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Memory (181)

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1.8 V

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Factory Lead Time	Mount	Package / Case	Surface Mount	Number of Pins	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Temperature	Memory Types	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Tradename	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Frequency	Pin Count	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Interface	Max Supply Voltage	Min Supply Voltage	Memory Size	Number of Ports	Nominal Supply Current	Operating Mode	Max Supply Current	Supply Current-Max	Access Time	Data Bus Width	Organization	Output Characteristics	Seated Height-Max	Memory Width	Address Bus Width	Density	Standby Current-Max	Memory Density	Max Frequency	Parallel/Serial	I/O Type	Memory IC Type	Standby Voltage-Min	Page Size	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Self Refresh	Length	Width	Radiation Hardening	REACH SVHC	Lead Free
Mfr Part No MT46H32M32LFCM-6:A	Micron	Datasheet	-	-	Min: 1 Mult: 1				YES		90	5.5 ns	166 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc	MT46H32M32LFCM-6:A								33554432 words	32000000	70 °C		PLASTIC/EPOXY	VFBGA	VFBGA, BGA90,9X15,32	BGA90,9X15,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Obsolete	BGA	30	5.64		Yes			1.8 V				e1		EAR99		Tin/Silver/Copper (Sn/Ag/Cu)			AUTO/SELF REFRESH	8542.32.00.32	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	unknown		90	R-PBGA-B90	Not Qualified		1.95 V	1.8 V	COMMERCIAL	1.7 V					1		SYNCHRONOUS		0.14 mA			32MX32	3-STATE	1 mm	32			0.0006 A	1073741824 bit			COMMON	DDR DRAM			8192	2,4,8	2,4,8	FOUR BANK PAGE BURST	YES	13 mm	10 mm
Mfr Part No MT47H64M16HR-25:E	Micron	Datasheet	-	-	Min: 1 Mult: 1				YES		84	0.4 ns	400 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc	MT47H64M16HR-25:E								67108864 words	64000000	85 °C	-40 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	30	8.36		Yes			1.8 V				e1				TIN SILVER COPPER			AUTO/SELF REFRESH		DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	unknown		84	R-PBGA-B84	Not Qualified		1.9 V	1.8 V	INDUSTRIAL	1.7 V					1		SYNCHRONOUS		0.44 mA			64MX16	3-STATE	1.2 mm	16			0.007 A	1073741824 bit			COMMON	DDR DRAM			8192	4,8	4,8	MULTI BANK PAGE BURST		12.5 mm	8 mm
Mfr Part No MT47H64M8B6-25E:D	Micron	Datasheet	-	-	Min: 1 Mult: 1				YES		60	0.4 ns	400 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc	MT47H64M8B6-25E:D								67108864 words	64000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA60,9X11,32	BGA60,9X11,32	SQUARE	GRID ARRAY	Obsolete	BGA	30	5.59		Yes			1.8 V				e1		EAR99		Tin/Silver/Copper (Sn/Ag/Cu)			AUTO/SELF REFRESH	8542.32.00.28	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	not_compliant		60	S-PBGA-B60	Not Qualified		1.9 V	1.8 V	OTHER	1.7 V					1		SYNCHRONOUS		0.3 mA			64MX8	3-STATE	1.2 mm	8			0.007 A	536870912 bit			COMMON	DDR DRAM			8192	4,8	4,8	FOUR BANK PAGE BURST	YES	10 mm	10 mm
Mfr Part No MT46H32M32LFCM-75IT:A	Micron	Datasheet	-	-	Min: 1 Mult: 1				YES		90	6 ns	133 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc	MT46H32M32LFCM-75IT:A								33554432 words	32000000	85 °C	-40 °C	PLASTIC/EPOXY	VFBGA	VFBGA, BGA90,9X15,32	BGA90,9X15,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Obsolete	BGA	30	5.37		Yes			1.8 V				e1		EAR99		Tin/Silver/Copper (Sn/Ag/Cu)			AUTO/SELF REFRESH	8542.32.00.32	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	unknown		90	R-PBGA-B90	Not Qualified		1.95 V	1.8 V	INDUSTRIAL	1.7 V					1		SYNCHRONOUS		0.14 mA			32MX32	3-STATE	1 mm	32			0.0006 A	1			COMMON	DDR DRAM			8192	2,4,8	2,4,8	FOUR BANK PAGE BURST	YES	13 mm	10 mm
