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2.5/3.3 V

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Factory Lead Time	Mount	Mounting Type	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Access Time-Max	Base Product Number	Brand	Clock Frequency-Max (fCLK)	Data Rate Architecture	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Clock Rate	Maximum Operating Supply Voltage	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number of I/O Lines	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Timing Type	Tradename	Typical Operating Supply Voltage	Unit Weight	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Frequency	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Max Supply Voltage	Min Supply Voltage	Memory Size	Number of Ports	Nominal Supply Current	Operating Mode	Clock Frequency	Supply Current-Max	Access Time	Memory Format	Memory Interface	Architecture	Organization	Output Characteristics	Seated Height-Max	Memory Width	Write Cycle Time - Word, Page	Address Bus Width	Product Type	Density	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Sync/Async	Word Size	Memory IC Type	Standby Voltage-Min	Product Category	Memory Organization	Length	Width	Radiation Hardening
Mfr Part No GS832132AGD-250	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-165	YES			165	5.5 ns		GSI Technology	250 MHz	SDR	18	GSI TECHNOLOGY	Parallel	GSI Technology	GS832132AGD-250	250 MHz	181.8@Flow-Through/250@Pipelined MHz	2.7, 3.6 V	+ 70 C	SDR		2.3, 3 V	0 C	Yes		Surface Mount	SMD/SMT	32 Bit	1 MWords	1000000	85 °C			PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA		NOT SPECIFIED	5.16	Details	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V		Commercial grade	0 to 85 °C	Tray	GS832132AGD			3A991.B.2.B	Pipeline/Flow Through				PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant		165	R-PBGA-B165	Not Qualified	2.7 V	2.5/3.3 V	OTHER	2.3 V			36 Mbit	4		SYNCHRONOUS		230 mA, 285 mA	5.5 ns			Flow-Through/Pipelined	1 M x 32	3-STATE	1.4 mm	32		20 Bit	SRAM	36 Mbit	0.03 A	33554432 bit	Commercial	PARALLEL	COMMON			CACHE SRAM	2.3 V	SRAM		15 mm	13 mm
Mfr Part No GS832136AD-150	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-165	YES			165	7.5 ns		GSI Technology	150 MHz	SDR	18	GSI TECHNOLOGY	Parallel	GSI Technology	GS832136AD-150	150 MHz	133.3@Flow-Through/150@Pipelined MHz	2.7, 3.6 V	+ 70 C	SDR		2.3, 3 V	0 C	Yes		Surface Mount	SMD/SMT	36 Bit	1 MWords	1000000	85 °C			PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA			5.16	N	No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V		Commercial grade	0 to 85 °C	Tray	GS832136AD			3A991.B.2.B	Pipeline/Flow Through				PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL		1	1 mm	compliant		165	R-PBGA-B165	Not Qualified	2.7 V	2.5/3.3 V	OTHER	2.3 V			36 Mbit	4		SYNCHRONOUS		190 mA, 200 mA	7.5 ns			Flow-Through/Pipelined	1 M x 36	3-STATE	1.4 mm	36		20 Bit	SRAM	36 Mbit	0.03 A	37748736 bit	Commercial	PARALLEL	COMMON			CACHE SRAM	2.3 V	SRAM		15 mm	13 mm
Mfr Part No GS832218AB-250I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-119	YES			119	5.5 ns		GSI Technology	250 MHz	SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS832218AB-250I	250 MHz	181.8@Flow-Through/250@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR		2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	18 Bit	2 MWords	2000000	85 °C	-40 °C		PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Active	BGA		NOT SPECIFIED	4.72	Compliant	No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V		Industrial grade	-40 to 100 °C	Bulk	GS832218AB	e0	No	3A991.B.2.B	Pipeline/Flow Through	Tin/Lead (Sn/Pb)	100 °C	-40 °C	ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant		119	R-PBGA-B119	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V			36 Mbit	2		SYNCHRONOUS		235 mA, 275 mA	5.5 ns			Flow-Through/Pipelined	2 M x 18	3-STATE	1.99 mm	18		21 Bit	SRAM	36 Mbit	0.04 A	37748736 bit	Industrial	PARALLEL	COMMON			CACHE SRAM	2.3 V	SRAM		22 mm	14 mm	No
