The category is 'Memory'
Memory (1)
- All Manufacturers
- Applications
- Backshell Material, Plating
- Cable Opening
- Clock Frequency-Max (fCLK)
- Color
- Connector Type
- Contact Finish Mating
- Contact Finish Thickness - Mating
- Contact Materials
- Current Rating (Amps)
- ECCN Code
- Series
- Series:
2B
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Surface Mount | Mounting Feature | Shell Material | Insert Material | Number of Terminals | Backshell Material, Plating | Clock Frequency-Max (fCLK) | Contact Finish Mating | Contact Materials | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Mfr | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Nom (Vsup) | Voltage, Rating | Operating Temperature | Series | Pbfree Code | Termination | ECCN Code | Connector Type | Number of Positions | Color | Applications | HTS Code | Fastening Type | Subcategory | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Number of Functions | Ingress Protection | Terminal Pitch | Reach Compliance Code | Shell Finish | Pin Count | Shell Size - Insert | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Shell Size, MIL | Supply Current-Max | Cable Opening | Organization | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | Memory IC Type | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Features | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating |
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 | Mfr Part No BR93C56-WDW6TP | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | - | YES | - | - | Polyetheretherketone (PEEK) | 8 | - | 2 MHz | Gold | Bronze | ROHM CO LTD | ROHM Semiconductor | BR93C56-WDW6TP | LEMO | 512 words | 512 | 85 °C | -40 °C | Bulk | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | SQUARE | SMALL OUTLINE | Obsolete | TSSOP | Metal | Active | NOT SPECIFIED | 5.79 | Yes | 5 V | - | -55°C ~ 250°C | 2B | Yes | Crimp | EAR99 | Insert, Female Sockets | 14 | - | - | 8542.32.00.51 | Push-Pull | EEPROMs | - | CMOS | DUAL | G | GULL WING | Shielded | NOT SPECIFIED | 1 | IP50 - Dust Protected | 0.65 mm | compliant | - | 8 | 514 | S-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | - | 0.002 mA | - | 512X4 | 1.2 mm | 4 | 0.000005 A | 2048 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | SOFTWARE | Insert Only, Requires Shell | 4.4 mm | 3 mm | - | UL94 V-0 |