Mfr Part No W949D6CBHX6E	Winbond Electronics Corporation	Datasheet	-	-	Min: 1 Mult: 1				YES		60	5 ns	166 MHz		WINBOND ELECTRONICS CORP		Winbond Electronics Corp	W949D6CBHX6E								33554432 words	32000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	8 X 9 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-60	BGA60,9X10,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	BGA	NOT SPECIFIED	5.37		Yes			1.8 V						EAR99					AUTO/SELF REFRESH	8542.32.00.28	DRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	compliant		60	R-PBGA-B60	Not Qualified		1.95 V	1.8 V	OTHER	1.7 V					1		SYNCHRONOUS		0.075 mA			32MX16	3-STATE	1.025 mm	16			0.00001 A	536870912 bit			COMMON	DDR DRAM			8192	2,4,8,16	2,4,8,16	FOUR BANK PAGE BURST	YES	9 mm	8 mm
Mfr Part No MT47H128M4BT-37E:A	Micron	Datasheet	-	-	Min: 1 Mult: 1				YES		92	0.5 ns	267 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc	MT47H128M4BT-37E:A								134217728 words	128000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA92,9X21,32	BGA92,9X21,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	30	8.62		Yes			1.8 V				e1		EAR99		Tin/Silver/Copper (Sn/Ag/Cu)			AUTO/SELF REFRESH	8542.32.00.28	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	unknown		92	R-PBGA-B92	Not Qualified		1.9 V	1.8 V	OTHER	1.7 V					1		SYNCHRONOUS					128MX4	3-STATE	1.2 mm	4			0.005 A	536870912 bit			COMMON	DDR DRAM			8192	4,8	4,8	FOUR BANK PAGE BURST	YES	19 mm	11 mm
Mfr Part No IS43DR16320B-3DBL	ISSI	Datasheet	-	-	Min: 1 Mult: 1	12 Weeks	Surface Mount		YES	84	84	0.45 ns	333 MHz		INTEGRATED SILICON SOLUTION INC		Integrated Silicon Solution Inc	IS43DR16320B-3DBL			DDR2 SDRAM, RAM					33554432 words	32000000	70 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	DSBGA	40	5.59	Compliant	Yes			1.8 V				e1	Yes	EAR99		Tin/Silver/Copper (Sn/Ag/Cu)	70 °C	0 °C	AUTO/SELF REFRESH	8542.32.00.28	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	compliant	333 MHz	84	R-PBGA-B84	Not Qualified	1.8 V	1.9 V	1.8 V	COMMERCIAL	1.7 V	Parallel	1.9 V	1.7 V	64 MB	1	280 mA	SYNCHRONOUS	340 mA	0.34 mA	450 ps	16 b	32MX16	3-STATE	1.2 mm	16	15 b	512 Mb	0.008 A	512	667 MHz		COMMON	DDR DRAM		512 MB	8192	4,8	4,8	FOUR BANK PAGE BURST	YES	13 mm	10.5 mm	No	No SVHC
Mfr Part No HYS64T128021HDL-3S-B	Qimonda	Datasheet	-	-	Min: 1 Mult: 1				NO		200	0.45 ns	333 MHz		QIMONDA AG		Qimonda AG	HYS64T128021HDL-3S-B								134217728 words	128000000	65 °C		UNSPECIFIED	DIMM	DIMM, DIMM200,24	DIMM200,24	RECTANGULAR	MICROELECTRONIC ASSEMBLY	Obsolete	MODULE	NOT SPECIFIED	5.71		Yes			1.8 V						EAR99					AUTO/SELF REFRESH	8542.32.00.36	DRAMs	CMOS	DUAL	NO LEAD	NOT SPECIFIED	1	0.6 mm	unknown		200	R-XDMA-N200	Not Qualified		1.9 V	1.8 V	COMMERCIAL	1.7 V					1		SYNCHRONOUS		1.34 mA			128MX64	3-STATE		64			0.11 A	8589934592 bit			COMMON	DDR DRAM MODULE			8192			DUAL BANK PAGE BURST	YES
Mfr Part No H5PS1G63JFR-S5C	Hynix	Datasheet	-	-	Min: 1 Mult: 1				YES		84	0.4 ns	400 MHz		SK HYNIX INC		SK Hynix Inc	H5PS1G63JFR-S5C								67108864 words	64000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	NOT SPECIFIED	5.44		Yes			1.8 V						EAR99					AUTO/SELF REFRESH	8542.32.00.32	DRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	unknown		84	R-PBGA-B84	Not Qualified		1.9 V	1.8 V	OTHER	1.7 V					1		SYNCHRONOUS		0.28 mA			64MX16	3-STATE	1.2 mm	16			0.01 A	1073741824 bit			COMMON	DDR DRAM			8192	4,8	4,8	MULTI BANK PAGE BURST	YES	12.5 mm	7.5 mm