Mfr Part No GS8322Z18AD-150	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-165	YES			165	7.5 ns		GSI Technology	150 MHz	SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS8322Z18AD-150	150 MHz	133.3@Flow-Through/150@Pipelined MHz	2.7, 3.6 V	+ 70 C	SDR		2.3, 3 V	0 C	Yes		Surface Mount	SMD/SMT	18 Bit	2 MWords	2000000	70 °C			PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA		NOT SPECIFIED	5.13	Compliant	No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V		Commercial grade	0 to 85 °C	Bulk	GS8322Z18AD	e0	No	3A991.B.2.B	NBT Pipeline/Flow Through	Tin/Lead (Sn/Pb)	85 °C	0 °C	ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant		165	R-PBGA-B165	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V			36 Mbit	2		SYNCHRONOUS		175 mA, 190 mA	7.5 ns			Flow-Through/Pipelined	2 M x 18	3-STATE	1.4 mm	18		21 Bit	SRAM	36 Mbit	0.03 A	37748736 bit	Commercial	PARALLEL	COMMON			ZBT SRAM	2.3 V	SRAM		15 mm	13 mm	No
Mfr Part No GS832218AGB-333	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-119	YES			119	4.5 ns		GSI Technology	333 MHz	SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS832218AGB-333	333 MHz		2.7, 3.6 V	+ 70 C	SDR		2.3, 3 V	0 C	Yes	3	Surface Mount	SMD/SMT	18 Bit	2 MWords	2000000	70 °C			PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Active	BGA		NOT SPECIFIED	5.11	Details	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V		Commercial grade	0 to 85 °C	Tray	GS832218AGB	e1	Yes	3A991.B.2.B	Pipeline/Flow Through	Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	0 °C	ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	260	1	1.27 mm	compliant		119	R-PBGA-B119	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V			36 Mbit	2		SYNCHRONOUS		235 mA, 320 mA	4.5 ns			Flow-Through/Pipelined	2 M x 18	3-STATE	1.99 mm	18		21 b	SRAM	36 Mbit	0.03 A	37748736 bit	Commercial	PARALLEL	COMMON			CACHE SRAM	2.3 V	SRAM		22 mm	14 mm	No
Mfr Part No GS832236AGD-200	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-165	YES			165	6.5 ns		GSI Technology	200 MHz	SDR	18	GSI TECHNOLOGY	Parallel	GSI Technology	GS832236AGD-200	200 MHz		2.7, 3.6 V	+ 70 C	SDR		2.3, 3 V	0 C	Yes	3	Surface Mount	SMD/SMT	36 Bit	1 MWords	1000000	70 °C			PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA		NOT SPECIFIED	5.12	Details	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V		Commercial grade	0 to 85 °C	Tray	GS832236AGD	e1	Yes	3A991.B.2.B	Pipeline/Flow Through	Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	0 °C	ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	260	1	1 mm	compliant		165	R-PBGA-B165	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V			36 Mbit	4		SYNCHRONOUS		205 mA, 240 mA	6.5 ns			Flow-Through/Pipelined	1 M x 36	3-STATE	1.4 mm	36		20 b	SRAM	36 Mbit	0.03 A	37748736 bit	Commercial	PARALLEL	COMMON			CACHE SRAM	2.3 V	SRAM		15 mm	13 mm	No
Mfr Part No GS832132AD-200I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	12 Weeks			BGA-165	YES			165	6.5 ns		GSI Technology	200 MHz	SDR	18	GSI TECHNOLOGY	Parallel	GSI Technology	GS832132AD-200I	200 MHz	153.8@Flow-Through/200@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR		2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	32 Bit	1 MWords	1000000	85 °C	-40 °C		PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA			1.67	N	No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V		Industrial grade	-40 to 100 °C	Tray	GS832132AD			3A991.B.2.B	Pipeline/Flow Through		100 °C	-40 °C	PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL		1	1 mm	compliant		165	R-PBGA-B165	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V			36 Mbit	4		SYNCHRONOUS		225 mA, 260 mA	6.5 ns			Flow-Through/Pipelined	1 M x 32	3-STATE	1.4 mm	32		20 Bit	SRAM	36 Mbit	0.04 A	33554432 bit	Industrial	PARALLEL	COMMON			CACHE SRAM	2.3 V	SRAM		15 mm	13 mm	No
