The category is 'Memory'
Memory (30)
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- Clock Frequency-Max (fCLK)
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- Power Supplies:
2.6 V
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Wavelength-dominant | Series | Size / Dimension | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Configuration | Max Supply Voltage | Min Supply Voltage | Number of Ports | Nominal Supply Current | Operating Mode | Voltage - Forward (Vf) (Typ) | Viewing Angle | Supply Current-Max | Current - Test | Access Time | Lens Style | Data Bus Width | Organization | Output Characteristics | Lens Size | Seated Height-Max | Memory Width | Address Bus Width | Density | Millicandela Rating | Standby Current-Max | Lens Transparency | Wavelength - Peak | Memory Density | Lens Color | Max Frequency | I/O Type | Memory IC Type | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Access Mode | Features | Self Refresh | Length | Width | Height (Max) | Radiation Hardening | Lead Free |
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![]() | Mfr Part No MT46V16M16FG-5B:F | Micron | Datasheet | - | - | Min: 1 Mult: 1 | YES | 60 | 0.7 ns | 200 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46V16M16FG-5B:F | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TBGA | (8 X 14) MM, PLASTIC, FBGA-60 | BGA60,9X12,40/32 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | 30 | 5.68 | No | 2.6 V | e0 | EAR99 | Tin/Lead/Silver (Sn/Pb/Ag) | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | BOTTOM | BALL | 235 | 1 | 1 mm | unknown | 60 | R-PBGA-B60 | Not Qualified | 2.7 V | 2.6 V | COMMERCIAL | 2.5 V | 1 | SYNCHRONOUS | 0.51 mA | 16MX16 | 3-STATE | 1.2 mm | 16 | 0.004 A | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 14 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K4H511638D-UCCC | Samsung | Datasheet | 21 | - | Min: 1 Mult: 1 | YES | 66 | 0.65 ns | 200 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4H511638D-UCCC | 3 | 33554432 words | 32000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | NOT SPECIFIED | 5.81 | Yes | 2.6 V | e6 | Yes | Tin/Bismuth (Sn97Bi3) | DRAMs | CMOS | DUAL | GULL WING | 260 | 0.635 mm | unknown | R-PDSO-G66 | Not Qualified | 2.6 V | COMMERCIAL | 0.4 mA | 32MX16 | 3-STATE | 16 | 0.005 A | 536870912 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W9425G6JH-4 | Winbond | Datasheet | 4147 | - | Min: 1 Mult: 1 | YES | 66 | 0.7 ns | 250 MHz | WINBOND ELECTRONICS CORP | Winbond Electronics Corp | W9425G6JH-4 | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | NOT SPECIFIED | 5.18 | Yes | 2.5 V | EAR99 | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | unknown | 66 | R-PDSO-G66 | Not Qualified | 2.7 V | 2.6 V | COMMERCIAL | 2.4 V | 1 | SYNCHRONOUS | 0.21 mA | 16MX16 | 3-STATE | 1.2 mm | 16 | 0.005 A | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT46V16M16P-5BIT:F | Micron | Datasheet | 439 | - | Min: 1 Mult: 1 | YES | 66 | 0.7 ns | 200 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46V16M16P-5BIT:F | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP | 30 | 8.42 | Yes | 2.6 V | e3 | EAR99 | Matte Tin (Sn) | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | unknown | 66 | R-PDSO-G66 | Not Qualified | 2.7 V | 2.6 V | INDUSTRIAL | 2.5 V | 1 | SYNCHRONOUS | 0.51 mA | 16MX16 | 3-STATE | 1.2 mm | 16 | 0.004 A | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K4H510838C-UCCC | Samsung | Datasheet | 3936 | - | Min: 1 Mult: 1 | YES | 66 | 0.65 ns | 200 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4H510838C-UCCC | 3 | 67108864 words | 64000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | NOT SPECIFIED | 5.8 | Yes | 2.6 V | e6 | Yes | Tin/Bismuth (Sn97Bi3) | DRAMs | CMOS | DUAL | GULL WING | 260 | 0.635 mm | unknown | R-PDSO-G66 | Not Qualified | 2.6 V | COMMERCIAL | 64MX8 | 3-STATE | 8 | 0.005 A | 536870912 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT46V16M16P-5B:F | Micron | Datasheet | - | - | Min: 1 Mult: 1 | YES | 66 | 0.7 ns | 200 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46V16M16P-5B:F | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP | 30 | 8.35 | Yes | 2.6 V | e3 | Yes | EAR99 | Matte Tin (Sn) | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | unknown | 66 | R-PDSO-G66 | Not Qualified | 2.7 V | 2.6 V | COMMERCIAL | 2.5 V | 1 | SYNCHRONOUS | 0.51 mA | 16MX16 | 3-STATE | 1.2 mm | 16 | 0.004 A | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT46V16M16TG-6T:C | Micron | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 66 | 66 | 0.7 ns | 167 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46V16M16TG-6T:C | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | 0.400 INCH, PLASTIC, TSOP-66 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | 30 | 8.57 | Compliant | No | 2.5 V | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | DUAL | GULL WING | 235 | 1 | 0.65 mm | unknown | 66 | R-PDSO-G66 | Not Qualified | 2.5 V | 2.7 V | 2.6 V | COMMERCIAL | 2.3 V | 2.7 V | 2.3 V | 1 | 410 mA | SYNCHRONOUS | 700 ps | 16 b | 16MX16 | 3-STATE | 1.2 mm | 16 | 15 b | 256 Mb | 268435456 bit | 333 MHz | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No MT46V16M16TG-5B IT K | Micron Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 2-SMD, Flat Lead | YES | 66 | SMD | 66 | 0.7 ns | 200 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46V16M16TG-5BIT:K | OSRAM Opto (ams OSRAM) | 16777216 words | 16000000 | 85 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | TSSOP | 0.40 INCH, PLASTIC, TSOP-66 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP | Obsolete | 30 | 5.68 | Compliant | No | 2.6 V | - | PointLED® | 3.40mm L x 1.90mm W | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | - | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | DUAL | GULL WING | 235 | 1 | 0.65 mm | unknown | 66 | R-PDSO-G66 | Not Qualified | 2.5 V | 2.7 V | 2.6 V | INDUSTRIAL | 2.5 V | - | 2.7 V | 2.5 V | 1 | 290 mA | SYNCHRONOUS | - | - | 0.29 mA | - | 700 ps | - | 16 b | 16MX16 | 3-STATE | - | 1.2 mm | 16 | 15 b | 256 Mb | - | 0.004 A | - | - | 268435456 bit | - | 400 MHz | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | - | YES | 22.22 mm | 10.16 mm | 0.87mm | No | ||||
![]() | Mfr Part No K4H560838H-ZCCC | Samsung | Datasheet | - | - | Min: 1 Mult: 1 | YES | 60 | 200 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4H560838H-ZCCC | 3 | 33554432 words | 32000000 | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA60,9X12,40/32 | BGA60,9X12,40/32 | RECTANGULAR | GRID ARRAY | Obsolete | NOT SPECIFIED | 5.84 | Yes | 2.6 V | e1 | Yes | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | DRAMs | CMOS | BOTTOM | BALL | 260 | 0.8 mm | unknown | R-PBGA-B60 | Not Qualified | 2.6 V | COMMERCIAL | 0.3 mA | 32MX8 | 3-STATE | 8 | 0.004 A | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT46V16M16P5BITK | Micron Technology | Datasheet | 4 | - | Min: 1 Mult: 1 | Surface Mount | YES | 66 | 66 | 0.7 ns | 200 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46V16M16P-5BIT:K | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP | 30 | 5.6 | Compliant | Yes | 2.6 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 85 °C | -40 °C | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 66 | R-PDSO-G66 | Not Qualified | 2.5 V | 2.7 V | 2.6 V | INDUSTRIAL | 2.5 V | 2.7 V | 2.5 V | 1 | 290 mA | SYNCHRONOUS | 0.29 mA | 700 ps | 16 b | 16MX16 | 3-STATE | 1.2 mm | 16 | 15 b | 256 Mb | 0.004 A | 268435456 bit | 400 MHz | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | No | Lead Free | |||||||||||||||||||||||||