Mfr Part No W9725G6JB-25	Winbond	Datasheet	-	-	Min: 1 Mult: 1				YES		84	0.4 ns	400 MHz		WINBOND ELECTRONICS CORP		Winbond Electronics Corp	W9725G6JB-25								16777216 words	16000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	NOT SPECIFIED	7.99		Yes			1.8 V						EAR99					AUTO/SELF REFRESH	8542.32.00.24	DRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	unknown		84	R-PBGA-B84	Not Qualified		1.9 V	1.8 V	OTHER	1.7 V					1		SYNCHRONOUS		0.135 mA			16MX16	3-STATE	1.2 mm	16			0.006 A	268435456 bit			COMMON	DDR DRAM			8192	4,8	4,8	MULTI BANK PAGE BURST	YES	12.5 mm	8 mm
Mfr Part No GS82582Q20GE-500	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	12 Weeks		BGA-165	YES		165	0.45 ns	500 MHz	10	GSI TECHNOLOGY	Parallel		GS82582Q20GE-500	500 MHz	+ 70 C	QDR-II	0 C	Yes		SMD/SMT	16777216 words	16000000	85 °C		PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active		NOT SPECIFIED	5.73	Details	Yes	1.9 V	1.7 V	1.8 V	SigmaQuad-II+	Tray	GS82582Q20GE			3A991.B.2.B	SigmaQuad-II+ B2							CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant			R-PBGA-B165	Not Qualified		1.9 V	1.8 V	OTHER	1.7 V				288 Mbit			SYNCHRONOUS		1.41 A			16 M x 18	3-STATE	1.5 mm	18				301989888 bit		PARALLEL	SEPARATE	STANDARD SRAM	1.7 V							17 mm	15 mm
Mfr Part No MT47H64M4BP-5E:B	Micron	Datasheet	-	-	Min: 1 Mult: 1				YES		60	0.6 ns	200 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc	MT47H64M4BP-5E:B								67108864 words	64000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA60,9X11,32	BGA60,9X11,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	30	5.82		Yes			1.8 V				e1		EAR99		Tin/Silver/Copper (Sn/Ag/Cu)			AUTO/SELF REFRESH	8542.32.00.24	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	not_compliant		60	R-PBGA-B60	Not Qualified		1.9 V	1.8 V	OTHER	1.7 V					1		SYNCHRONOUS		0.23 mA			64MX4	3-STATE	1.2 mm	4			0.005 A	268435456 bit			COMMON	DDR DRAM			8192	4,8	4,8	FOUR BANK PAGE BURST	YES	12 mm	8 mm
Mfr Part No MT48H16M32LFCM-75IT:B	Micron	Datasheet	-	-	Min: 1 Mult: 1		Surface Mount		YES	90	90	5.4 ns	133 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc	MT48H16M32LFCM-75IT:B								16777216 words	16000000	85 °C	-40 °C	PLASTIC/EPOXY	VFBGA	VFBGA, BGA90,9X15,32	BGA90,9X15,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Obsolete	BGA	30	5.46	Compliant	Yes			1.8 V				e1		EAR99		Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	-40 °C	AUTO/SELF REFRESH	8542.32.00.28	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	unknown		90	R-PBGA-B90	Not Qualified	1.8 V	1.95 V	1.8 V	INDUSTRIAL	1.7 V		1.95 V	1.7 V		1	95 mA	SYNCHRONOUS		0.095 mA		32 b	16MX32	3-STATE	1 mm	32	15 b	512 Mb	0.00001 A	536870912 bit	133 MHz		COMMON	SYNCHRONOUS DRAM			8192	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES	13 mm	10 mm	No		Lead Free
Mfr Part No MT47H16M16BG-3E	Micron	Datasheet	-	-	Min: 1 Mult: 1				YES		84	0.45 ns	333 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc	MT47H16M16BG-3E								16777216 words	16000000			PLASTIC/EPOXY	FBGA	FBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, FINE PITCH	Obsolete			5.83		Yes			1.8 V													DRAMs	CMOS	BOTTOM	BALL			0.8 mm	compliant			R-PBGA-B84	Not Qualified			1.8 V											0.18 mA			16MX16	3-STATE		16			0.005 A	268435456 bit			COMMON	DDR DRAM			8192	4,8	4,8