Mfr Part No GS832272C-250I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	9 Weeks, 4 Days			BGA-209	YES			209	6.5 ns		GSI Technology	250 MHz	SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS832272C-250I	250 MHz	153.8@Flow-Through/250@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR		2.3, 3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	72 Bit	512 kWords	512000	85 °C	-40 °C		PLASTIC/EPOXY	LBGA	LBGA, BGA209,11X19,40	BGA209,11X19,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA		NOT SPECIFIED	4.75	Compliant	No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V	0.887207 oz	Industrial grade	-40 to 85 °C	Tray	GS832272C		No	3A991.B.2.B	SCD/DCD Pipeline/Flow Through		85 °C	-40 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant		209	R-PBGA-B209	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V			36 Mbit	8		SYNCHRONOUS		285 mA, 400 mA	6.5 ns			Flow-Through/Pipelined	512 k x 72	3-STATE	1.7 mm	72		19 Bit	SRAM	36 Mbit	0.08 A	37748736 bit	Industrial	PARALLEL	COMMON			CACHE SRAM	2.38 V	SRAM		22 mm	14 mm	No
Mfr Part No GS816032BGT-150	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1					YES			100	7.5 ns			150 MHz			GSI TECHNOLOGY		GSI Technology	GS816032BGT-150										3				524288 words	512000	70 °C			PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Obsolete	QFP		NOT SPECIFIED	5.67		Yes				2.5 V									e3	Yes	3A991.B.2.B		PURE MATTE TIN			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	SRAMs	CMOS		QUAD	GULL WING	260	1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V						SYNCHRONOUS		0.205 mA					512KX32	3-STATE	1.6 mm	32						16777216 bit		PARALLEL	COMMON			CACHE SRAM	2.3 V			20 mm	14 mm
Mfr Part No GS8642Z72GC-167I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-209	YES			209	8 ns		GSI Technology	167 MHz		14	GSI TECHNOLOGY	Parallel	GSI Technology	GS8642Z72GC-167I	167 MHz	125@Flow-Through/167@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR		2.3, 3 V	- 40 C	Yes	3		SMD/SMT	72 Bit	1048576 words	1000000	85 °C	-40 °C		PLASTIC/EPOXY	LBGA	LBGA, BGA209,11X19,40	BGA209,11X19,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA		NOT SPECIFIED	5.18	Details	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V		Industrial grade	-40 to 85 °C	Tray	GS8642Z72GC	e1	Yes	3A991.B.2.B	NBT Pipeline/Flow Through	Tin/Silver/Copper (Sn/Ag/Cu)			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	260	1	1 mm	compliant		209	R-PBGA-B209	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V			72 Mbit			SYNCHRONOUS		280 mA, 360 mA	8@Flow-Through/3.5@P				1 M x 72	3-STATE	1.7 mm	72			SRAM		0.12 A	72	Industrial	PARALLEL	COMMON			ZBT SRAM	2.3 V	SRAM		22 mm	14 mm
Mfr Part No GS8321Z36E250I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		Surface Mount			YES	165		165	6.5 ns			250 MHz			GSI TECHNOLOGY		GSI Technology	GS8321Z36E-250I										3				1048576 words	1000000	85 °C	-40 °C		PLASTIC/EPOXY	LBGA	15 X 17 MM, 1 MM PITCH, FPBGA-165	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Obsolete	BGA		NOT SPECIFIED	5.65	Compliant	No				2.5 V										No	3A991.B.2.B			85 °C	-40 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	SRAMs	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant	153 MHz	165	R-PBGA-B165	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V	3.6 V	2.3 V		1	220 mA	SYNCHRONOUS		0.32 mA	6.5 ns				1MX36	3-STATE	1.5 mm	36		20 b		36 Mb	0.08 A	37748736 bit		PARALLEL	COMMON	Synchronous	36 b	ZBT SRAM	2.3 V			17 mm	15 mm	No
Mfr Part No GS8322Z36AGD-375I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-165	YES			165	4.2 ns		GSI Technology	375 MHz		14	GSI TECHNOLOGY	Parallel	GSI Technology	GS8322Z36AGD-375I	375 MHz	238@Flow-Through/375@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR		2.3, 3 V	- 40 C	Yes	3		SMD/SMT	36 Bit	1048576 words	1000000	85 °C	-40 °C		PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA		NOT SPECIFIED	5.12	Details	Yes		3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V		Industrial grade	-40 to 100 °C	Tray	GS8322Z36AGD	e1	Yes	3A991.B.2.B	NBT Pipeline/Flow Through	Tin/Silver/Copper (Sn/Ag/Cu)			ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	260	1	1 mm	compliant		165	R-PBGA-B165	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V			36 Mbit			SYNCHRONOUS		290 mA, 400 mA	4.2@Flow-Through/2.5				1 M x 36	3-STATE	1.4 mm	36			SRAM		0.04 A	36	Industrial	PARALLEL	COMMON			ZBT SRAM	2.3 V	SRAM		15 mm	13 mm
