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Power Supplies:
2.5/3.3 V

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Factory Lead Time	Mount	Mounting Type	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Access Time-Max	Base Product Number	Brand	Cell Type	Clock Frequency-Max (fCLK)	Data Rate Architecture	Dimensions	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Clock Rate	Maximum Operating Supply Voltage	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number of I/O Lines	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Package Type	Part Life Cycle Code	Part Package Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Timing Type	Tradename	Typical Operating Supply Voltage	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Frequency	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Voltage	Interface	Max Supply Voltage	Min Supply Voltage	Memory Size	Number of Ports	Nominal Supply Current	Operating Mode	Clock Frequency	Supply Current-Max	Access Time	Memory Format	Memory Interface	Architecture	Organization	Output Characteristics	Seated Height-Max	Memory Width	Write Cycle Time - Word, Page	Address Bus Width	Product Type	Density	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Sync/Async	Memory IC Type	Programming Voltage	Serial Bus Type	Endurance	Write Cycle Time-Max (tWC)	Data Retention Time-Min	Write Protection	Standby Voltage-Min	Product Category	Temperature	Memory Organization	Height	Length	Width	Radiation Hardening
Mfr Part No GS816036BGT-250	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1					YES			100	5.5 ns				250 MHz				GSI TECHNOLOGY		GSI Technology	GS816036BGT-250										3				524288 words	512000	70 °C			PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE		Obsolete	QFP		NOT SPECIFIED	5.67		Yes				2.5 V								e3	Yes	3A991.B.2.B		PURE MATTE TIN			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	SRAMs	CMOS		QUAD	GULL WING	260	1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V								SYNCHRONOUS		0.305 mA					512KX36	3-STATE	1.6 mm	36					0.04 A	18874368 bit		PARALLEL	COMMON		CACHE SRAM							2.3 V					20 mm	14 mm
Mfr Part No M25P40-VMW6G	Micron	Datasheet	-	-	Min: 1 Mult: 1					YES			8					75 MHz				MICRON TECHNOLOGY INC		Micron Technology Inc	M25P40-VMW6G														524288 words	512000	85 °C	-40 °C		PLASTIC/EPOXY	SOP	SOP, SOP8,.3	SOP8,.3	RECTANGULAR	SMALL OUTLINE		Obsolete	SOIC		30	5.45		Yes				2.7 V									Yes	EAR99	NOR TYPE					8542.32.00.51	Flash Memories	CMOS		DUAL	GULL WING	260	1	1.27 mm	unknown		8	R-PDSO-G8	Not Qualified	3.6 V	2.5/3.3 V	INDUSTRIAL	2.3 V								SYNCHRONOUS		0.015 mA					512KX8		2.5 mm	8					0.00001 A	4194304 bit		SERIAL			FLASH	2.7 V	SPI	100000 Write/Erase Cycles	15 ms	20	HARDWARE/SOFTWARE							5.62 mm
Mfr Part No M25PX16-VMN6TPBA	Micron	Datasheet	-	-	Min: 1 Mult: 1					YES			8					75 MHz				MICRON TECHNOLOGY INC		Micron Technology Inc	M25PX16-VMN6TPBA														2097152 words	2000000	85 °C	-40 °C		PLASTIC/EPOXY	SOP	SOP, SOP8,.25	SOP8,.25	RECTANGULAR	SMALL OUTLINE		Obsolete			30	5.76		Yes				3 V									Yes		NOR TYPE						Flash Memories	CMOS		DUAL	GULL WING	260	1	1.27 mm	compliant			R-PDSO-G8	Not Qualified	3.6 V	2.5/3.3 V	INDUSTRIAL	2.7 V								SYNCHRONOUS		0.015 mA					2MX8		1.75 mm	8					0.00001 A	16777216 bit		SERIAL			FLASH	3 V	SPI	100000 Write/Erase Cycles		20	HARDWARE/SOFTWARE						4.9 mm	3.9 mm
