The category is 'Memory'
Memory (3)
- All Manufacturers
- Access Time-Max
- Additional Feature
- Address Bus Width
- Architecture
- Brand
- Data Rate Architecture
- Density
- ECCN Code
- Factory Lead Time
- Factory Pack QuantityFactory Pack Quantity
- Ihs Manufacturer
- Series
- Series:
GS81302Q18GE
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Access Time-Max | Base Product Number | Brand | Data Rate Architecture | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Architecture | Organization | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Product Type | Density | Memory Density | Screening Level | Parallel/Serial | Memory IC Type | Product Category | Memory Organization | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No GS81302Q18GE-250 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-165 | YES | 165 | 0.45 ns | GSI Technology | QDR | 10 | GSI TECHNOLOGY | Parallel | GSI Technology | GS81302Q18GE-250 | 250 MHz | 250 MHz | + 70 C | QDR-II | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 18 Bit | 8 MWords | 8000000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Not Recommended | BGA | NOT SPECIFIED | 7.61 | Details | Yes | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II | 1.8000 V | Commercial grade | 0 to 85 °C | Tray | GS81302Q18GE | e1 | Yes | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | COMMERCIAL | 1.7 V | 144 Mbit | 2 | SYNCHRONOUS | 1.06 A | 450 ps | Pipelined | 8 M x 18 | 1.5 mm | 18 | 22 Bit | SRAM | 144 Mbit | 150994944 bit | Commercial | PARALLEL | DDR SRAM | SRAM | 17 mm | 15 mm | ||||||||||||||||
| Mfr Part No GS81302Q18GE-300 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | BGA-165 | YES | 165 | 0.45 ns | GSI Technology | QDR | 10 | GSI TECHNOLOGY | Parallel | GSI Technology | GS81302Q18GE-300 | 300 MHz | 300 MHz | 1.9 V | + 70 C | QDR-II | 1.7 V | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 18 Bit | 8 MWords | 8000000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Not Recommended | BGA | NOT SPECIFIED | 5.05 | Details | Yes | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II | 1.8000 V | Commercial grade | 0 to 85 °C | Tray | GS81302Q18GE | e1 | Yes | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | COMMERCIAL | 1.7 V | 144 Mbit | 2 | SYNCHRONOUS | 1.25 A | Pipelined | 8 M x 18 | 1.5 mm | 18 | 22 Bit | SRAM | 144 Mbit | 150994944 bit | Commercial | PARALLEL | DDR SRAM | SRAM | 17 mm | 15 mm | |||||||||||||||
| Mfr Part No GS81302Q18GE-300I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | BGA-165 | YES | 165-FPBGA (15x17) | 165 | 0.45 ns | GS81302Q18 | GSI Technology | QDR | 10 | GSI TECHNOLOGY | Parallel | GSI Technology | GS81302Q18GE-300I | 300 MHz | 300 MHz | + 85 C | QDR-II | GSI Technology Inc. | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 18 Bit | 8 MWords | 8000000 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Not Recommended | BGA | Active | NOT SPECIFIED | 5.06 | Details | Yes | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaQuad-II | 1.8000 V | Industrial grade | -40 to 100 °C | Tray | GS81302Q18GE | e1 | Yes | 3A991.B.2.B | SigmaQuad-II | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED ARCHITECTURE | 8542.32.00.41 | Memory & Data Storage | SRAM - Quad Port, Synchronous | 1.7V ~ 1.9V | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | INDUSTRIAL | 1.7 V | 144 Mbit | 2 | SYNCHRONOUS | 300 MHz | 1.26 A | SRAM | Parallel | Pipelined | 8 M x 18 | 1.5 mm | 18 | - | 22 Bit | SRAM | 144 Mbit | 150994944 bit | Industrial | PARALLEL | DDR SRAM | SRAM | 8M x 18 | 17 mm | 15 mm |