULATED | 100 µF | EEPROMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 1.378 (35.00mm) | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.002 mA | 8KX8 | 1.71 mm | 8 | 0.000002 A | 65536 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE | 1010DDDR | - | 9.744 (247.50mm) | 5 mm | 4.4 mm | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M24C32-FMB5TG/P | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | STMICROELECTRONICS | 4096 words | 4000 | 85 °C | -20 °C | UNSPECIFIED | VSON | 2 X 3 MM, ROHS COMPLIANT, MLP-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | Obsolete | SOIC | Yes | 1.8 V | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | compliant | NOT SPECIFIED | 8 | R-XDSO-N8 | Not Qualified | 5.5 V | 1.8/5 V | OTHER | 1.7 V | SYNCHRONOUS | 0.003 mA | 4KX8 | 0.6 mm | 8 | 0.000001 A | 32768 bit | AEC-Q100 | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 10 ms | 40 | HARDWARE | 1010DDDR | 3 mm | 2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DS28CN01U-A00 T | Maxim Integrated | Datasheet | 8000 | - | Min: 1 Mult: 1 | 4 Weeks, 6 Days | UMAX-8 | YES | 8 | Maxim Integrated | 0.4 MHz | 3000 | MAXIM INTEGRATED PRODUCTS INC | Maxim Integrated | DS28CN01U-A00+T | 1 | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.19 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | DS28CN01U | Not Recommended | SOIC | 30 | 5.44 | Details | Yes | 2 V | Reel | DS28CN01U | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | Memory & Data Storage | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.62 V | SYNCHRONOUS | 0.0005 mA | 256X4 | 1.1 mm | 4 | EEPROM | 0.0000055 A | 1024 bit | SERIAL | EEPROM | 3 V | 200000 Write/Erase Cycles | 40 | EEPROM | 3 mm | 3 mm |
24FC256-E/SN
Microchip
Package:Memory
Price: please inquire
BR24T64NUX-WGTR
ROHM Semiconductor
Package:Memory
Price: please inquire
24AA16H-I/MNY
Microchip Technology
Package:Memory
Price: please inquire
BR24T04-W
ROHM Semiconductor
Package:Memory
Price: please inquire
BR24T08FVM-WGTR
ROHM Semicon
Package:Memory
0.089813
CAT24AA08TDI-G
ON Semiconductor
Package:Memory
Price: please inquire
DS28CN01U-A00
Maxim Integrated
Package:Memory
Price: please inquire
BR24T512F-WE2
ROHM Semiconductor
Package:Memory
Price: please inquire
BR24T1MF-WE2
ROHM Semiconductor
Package:Memory
Price: please inquire
BR24T01NUX-WGTR
ROHM Semiconductor
Package:Memory
Price: please inquire
BR24T16F-WGE2
ROHM Semiconductor
Package:Memory
Price: please inquire
BR24T04NUX-WGTR
ROHM Semiconductor
Package:Memory
Price: please inquire
BR24T04FVJ-WGE2
ROHM Semiconductor
Package:Memory
Price: please inquire
BR93G46-3
ROHM Semiconductor
Package:Memory
Price: please inquire
BR24T64F-WGE2
ROHM Semiconductor
Package:Memory
Price: please inquire
M24C32-FMB5TG/P
STMicroelectronics
Package:Memory
Price: please inquire
DS28CN01U-A00 T
Maxim Integrated
Package:Memory
Price: please inquire