Mfr Part No GS8642Z72C-250I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-209	YES			209	6.5 ns		GSI Technology		250 MHz	SDR		14	GSI TECHNOLOGY	Parallel	GSI Technology	GS8642Z72C-250I	250 MHz	153.8@Flow-Through/250@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR		2.3, 3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	72 Bit	1 MWords	1000000	85 °C	-40 °C		PLASTIC/EPOXY	LBGA	LBGA, BGA209,11X19,40	BGA209,11X19,40	RECTANGULAR	GRID ARRAY, LOW PROFILE		Active	BGA		NOT SPECIFIED	5.18	Compliant	No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS8642Z72C		No	3A991.B.2.B	NBT Pipeline/Flow Through		85 °C	-40 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant		209	R-PBGA-B209	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V					72 Mbit	8		SYNCHRONOUS		340 mA, 480 mA	6.5 ns			Flow-Through/Pipelined	1 M x 72	3-STATE	1.7 mm	72		20 Bit	SRAM	72 Mbit	0.12 A	75497472 bit	Industrial	PARALLEL	COMMON		ZBT SRAM							2.3 V	SRAM				22 mm	14 mm	No
Mfr Part No GS832036GT-133	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1					YES			100	8.5 ns				133 MHz				GSI TECHNOLOGY		GSI Technology	GS832036GT-133										3				1048576 words	1000000	70 °C			PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE		Obsolete	QFP		NOT SPECIFIED	5.7		Yes				2.5 V								e3	Yes	3A991.B.2.B		PURE MATTE TIN			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	SRAMs	CMOS		QUAD	GULL WING	260	1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V								SYNCHRONOUS		0.16 mA					1MX36	3-STATE	1.6 mm	36					0.06 A	37748736 bit		PARALLEL	COMMON		CACHE SRAM							3.14 V					20 mm	14 mm
Mfr Part No W25X20CLUXIG	Winbond	Datasheet	263 In Stock	-	Min: 1 Mult: 1		Surface Mount	Surface Mount		YES	8		8				NOR	104 MHz		3.1 x 2.1 x 0.55mm		WINBOND ELECTRONICS CORP	SPI	Winbond Electronics Corp	W25X20CLUXIG			3.6 V	+85 °C	NOR		2.3 V	-40 °C						256K	2000000	85 °C	-40 °C	USON - 8	PLASTIC/EPOXY	HVSON	2 X 3 MM, GREEN, PLASTIC, USON-8	SOLCC8,.11,20	RECTANGULAR	SMALL OUTLINE	USON	Active	SON		NOT SPECIFIED	2.28	Compliant	Yes				3 V							W25X			EAR99	NOR TYPE		85 °C	-40 °C	IT ALSO OPERATES AT 2.3 V AT 80 MHZ	8542.32.00.51	Flash Memories	CMOS		DUAL	NO LEAD	NOT SPECIFIED	1	0.5 mm	compliant	80/104MHz	8	R-PDSO-N8	Not Qualified	3.6 V	2.5/3.3 V	INDUSTRIAL	2.7 V	2.3 ~ 3.6V	SPI, Serial	3.6 V	2.3 V	2Mbit		14 mA	SYNCHRONOUS		0.015 mA	8 ns				2MX1		0.6 mm	1		24 b		2 Mb	0.000005 A	2097152 bit		SERIAL		Synchronous	FLASH	3 V	SPI	100000 Write/Erase Cycles		20	HARDWARE/SOFTWARE			-40~+85˚C		0.55mm	2.1mm	3.1mm	No
Mfr Part No GS842Z36CGB-166	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	7 Weeks			BGA-119	YES			119	7 ns		GSI Technology		166 MHz			84	GSI TECHNOLOGY	Parallel	GSI Technology	GS842Z36CGB-166	166 MHz			+ 70 C	SDR			0 C	Yes			SMD/SMT		131072 words	128000	70 °C			PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY		Active	BGA		NOT SPECIFIED	5.35	Details	Yes		3.6 V	2.3 V	2.5 V		NBT SRAM				Tray	GS842Z36CGB			3A991.B.2.B	NBT Pipeline/Flow Through				FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant		119	R-PBGA-B119	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V					4 Mbit			SYNCHRONOUS		135 mA, 160 mA	7 ns				128 k x 36	3-STATE	1.99 mm	36			SRAM		0.025 A	4718592 bit		PARALLEL	COMMON		ZBT SRAM							2.3 V	SRAM				22 mm	14 mm
Mfr Part No GS842Z18CB-250	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	7 Weeks			BGA-119	YES			119	5.5 ns		GSI Technology		250 MHz			84	GSI TECHNOLOGY	Parallel	GSI Technology	GS842Z18CB-250	250 MHz			+ 70 C	SDR			0 C	Yes			SMD/SMT		262144 words	256000	70 °C			PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY		Active	BGA			5.36		No		3.6 V	2.3 V	2.5 V		NBT SRAM				Tray	GS842Z18CB			3A991.B.2.B	NBT Pipeline/Flow Through				FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL		1	1.27 mm	compliant		119	R-PBGA-B119	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V					4 Mbit			SYNCHRONOUS		145 mA, 180 mA	5.5 ns				256 k x 18	3-STATE	1.99 mm	18			SRAM		0.025 A	4718592 bit		PARALLEL	COMMON		ZBT SRAM							2.3 V	SRAM				22 mm	14 mm
