The category is 'Memory'
Memory (368)
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3/5 V
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Active Read Current - Max | Bandwidth-Nom | Base Product Number | Clock Frequency-Max (fCLK) | Country of Origin | Data Retention | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Package Code | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of Words | Number of Words Code | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Part Package Code | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Supply Voltage-Nom (Vsup) | Temperature Coefficient-Nom | Total Resistance-Nom | Unit Weight | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Number of Terminations | ECCN Code | Temperature Coefficient | Resistance | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Power (Watts) | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Qualification Status | Brand Name | Operating Supply Voltage | Failure Rate | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Nominal Supply Current | Operating Mode | Supply Current-Max | Access Time | Organization | Converter Type | Seated Height-Max | Memory Width | Density | Standby Current-Max | Memory Density | Inductance Tolerance | RMS Current (Irms) | Max Frequency | Access Time (Max) | Parallel/Serial | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Resistor Terminal Voltage-Max | Alternate Memory Width | I2C Control Byte | Resistance Law | Control Interface | Features | Supply Current | Product Length | Product Width | Height | Height Seated (Max) | Length | Width | Radiation Hardening | Lead Free | Ratings |
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 | Mfr Part No 24LC128T-I/SNG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 24LC128T-I/SNG | 1 | 16384 words | 16000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | ROHS COMPLIANT, PLASTIC, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | 40 | 5.12 | Yes | 4.5 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.003 mA | 16KX8 | 1.75 mm | 8 | 0.000001 A | 131072 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CAT25256XE-T2 | ON Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks, 1 Day | YES | 8 | 10 MHz | ON SEMICONDUCTOR | ON Semiconductor | 751BE | CAT25256XE-T2 | 3 | 32768 words | 32000 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | 0.208 INCH, HALOGEN FREE AND ROHS COMPLIANT, SOIC-8 | SOP8,.3 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | 40 | 5.61 | Yes | 5 V | e3 | Yes | EAR99 | Tin (Sn) | 100 YEAR DATA RETENTION | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | ON Semiconductor | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | Serial (SPI) | SYNCHRONOUS | 0.004 mA | 32KX8 | 2.03 mm | 8 | 0.000003 A | 256 | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE/SOFTWARE | 5.255 mm | 5.23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BR35H640FVT-WCE2 | ROHM Semiconductor | Datasheet | 1507 | - | Min: 1 Mult: 1 | YES | 8 | 5 MHz | 40 | ROHM CO LTD | Serial (SPI) | ROHM Semiconductor | BR35H640FVT-WCE2 | Surface Mount | 8192 words | 8000 | 5.5(V) | 2.5(V) | 3.3/5(V) | -40C to 125C | 125C | -40C | Automotive | 125 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | TSSOP-B | Obsolete | SOIC | Yes | No | NOT SPECIFIED | 8.61 | Yes | 5 V | Tape and Reel | Yes | EAR99 | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 5(MHz) | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 0.0055 mA | 8Kx8 | 1.2 mm | 8 | 65536(Bit) | 0.00001 A | 65536 bit | 70(ns) | SERIAL | EEPROM | 2.5 TO 5.5 | SPI | 300000 Write/Erase Cycles | 20 | No | 5.5(mA) | 4.4 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IS24C08A-3P | Integrated Silicon Solution, Inc. (ISSI) | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 1 MHz | INTEGRATED SILICON SOLUTION INC | IS24C08A-3P | 3 | 1024 words | 1000 | 70 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | NOT SPECIFIED | 5.65 | No | 5 V | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | unknown | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 3/5 V | COMMERCIAL | 2.5 V | SYNCHRONOUS | 0.003 mA | 1KX8 | 4.57 mm | 8 | 0.000002 A | 8192 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE | 1010DMMR | 9.325 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IS93C46A-3PLI | Integrated Silicon Solution, Inc. (ISSI) | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 1 MHz | INTEGRATED SILICON SOLUTION INC | IS93C46A-3PLI | 3 | 64 words | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | 40 | 5.83 | Yes | 2.7 V | e3 | Yes | EAR99 | Matte Tin (Sn) - annealed | 8542.32.00.51 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.003 mA | 64X16 | 4.572 mm | 16 | 0.000002 