Mfr Part No GS8644Z36GE-250I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-165	YES			165	6.5 ns		GSI Technology	250 MHz	SDR	15	GSI TECHNOLOGY	Parallel	GSI Technology	GS8644Z36GE-250I	250 MHz	153.8@Flow-Through/250@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR		2.3, 3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	36 Bit	2 MWords	2000000	85 °C	-40 °C		PLASTIC/EPOXY	BGA	BGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY	Active	BGA		NOT SPECIFIED	5.15	Details	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V		Industrial grade	-40 to 85 °C	Tray	GS8644Z36GE	e1	Yes	3A991.B.2.B	NBT	Tin/Silver/Copper (Sn/Ag/Cu)			ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	260	1	1 mm	compliant		165	R-PBGA-B165	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V			72 Mbit	4		SYNCHRONOUS		295 mA, 435 mA	6.5 ns			Flow-Through/Pipelined	2 M x 36	3-STATE	1.5 mm	36		21 Bit	SRAM	72 Mbit	0.16 A	75497472 bit	Industrial	PARALLEL	COMMON			ZBT SRAM	2.3 V	SRAM		17 mm	15 mm
Mfr Part No GS832136AGD-333I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks		Surface Mount	BGA-165	YES		165-FPBGA (13x15)	165	4.5 ns	GS832136	GSI Technology	333 MHz	SDR	18	GSI TECHNOLOGY	Parallel	GSI Technology	GS832136AGD-333I	333 MHz	222.2@Flow-Through/333@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	GSI Technology Inc.	2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	36 Bit	1 MWords	1000000	85 °C	-40 °C	Tray	PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	Active	NOT SPECIFIED	5.16	Details	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V		Industrial grade	-40 to 100 °C	Tray	GS832136AGD			3A991.B.2.B	Pipeline/Flow Through				PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY	8542.32.00.41	Memory & Data Storage	SRAM - Synchronous, Standard	2.3V ~ 2.7V, 3V ~ 3.6V	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant		165	R-PBGA-B165	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V			36 Mbit	4		SYNCHRONOUS	333 MHz	280 mA, 365 mA	4.5 ns	SRAM	Parallel	Flow-Through/Pipelined	1 M x 36	3-STATE	1.4 mm	36	-	20 Bit	SRAM	36 Mbit	0.04 A	37748736 bit	Industrial	PARALLEL	COMMON			CACHE SRAM	2.3 V	SRAM	1M x 36	15 mm	13 mm
Mfr Part No GS88032CGT-200T	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks				YES			100	6.5 ns						GSI TECHNOLOGY		GSI Technology	GS88032CGT-200T										3				262144 words	256000	70 °C			PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Active	QFP		NOT SPECIFIED	5.61		Yes				2.5 V									e3	Yes	3A991.B.2.B		PURE MATTE TIN			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY	8542.32.00.41	SRAMs	CMOS		QUAD	GULL WING	260	1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V						SYNCHRONOUS		0.17 mA					256KX32	3-STATE	1.6 mm	32					0.025 A	8388608 bit		PARALLEL	COMMON			CACHE SRAM	2.3 V			20 mm	14 mm
Mfr Part No GS8644Z36E-133	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-165	YES			165	8.5 ns		GSI Technology	133 MHz	SDR	15	GSI TECHNOLOGY	Parallel	GSI Technology	GS8644Z36E-133	133 MHz	117.6@Flow-Through/133@Pipelined MHz	2.7, 3.6 V	+ 70 C	SDR		2.3, 3 V	0 C	Yes	3	Surface Mount	SMD/SMT	36 Bit	2 MWords	2000000	70 °C			PLASTIC/EPOXY	BGA	BGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY	Active	BGA		NOT SPECIFIED	5.15	N	No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V		Commercial grade	0 to 70 °C	Tray	GS8644Z36E		No	3A991.B.2.B	NBT				ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant		165	R-PBGA-B165	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V			72 Mbit	4		SYNCHRONOUS		230 mA, 270 mA	8.5 ns			Flow-Through/Pipelined	2 M x 36	3-STATE	1.5 mm	36		21 Bit	SRAM	72 Mbit	0.12 A	75497472 bit	Commercial	PARALLEL	COMMON			ZBT SRAM	2.3 V	SRAM		17 mm	15 mm