![]() | Mfr Part No K4H561638F-UCCC | Samsung | Datasheet | 1734 | - | Min: 1 Mult: 1 | YES | 66 | 200 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4H561638F-UCCC | 3 | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | NOT SPECIFIED | 5.81 | Yes | 2.6 V | Yes | DRAMs | CMOS | DUAL | GULL WING | 260 | 0.635 mm | compliant | R-PDSO-G66 | Not Qualified | 2.6 V | COMMERCIAL | 0.38 mA | 16MX16 | 3-STATE | 16 | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT46V16M16P-5B:K | Micron | Datasheet | 12800 | - | Min: 1 Mult: 1 | YES | 66 | 0.7 ns | 200 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46V16M16P-5B:K | 3 | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP | 30 | 5.58 | Yes | 2.6 V | e3 | Yes | EAR99 | Matte Tin (Sn) | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 66 | R-PDSO-G66 | Not Qualified | 2.7 V | 2.6 V | COMMERCIAL | 2.5 V | 1 | SYNCHRONOUS | 0.29 mA | 16MX16 | 3-STATE | 1.2 mm | 16 | 0.004 A | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT46V32M8TG-5B:K | Micron | Datasheet | 14 | - | Min: 1 Mult: 1 | YES | 66 | 0.7 ns | 200 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46V32M8TG-5B:K | 33554432 words | 32000000 | 70 °C | PLASTIC/EPOXY | TSSOP | 0.40 INCH, PLASTIC, TSOP-66 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP | 30 | 5.62 | No | 2.6 V | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | DUAL | GULL WING | 235 | 1 | 0.65 mm | unknown | 66 | R-PDSO-G66 | Not Qualified | 2.7 V | 2.6 V | COMMERCIAL | 2.5 V | 1 | SYNCHRONOUS | 0.29 mA | 32MX8 | 3-STATE | 1.2 mm | 8 | 0.004 A | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K4H511638C-UCCC | Samsung | Datasheet | 4304 | - | Min: 1 Mult: 1 | YES | 66 | 0.65 ns | 200 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4H511638C-UCCC | 3 | 33554432 words | 32000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | NOT SPECIFIED | 5.81 | Yes | 2.6 V | e6 | Yes | Tin/Bismuth (Sn97Bi3) | DRAMs | CMOS | DUAL | GULL WING | 260 | 0.635 mm | unknown | R-PDSO-G66 | Not Qualified | 2.6 V | COMMERCIAL | 0.4 mA | 32MX16 | 3-STATE | 16 | 0.005 A | 536870912 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K4H511638B-UCCC | Samsung | Datasheet | - | - | Min: 1 Mult: 1 | YES | 66 | 0.65 ns | 200 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4H511638B-UCCC | 3 | 33554432 words | 32000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | NOT SPECIFIED | 5.84 | Yes | 2.6 V | Yes | AUTO/SELF REFRESH | DRAMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | R-PDSO-G66 | Not Qualified | 2.7 V | 2.6 V | COMMERCIAL | 2.5 V | 1 | SYNCHRONOUS | 32MX16 | 3-STATE | 1.2 mm | 16 | 0.005 A | 536870912 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT46V16M16TG-5B:K | Micron | Datasheet | 1941 | - | Min: 1 Mult: 1 | YES | 66 | 0.7 ns | 200 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46V16M16TG-5B:K | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TSSOP | 0.40 INCH, PLASTIC, TSOP-66 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP | 30 | 5.62 | No | 2.6 V | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | DUAL | GULL WING | 235 | 1 | 0.65 mm | unknown | 66 | R-PDSO-G66 | Not Qualified | 2.7 V | 2.6 V | COMMERCIAL | 2.5 V | 1 | SYNCHRONOUS | 0.29 mA | 16MX16 | 3-STATE | 1.2 mm | 16 | 0.004 A | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT46V16M16FG-6IT:F | Micron | Datasheet | - | - | Min: 1 Mult: 1 | YES | 60 | 0.7 ns | 167 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46V16M16FG-6IT:F | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | (8 X 14) MM, PLASTIC, FBGA-60 | BGA60,9X12,40/32 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | 30 | 5.68 | No | 2.5 V | e0 | EAR99 | Tin/Lead/Silver (Sn/Pb/Ag) | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | BOTTOM | BALL | 235 | 1 | 1 mm | unknown | 60 | R-PBGA-B60 | Not Qualified | 2.7 V | 2.6 V | INDUSTRIAL | 2.3 V | 1 | SYNCHRONOUS | 0.44 mA | 16MX16 | 3-STATE | 1.2 mm | 16 | 0.004 A | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 14 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT46V32M8P-5B:K | Micron | Datasheet | 8 | - | Min: 1 Mult: 1 | YES | 66 | 0.7 ns | 200 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46V32M8P-5B:K | 3 | 33554432 words | 32000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP | 30 | 8.37 | Yes | 2.6 V | e3 | Yes | EAR99 | Matte Tin (Sn) | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 66 | R-PDSO-G66 | Not Qualified | 2.7 V | 2.6 V | COMMERCIAL | 2.5 V | 1 | SYNCHRONOUS | 0.29 mA | 32MX8 | 3-STATE | 1.2 mm | 8 | 0.004 A | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT46V64M4CY-5B:K | Micron | Datasheet | - | - | Min: 1 Mult: 1 | YES | 60 | 0.7 ns | 200 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46V64M4CY-5B:K | 67108864 words | 64000000 | 70 °C | PLASTIC/EPOXY | TBGA | TBGA, BGA60,9X12,40/32 | BGA60,9X12,40/32 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Obsolete | BGA | 30 | 5.62 | Yes | 2.6 V | e1 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | unknown | 60 | R-PBGA-B60 | Not Qualified | 2.7 V | 2.6 V | COMMERCIAL | 2.5 V | 1 | SYNCHRONOUS | 0.29 mA | 64MX4 | 3-STATE | 1.2 mm | 4 | 0.004 A | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 12.5 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K4H1G0838A-UCCC | Samsung | Datasheet | - | - | Min: 1 Mult: 1 | YES | 66 | 0.65 ns | 200 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4H1G0838A-UCCC | 1 | 134217728 words | 128000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | NOT SPECIFIED | 5.84 | Non-Compliant | Yes | 2.6 V | e3 | Yes | MATTE TIN | DRAMs | CMOS | DUAL | GULL WING | 225 | 0.635 mm | compliant | 200 MHz | R-PDSO-G66 | Not Qualified | 2.6 V | COMMERCIAL | 0.25 mA | 128MX8 | 3-STATE | 8 | 0.015 A | 1073741824 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | Lead Free |
MT46V16M16FG-5B:F
Micron
Package:Memory
Price: please inquire
K4H511638D-UCCC
Samsung
Package:Memory
Price: please inquire
W9425G6JH-4
Winbond
Package:Memory
Price: please inquire
MT46V16M16P-5BIT:F
Micron
Package:Memory
Price: please inquire
K4H510838C-UCCC
Samsung
Package:Memory
Price: please inquire
MT46V16M16P-5B:F
Micron
Package:Memory
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MT46V16M16TG-6T:C
Micron
Package:Memory
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MT46V16M16TG-5B IT K
Micron Technology
Package:Memory
Price: please inquire
K4H560838H-ZCCC
Samsung
Package:Memory
Price: please inquire
MT46V16M16P5BITK
Micron Technology
Package:Memory
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K4H561638F-UCCC
Samsung
Package:Memory
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MT46V16M16P-5B:K
Micron
Package:Memory
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MT46V32M8TG-5B:K
Micron
Package:Memory
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K4H511638C-UCCC
Samsung
Package:Memory
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K4H511638B-UCCC
Samsung
Package:Memory
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MT46V16M16TG-5B:K
Micron
Package:Memory
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MT46V16M16FG-6IT:F
Micron
Package:Memory
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MT46V32M8P-5B:K
Micron
Package:Memory
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MT46V64M4CY-5B:K
Micron
Package:Memory
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K4H1G0838A-UCCC
Samsung
Package:Memory
Price: please inquire