Mfr Part No GS832136AGD-250I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks		Surface Mount	BGA-165	YES		165-FPBGA (15x13)	165	5.5 ns	GS832136	GSI Technology		250 MHz	SDR		18	GSI TECHNOLOGY	Parallel	GSI Technology	GS832136AGD-250I	250 MHz	181.8@Flow-Through/250@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR	GSI Technology Inc.	2.3, 3 V	- 40 C	Yes		Surface Mount	SMD/SMT	36 Bit	1 MWords	1000000	85 °C	-40 °C	Tray	PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE		Active	BGA	Active	NOT SPECIFIED	5.16	Details	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 100 °C	Tray	GS832136AGD			3A991.B.2.B	Pipeline/Flow Through				PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY	8542.32.00.41	Memory & Data Storage	SRAM - Synchronous, Standard	2.3V ~ 2.7V, 3V ~ 3.6V	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant		165	R-PBGA-B165	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V					36 Mbit	4		SYNCHRONOUS	250 MHz	250 mA, 305 mA	5.5 ns	SRAM	Parallel	Flow-Through/Pipelined	1 M x 36	3-STATE	1.4 mm	36	-	20 Bit	SRAM	36 Mbit	0.04 A	37748736 bit	Industrial	PARALLEL	COMMON		CACHE SRAM							2.3 V	SRAM		1M x 36		15 mm	13 mm
Mfr Part No GS864218B-250M	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	10 Weeks				YES			119	6.5 ns				250 MHz	SDR			GSI TECHNOLOGY		GSI Technology	GS864218B-250M		153@Flow-Through/250@Pipelined MHz	2.7, 3.6 V				2.3, 3 V				Surface Mount		18 Bit	4 MWords	4000000	125 °C	-55 °C		PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY		Active	BGA		NOT SPECIFIED	5.43		No	FBGA			2.5 V	Synchronous		2.5, 3.3 V	Military grade	-55 to 125 °C			e0	No	3A991.B.2.B		Tin/Lead (Sn/Pb)			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	SRAMs	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant		119	R-PBGA-B119	Not Qualified	2.7 V	2.5/3.3 V	MILITARY	2.3 V						2		SYNCHRONOUS		0.355 mA				Flow-Through/Pipelined	4MX18	3-STATE	1.99 mm	18		22 Bit		72 Mbit	0.14 A	75497472 bit	Military	PARALLEL	COMMON		CACHE SRAM							2.3 V					22 mm	14 mm
Mfr Part No GS880F32CGT-6.5	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			TQFP-100	YES			100	6.5 ns		GSI Technology		153 MHz			72	GSI TECHNOLOGY	Parallel	GSI Technology	GS880F32CGT-6.5				+ 70 C	SDR			0 C	Yes	3		SMD/SMT		262144 words	256000	70 °C			PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE		Active	QFP		NOT SPECIFIED	5.37	Details	Yes		3.6 V	2.3 V	2.5 V		SyncBurst				Tray	GS880F32CGT	e3	Yes	3A991.B.2.B	Flow Through	PURE MATTE TIN			FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS		QUAD	GULL WING	260	1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V					9 Mbit			SYNCHRONOUS		140 mA	6.5 ns				256 k x 32	3-STATE	1.6 mm	32			SRAM		0.025 A	8388608 bit		PARALLEL	COMMON		CACHE SRAM							2.3 V	SRAM				20 mm	14 mm
Mfr Part No GS842Z18CGB-166I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	7 Weeks			BGA-119	YES			119	7 ns		GSI Technology		166 MHz			84	GSI TECHNOLOGY	Parallel	GSI Technology	GS842Z18CGB-166I	166 MHz			+ 85 C	SDR			- 40 C	Yes			SMD/SMT		262144 words	256000	85 °C	-40 °C		PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY		Active	BGA		NOT SPECIFIED	5.36	Details	Yes		3.6 V	2.3 V	2.5 V		NBT SRAM				Tray	GS842Z18CGB			3A991.B.2.B	NBT Pipeline/Flow Through				FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant		119	R-PBGA-B119	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V					4 Mbit			SYNCHRONOUS		145 mA, 160 mA	7 ns				256 k x 18	3-STATE	1.99 mm	18			SRAM		0.045 A	4718592 bit		PARALLEL	COMMON		ZBT SRAM							2.3 V	SRAM				22 mm	14 mm