Mfr Part No MT46H32M16LFCK-75LIT	Micron	Datasheet	-	-	Min: 1 Mult: 1				YES		60	6 ns	133 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc	MT46H32M16LFCK-75LIT								33554432 words	32000000	85 °C	-40 °C	PLASTIC/EPOXY	VFBGA	10 X 11.5 MM, LEAD FREE, PLASTIC, VFBGA-60	BGA60,9X10,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Active	BGA	30	5.12		Yes			1.8 V				e1	Yes	EAR99		Tin/Silver/Copper (Sn/Ag/Cu)			AUTO/SELF REFRESH	8542.32.00.28	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	compliant		60	R-PBGA-B60	Not Qualified		1.95 V	1.8 V	INDUSTRIAL	1.7 V					1		SYNCHRONOUS		0.1 mA			32MX16	3-STATE	1 mm	16			0.00001 A	536870912 bit			COMMON	DDR DRAM			8192	2,4,8	2,4,8	FOUR BANK PAGE BURST	YES	11.5 mm	10 mm
Mfr Part No HYB18T512160BF-3.7	Qimonda	Datasheet	-	-	Min: 1 Mult: 1				YES		84	0.5 ns	266 MHz		QIMONDA AG		Qimonda AG	HYB18T512160BF-3.7						3		33554432 words	32000000	95 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	40	5.68		Yes			1.8 V						EAR99					AUTO/SELF REFRESH	8542.32.00.28	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	unknown		84	R-PBGA-B84	Not Qualified		1.9 V	1.8 V	OTHER	1.7 V					1		SYNCHRONOUS		0.23 mA			32MX16	3-STATE	1.2 mm	16			0.007 A	536870912 bit			COMMON	DDR DRAM			8192	4,8	4,8	FOUR BANK PAGE BURST	YES	12.5 mm	10 mm
Mfr Part No W971GG6JB-25	Winbond	Datasheet	-	-	Min: 1 Mult: 1				YES		84	0.4 ns	400 MHz		WINBOND ELECTRONICS CORP		Winbond Electronics Corp	W971GG6JB-25								67108864 words	64000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	NOT SPECIFIED	8.15		Yes			1.8 V					Yes	EAR99					AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	compliant		84	R-PBGA-B84	Not Qualified		1.9 V	1.8 V	OTHER	1.7 V					1		SYNCHRONOUS		0.225 mA			64MX16	3-STATE	1.2 mm	16			0.01 A	1073741824 bit			COMMON	DDR DRAM			8192	4,8	4,8	MULTI BANK PAGE BURST	YES	12.5 mm	8 mm
Mfr Part No MT47H128M8HQ-25E:E	Micron	Datasheet	-	-	Min: 1 Mult: 1				YES		60	0.4 ns	400 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc	MT47H128M8HQ-25E:E								134217728 words	128000000	85 °C	-40 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA60,9X11,32	BGA60,9X11,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	30	8.18		Yes			1.8 V				e1		EAR99		Tin/Silver/Copper (Sn/Ag/Cu)			AUTO/SELF REFRESH	8542.32.00.32	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	unknown		60	R-PBGA-B60	Not Qualified		1.9 V	1.8 V	INDUSTRIAL	1.7 V					1		SYNCHRONOUS		0.335 mA			128MX8	3-STATE	1.2 mm	8				1073741824 bit			COMMON	DDR DRAM			8192	4,8	4,8	MULTI BANK PAGE BURST	YES	11.5 mm	8 mm
Mfr Part No W971GG6JB-25I	Winbond	Datasheet	-	-	Min: 1 Mult: 1				YES		84	0.4 ns	400 MHz		WINBOND ELECTRONICS CORP		Winbond Electronics Corp	W971GG6JB-25I								67108864 words	64000000	85 °C	-40 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	NOT SPECIFIED	5.62		Yes			1.8 V						EAR99					AUTO/SELF REFRESH	8542.32.00.32	DRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	compliant		84	R-PBGA-B84	Not Qualified		1.9 V	1.8 V	INDUSTRIAL	1.7 V					1		SYNCHRONOUS		0.225 mA			64MX16	3-STATE	1.2 mm	16			0.01 A	1073741824 bit			COMMON	DDR DRAM			8192	4,8	4,8	MULTI BANK PAGE BURST	YES	12.5 mm	8 mm
Mfr Part No W9751G6JB-3	Winbond	Datasheet	-	-	Min: 1 Mult: 1				YES		84	0.45 ns	333 MHz		WINBOND ELECTRONICS CORP		Winbond Electronics Corp	W9751G6JB-3								33554432 words	32000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.45		Yes			1.8 V						EAR99					AUTO/SELF REFRESH	8542.32.00.28	DRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	compliant		84	R-PBGA-B84	Not Qualified		1.9 V	1.8 V	OTHER	1.7 V					1		SYNCHRONOUS		0.18 mA			32MX16	3-STATE	1.2 mm	16			0.008 A	536870912 bit			COMMON	DDR DRAM			8192	4,8	4,8	FOUR BANK PAGE BURST	YES	12.5 mm	8 mm

Memory (181)