The category is 'Memory'
Memory (2)
- All Manufacturers
- Applications
- Backshell Material, Plating
- Base Product Number
- Cable Opening
- Color
- Connector Type
- Contact Finish Mating
- Contact Finish Thickness - Mating
- Contact Materials
- Current Rating (Amps)
- Features
- Series
- Series:
BACC63
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Backshell Material, Plating | Base Product Number | Clock Frequency-Max (fCLK) | Contact Finish Mating | Contact Materials | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Mfr | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Nom (Vsup) | Voltage, Rating | Operating Temperature | Series | JESD-609 Code | Pbfree Code | Termination | ECCN Code | Connector Type | Number of Positions | Terminal Finish | Color | Applications | HTS Code | Fastening Type | Subcategory | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Number of Functions | Ingress Protection | Terminal Pitch | Reach Compliance Code | Shell Finish | Pin Count | Shell Size - Insert | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Operating Mode | Shell Size, MIL | Supply Current-Max | Cable Opening | Access Time | Memory Format | Memory Interface | Organization | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Standby Current-Max | Memory Density | Parallel/Serial | Memory IC Type | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Features | Memory Organization | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating |
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 | Mfr Part No BR93C46-DW6TP | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | YES | - | Composite | - | 8 | - | BACC63CT19 | 2 MHz | Gold | Copper Alloy | ROHM CO LTD | ROHM Semiconductor | BR93C46-DW6TP | Amphenol Aerospace Operations | 1024 words | 1000 | 85 °C | -40 °C | Bulk | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | Composite | Active | 10 | 5.78 | Yes | 5 V | - | -65°C ~ 175°C | BACC63 | e3/e2 | Yes | Crimp | EAR99 | Plug, Female Sockets | 66 | TIN/TIN COPPER | Olive Drab | - | 8542.32.00.51 | Threaded | EEPROMs | - | CMOS | DUAL | A | GULL WING | - | 260 | 1 | - | 0.65 mm | compliant | Olive Drab Cadmium | 8 | 19-35 | R-PDSO-G8 | Not Qualified | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | - | 0.002 mA | - | 1KX1 | 1.2 mm | 1 | 0.000015 A | 1024 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | SOFTWARE | Coupling Nut | 4.4 mm | 3 mm | 50.0µin (1.27µm) | - | |||||||||||
| Mfr Part No STK11C68-SF45TR | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | 28-SOIC (0.342, 8.69mm Width) | Flange | Composite | 28-SOIC | - | - | BACC63CU21 | Gold | Copper Alloy | Non-Volatile | Amphenol Aerospace Operations | Bulk | Composite | Active | - | -65°C ~ 200°C | BACC63 | Crimp | Receptacle, Female Sockets | 16 | Silver | - | Threaded | - | NVSRAM (Non-Volatile SRAM) | 4.5V ~ 5.5V | A | - | - | Nickel | 21-16 | 64Kbit | - | - | 45 ns | NVSRAM | Parallel | 45ns | - | 8K x 8 | 50.0µin (1.27µm) | - |