Mfr Part No GS88037CGT-300	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			TQFP-100	YES			100	2.2 ns		GSI Technology		300 MHz	SDR		36	GSI TECHNOLOGY	Parallel	GSI Technology	GS88037CGT-300	300 MHz	300 MHz	2.7, 3.6 V	+ 70 C	SDR		2.3, 3 V	0 C	Yes	3	Surface Mount	SMD/SMT	36 Bit	256 kWords	256000	70 °C			PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE		Active	QFP		NOT SPECIFIED	5.61	Details	Yes	TQFP	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V	Commercial grade	0 to 70 °C	Tray	GS88037CGT	e3	Yes	3A991.B.2.B	Pipeline	PURE MATTE TIN			PIPELINED ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS		QUAD	GULL WING	260	1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V					9 Mbit	1		SYNCHRONOUS		225 mA				Pipelined	256 k x 36	3-STATE	1.6 mm	36		18 Bit	SRAM	9 Mbit	0.025 A	9437184 bit	Commercial	PARALLEL	COMMON		CACHE SRAM							2.3 V	SRAM				20 mm	14 mm
Mfr Part No GS842Z18CGB-250	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	7 Weeks			BGA-119	YES			119	5.5 ns		GSI Technology		250 MHz			84	GSI TECHNOLOGY	Parallel	GSI Technology	GS842Z18CGB-250	250 MHz			+ 70 C	SDR			0 C	Yes			SMD/SMT		262144 words	256000	70 °C			PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY		Active	BGA		NOT SPECIFIED	5.36	Compliant	Yes		3.6 V	2.3 V	2.5 V		NBT SRAM				Bulk	GS842Z18CGB			3A991.B.2.B	NBT Pipeline/Flow Through		85 °C	0 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant		119	R-PBGA-B119	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V					4 Mbit	2		SYNCHRONOUS		145 mA, 180 mA	5.5 ns				256 k x 18	3-STATE	1.99 mm	18		18 b	SRAM	4 Mb	0.025 A	4718592 bit		PARALLEL	COMMON		ZBT SRAM							2.3 V	SRAM				22 mm	14 mm	No
Mfr Part No GS842Z18CGB-100	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	7 Weeks			BGA-119	YES			119	12 ns		GSI Technology		100 MHz			84	GSI TECHNOLOGY	Parallel	GSI Technology	GS842Z18CGB-100	100 MHz			+ 70 C	SDR			0 C	Yes			SMD/SMT		262144 words	256000	70 °C			PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY		Active	BGA		NOT SPECIFIED	5.36	Details	Yes		3.6 V	2.3 V	2.5 V		NBT SRAM				Tray	GS842Z18CGB			3A991.B.2.B	NBT Pipeline/Flow Through				FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant		119	R-PBGA-B119	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V					4 Mbit			SYNCHRONOUS		110 mA, 110 mA	12 ns				256 k x 18	3-STATE	1.99 mm	18			SRAM		0.025 A	4718592 bit		PARALLEL	COMMON		ZBT SRAM							2.3 V	SRAM				22 mm	14 mm
Mfr Part No GS8320Z36AGT-200	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			TQFP-100	YES			100	6.5 ns		GSI Technology		200 MHz	SDR		18	GSI TECHNOLOGY	Parallel	GSI Technology	GS8320Z36AGT-200	200 MHz	153.8@Flow-Through/200@Pipelined MHz	2.7, 3.6 V	+ 70 C	SDR		2.3, 3 V	0 C	Yes		Surface Mount	SMD/SMT	36 Bit	1 MWords	1000000	85 °C			PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE		Active	QFP		NOT SPECIFIED	1.71	Details	Yes	TQFP	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V	Commercial grade	0 to 85 °C	Tray	GS8320Z36AGT			3A991.B.2.B	NBT Pipeline/Flow Through				IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE		Memory & Data Storage	CMOS		QUAD	GULL WING	NOT SPECIFIED	1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified	2.7 V	2.5/3.3 V	OTHER	2.3 V					36 Mbit	4		SYNCHRONOUS		205 mA, 240 mA	6.5 ns			Flow-Through/Pipelined	1 M x 36	3-STATE	1.6 mm	36		20 Bit	SRAM	36 Mbit	0.03 A	37748736 bit	Commercial	PARALLEL	COMMON		ZBT SRAM							2.3 V	SRAM				20 mm	14 mm