A | 1024 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 10 ms | 40 | SOFTWARE | 8 | 9.3218 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IS93C46B-3PI | Integrated Silicon Solution, Inc. (ISSI) | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 1 MHz | INTEGRATED SILICON SOLUTION INC | IS93C46B-3PI | 3 | 64 words | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | NOT SPECIFIED | 5.91 | No | 2.7 V | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | unknown | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.003 mA | 64X16 | 4.57 mm | 16 | 0.000002 A | 1024 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 10 ms | 40 | SOFTWARE | 9.325 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BR93C46-WMN7TP | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 2 mA | 2 MHz | 40 Year | 2500 | ROHM CO LTD | 3-Wire, Microwire | BR93C46-WMN7TP | 2 MHz | + 105 C | - 40 C | SMD/SMT | 1024 words | 1000 | 105 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 10 | 7.9 | Details | Yes | 5.5 V | 2.5 V | 5 V | 0.005044 oz | MouseReel | e3/e2 | Yes | EAR99 | TIN/TIN COPPER | 8542.32.00.51 | CMOS | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 3.3 V, 5 V | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | 1 kbit | 2 mA | SYNCHRONOUS | 2 mA | 200 ns | 64 x 16 | 1.75 mm | 1 | 0.000005 A | 1024 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | SOFTWARE | 1.5 mm (Max) | 5 mm (Max) | 4 mm (Max) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 93LC46C-I/MSG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 2 MHz | MICROCHIP TECHNOLOGY INC | 93LC46C-I/MSG | 1 | 64 words | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.19 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | MSOP | 40 | 5.05 | Yes | 3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.002 mA | 64X16 | 1.1 mm | 16 | 0.000001 A | 1024 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 8 | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M93C46-WBN3P/S | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 2 MHz | STMICROELECTRONICS | M93C46-WBN3P/S | 64 words | 64 | 125 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | NOT SPECIFIED | 5.7 | Yes | 5 V | e3 | EAR99 | Tin (Sn) | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 0.002 mA | 64X16 | 5.33 mm | 16 | 0.000005 A | 1024 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | SOFTWARE | 8 | 9.27 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M95640-WMN3P | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 10 MHz | STMICROELECTRONICS | M95640-WMN3P | 1 | 8192 words | 8000 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | 40 | 5.09 | Yes | 5 V | e4 | Yes | Nickel/Palladium/Gold (Ni/Pd/Au) | 1 MILLION ERASE/WRITE CYCLES; 40 YEARS DATA RETENTION | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 0.003 mA | 8KX8 | 1.75 mm | 8 | 0.000002 A | 65536 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 24FC128-I/MSG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 1 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 24FC128-I/MSG | 1 | 16384 words | 16000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | ROHS COMPLIANT, PLASTIC, MSOP-8 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | MSOP | 40 | 5.39 | Yes | 2.5 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.003 mA | 16KX8 | 1.1 mm | 8 | 0.000001 A | 131072 bit | 20 | 12 A | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010DDDR | 17.2 | 16.85 mm | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 93LC46CT-I/STG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 2 MHz | US | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 93LC46CT-I/STG | 1 | 64 words | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | SOIC | 40 | 5.07 | Yes | 3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.002 mA | 64X16 | 1.2 mm | 16 | 0.000001 A | 1024 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 8 | 4.4 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AT24C08A-10PU-2.7 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | NO | 8 | 8 | 0.4 MHz | ATMEL CORP | Atmel Corporation | AT24C08A-10PU-2.7 | 1 | 1024 words | 1000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | NOT SPECIFIED | 5.67 | Compliant | Yes | 3 V | e3 | EAR99 | Matte Tin (Sn) | 85 °C | -40 °C | DATA RETENTION 100 YEARS; 1 MILLION ENDURANCE WRITE CYCLES | 8542.32.00.51 | EEPROMs | CMOS | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | unknown | 400 kHz | 8 | R-PDIP-T8 | Not Qualified | 5 V | 5.5 V | 3/5 V | INDUSTRIAL | 2.7 V | 2-Wire, Serial | 5.5 V | 2.7 V | 1 kB | 3 mA | SYNCHRONOUS | 0.003 mA | 900 ns | 1KX8 | 5.334 mm | 8 | 8 kb | 0.000004 A | 8192 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE | 1010DMMR | 9.271 mm | 7.62 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCP4642-103E/MF | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 0402 (1005 Metric) | YES | 0402 | 10 | 1 kHz | RS73G1ERT | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | MCP4642-103E/MF | KOA Speer Electronics, Inc. | 1 | 125 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | HVSON | HVSON, SOLCC10,.12,20 | SOLCC10,.12,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | Active | 40 | 5.36 | Yes | 2.7 V | 150 ppm/°C | 10000 Ω | -55°C ~ 155°C | RS73-RT | 0.039 L x 0.020 W (1.00mm x 0.50mm) | ±1% | e3 | Yes | 2 | EAR99 | ±50ppm/°C | 1.78 kOhms | 129 | Matte Tin (Sn) | Thick Film | 0.125W, 1/8W | NON-VOLATILE MEMORY | 8542.39.00.01 | Digital Potentiometers | CMOS | DUAL | NO LEAD | 260 | 2 | 0.5 mm | compliant | 10 | S-PDSO-N10 | Not Qualified | - | 3/5 V | AUTOMOTIVE | DIGITAL POTENTIOMETER | 1 mm | 5.5 V | LINEAR | INCREMENT/DECREMENT | Automotive AEC-Q200 | 0.016 (0.40mm) | 3 mm | 3 mm | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 24LC04BH-E/MNY | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24LC04BH-E/MNY | 256 words | 256 | 125 °C | -40 °C | PLASTIC/EPOXY | VSON | 2 X 3 MM, PLASTIC, TDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE | Active | DFN | 5.35 | Yes | e4 | EAR99 | NICKEL PALLADIUM GOLD | 8542.32.00.51 | DUAL | NO LEAD | 1 | 0.5 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 0.003 mA | 256X8 | 0.8 mm | 8 | 0.000005 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010XXMR | 3 mm | 2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 24LC16B-E/MNY | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 8 | 0.4 MHz | MICROCHIP TECHNOLOGY INC | 24LC16B-E/MNY | 1 | 2048 words | 2000 | 125 °C | -40 °C | PLASTIC/EPOXY | VSSOP | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | Active | DFN | 40 | 5.12 | Compliant | Yes | 5 V | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 125 °C | -40 °C | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5 V | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | I2C, Serial | 5.5 V | 2.5 V | 2 kB | SYNCHRONOUS | 0.003 mA | 900 ns | 2KX8 | 0.8 mm | 8 | 16 kb | 0.000005 A | 16384 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 1010MMMR | 3 mm | 2 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AT24C04A-10PU-2.7 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 8 | 0.4 MHz | ATMEL CORP | AT24C04A-10PU-2.7 | 1 | 512 words | 512 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, GREEN, PLASTIC, MS-001BA, DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | NOT SPECIFIED | 5.67 | Compliant | Yes | 3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 85 °C | -40 °C | DATA RETENTION 100 YEARS; 1 MILLION ENDURANCE WRITE CYCLES | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | unknown | 400 kHz | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.7 V | 2-Wire | 5.5 V | 2.7 V | 512 B | SYNCHRONOUS | 0.003 mA | 900 ns | 512X8 | 5.334 mm | 8 | 0.000004 A | 4096 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE | 1010DDMR | 9.271 mm | 7.62 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M95010-WDW3P | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 5 MHz | STMICROELECTRONICS | M95010-WDW3P | 1 | 128 words | 128 | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | SOIC | 30 | 5.72 | Yes | 3.3 V | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 0.002 mA | 128X8 | 1.2 mm | 8 | 0.000002 A | 1024 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE/SOFTWARE | 4.4 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M24C08-WDW6P | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | 25 Weeks, 5 Days | YES | 8 | 0.4 MHz | STMICROELECTRONICS | M24C08-WDW6P | 1024 words | 1000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Not Recommended | SOIC | NOT SPECIFIED | 5.33 | Compliant | Yes | 5 V | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 85 °C | -40 °C | 8542.32.00.51 | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | I2C, Serial | SYNCHRONOUS | 0.002 mA | 900 ns | 1KX8 | 1.2 mm | 8 | 8 kb | 0.000001 A | 8192 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE | 1010DMMR | 4.4 mm | 3 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M24C08-WMN6TG | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | STMICROELECTRONICS | M24C08-WMN6TG | 1 | 1024 words | 1000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Not Recommended | SOIC | 30 | 5.33 | Yes | 5 V | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.002 mA | 1KX8 | 1.75 mm | 8 | 0.000001 A | 8192 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE | 1010DMMR | 4.9 mm | 3.9 mm |
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