Mfr Part No GS832218AB-400I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-119	YES			119	4 ns		GSI Technology	400 MHz	SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS832218AB-400I	400 MHz		2.7, 3.6 V	+ 85 C	SDR		2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	18 Bit	2 MWords	2000000	85 °C	-40 °C		PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Active	BGA		NOT SPECIFIED	5.1		No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V		Industrial grade	-40 to 100 °C	Tray	GS832218AB	e0	No	3A991.B.2.B	Pipeline/Flow Through	Tin/Lead (Sn/Pb)			ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant		119	R-PBGA-B119	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V			36 Mbit	2		SYNCHRONOUS		285 mA, 375 mA	4 ns			Flow-Through/Pipelined	2 M x 18	3-STATE	1.99 mm	18			SRAM	36 Mbit	0.04 A	37748736 bit	Industrial	PARALLEL	COMMON			CACHE SRAM	2.3 V	SRAM		22 mm	14 mm
Mfr Part No GS8322Z36AGB-375	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-119	YES			119	4.2 ns		GSI Technology	375 MHz	SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS8322Z36AGB-375	375 MHz	238@Flow-Through/375@Pipelined MHz	2.7, 3.6 V	+ 70 C	SDR		2.3, 3 V	0 C	Yes	3	Surface Mount	SMD/SMT	36 Bit	1 MWords	1000000	70 °C			PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Active	BGA		NOT SPECIFIED	5.12	Details	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V		Commercial grade	0 to 85 °C	Tray	GS8322Z36AGB	e1	Yes	3A991.B.2.B	NBT Pipeline/Flow Through	Tin/Silver/Copper (Sn/Ag/Cu)			ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	260	1	1.27 mm	compliant		119	R-PBGA-B119	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V			36 Mbit	4		SYNCHRONOUS		270 mA, 380 mA	4.2 ns			Flow-Through/Pipelined	1 M x 36	3-STATE	1.99 mm	36		20 Bit	SRAM	36 Mbit	0.03 A	37748736 bit	Commercial	PARALLEL	COMMON			ZBT SRAM	2.3 V	SRAM		22 mm	14 mm
Mfr Part No GS832272C-166	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	5 Weeks			BGA-209	YES			209	8 ns		GSI Technology	166 MHz	SDR	14	GSI TECHNOLOGY	Parallel	GSI Technology	GS832272C-166	166 MHz	125@Flow-Through/166@Pipelined MHz	2.7, 3.6 V	+ 70 C	SDR		2.3, 3 V	0 C	Yes	3	Surface Mount	SMD/SMT	72 Bit	512 kWords	512000	70 °C			PLASTIC/EPOXY	LBGA	LBGA, BGA209,11X19,40	BGA209,11X19,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA		NOT SPECIFIED	1.63	N	No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V		Commercial grade	0 to 70 °C	Tray	GS832272C		No	3A991.B.2.B	SCD/DCD Pipeline/Flow Through				FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant		209	R-PBGA-B209	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V			36 Mbit	8		SYNCHRONOUS		225 mA, 280 mA	8 ns			Flow-Through/Pipelined	512 k x 72	3-STATE	1.7 mm	72		19 Bit	SRAM	36 Mbit	0.06 A	37748736 bit	Commercial	PARALLEL	COMMON			CACHE SRAM	2.38 V	SRAM		22 mm	14 mm
Mfr Part No GS832236AGD-375	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-165	YES			165	4.2 ns		GSI Technology	375 MHz	SDR	18	GSI TECHNOLOGY	Parallel	GSI Technology	GS832236AGD-375	375 MHz	238@Flow-Through/375@Pipelined MHz	2.7, 3.6 V	+ 70 C	SDR		2.3, 3 V	0 C	Yes	3	Surface Mount	SMD/SMT	36 Bit	1 MWords	1000000	70 °C			PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA		NOT SPECIFIED	5.12	Details	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V		Commercial grade	0 to 85 °C	Tray	GS832236AGD	e1	Yes	3A991.B.2.B	Pipeline/Flow Through	TIN SILVER COPPER	85 °C	0 °C	ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	260	1	1 mm	compliant		165	R-PBGA-B165	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V			36 Mbit	4		SYNCHRONOUS		270 mA, 380 mA	4.2 ns			Flow-Through/Pipelined	1 M x 36	3-STATE	1.4 mm	36		20 Bit	SRAM	36 Mbit	0.03 A	37748736 bit	Commercial	PARALLEL	COMMON			CACHE SRAM	2.3 V	SRAM		15 mm	13 mm	No

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