Mfr Part No GS816018BGT-200	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1					YES			100	6.5 ns				200 MHz				GSI TECHNOLOGY		GSI Technology	GS816018BGT-200										3				1048576 words	1000000	70 °C			PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE		Obsolete	QFP		NOT SPECIFIED	5.28	Compliant	Yes				2.5 V								e3	Yes	3A991.B.2.B		PURE MATTE TIN	70 °C	0 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	SRAMs	CMOS		QUAD	GULL WING	260	1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V						2		SYNCHRONOUS		0.23 mA					1MX18	3-STATE	1.6 mm	18		20 b		18 Mb	0.04 A	18874368 bit		PARALLEL	COMMON		CACHE SRAM							2.3 V					20 mm	14 mm	No
Mfr Part No GS8642Z72C-167I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-209	YES			209	8 ns		GSI Technology		167 MHz	SDR		14	GSI TECHNOLOGY	Parallel	GSI Technology	GS8642Z72C-167I	167 MHz	125@Flow-Through/167@Pipelined MHz	2.7, 3.6 V	+ 85 C	SDR		2.3, 3 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	72 Bit	1 MWords	1000000	85 °C	-40 °C		PLASTIC/EPOXY	LBGA	LBGA, BGA209,11X19,40	BGA209,11X19,40	RECTANGULAR	GRID ARRAY, LOW PROFILE		Active	BGA		NOT SPECIFIED	5.18	Compliant	No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS8642Z72C		No	3A991.B.2.B	NBT Pipeline/Flow Through		85 °C	-40 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant		209	R-PBGA-B209	Not Qualified	2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V					72 Mbit	8		SYNCHRONOUS		280 mA, 360 mA	8 ns			Flow-Through/Pipelined	1 M x 72	3-STATE	1.7 mm	72		20 Bit	SRAM	72 Mbit	0.12 A	75497472 bit	Industrial	PARALLEL	COMMON		ZBT SRAM							2.3 V	SRAM				22 mm	14 mm	No
Mfr Part No GS8322Z18AGB-150	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks			BGA-119	YES			119	7.5 ns		GSI Technology		150 MHz	SDR		14	GSI TECHNOLOGY	Parallel	GSI Technology	GS8322Z18AGB-150	150 MHz	133.3@Flow-Through/150@Pipelined MHz	2.7, 3.6 V	+ 70 C	SDR		2.3, 3 V	0 C	Yes	3	Surface Mount	SMD/SMT	18 Bit	2 MWords	2000000	70 °C			PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY		Active	BGA		NOT SPECIFIED	5.13	Compliant	Yes	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	NBT SRAM	2.5, 3.3 V	Commercial grade	0 to 85 °C	Bulk	GS8322Z18AGB	e1	Yes	3A991.B.2.B	NBT Pipeline/Flow Through	Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	0 °C	ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH	8542.32.00.41	Memory & Data Storage	CMOS		BOTTOM	BALL	260	1	1.27 mm	compliant		119	R-PBGA-B119	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V					36 Mbit	2		SYNCHRONOUS		175 mA, 190 mA	7.5 ns			Flow-Through/Pipelined	2 M x 18	3-STATE	1.99 mm	18		21 Bit	SRAM	36 Mbit	0.03 A	37748736 bit	Commercial	PARALLEL	COMMON		ZBT SRAM							2.3 V	SRAM				22 mm	14 mm	No
Mfr Part No GS816032BGT-200	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1					YES			100	6.5 ns				200 MHz				GSI TECHNOLOGY		GSI Technology	GS816032BGT-200										3				524288 words	512000	70 °C			PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE		Obsolete	QFP		NOT SPECIFIED	5.67		Yes				2.5 V								e3	Yes	3A991.B.2.B		PURE MATTE TIN			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	SRAMs	CMOS		QUAD	GULL WING	260	1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified	2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V								SYNCHRONOUS		0.255 mA					512KX32	3-STATE	1.6 mm	32						16777216 bit		PARALLEL	COMMON		CACHE SRAM							2.3 V					20 mm	14 mm

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