The category is 'Memory'
Memory (3)
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- ECCN Code
- HTS Code
- Ihs Manufacturer
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- JESD-30 Code
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- Series:
GS81313LD36GK
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Number of Terminals | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Memory Types | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of Words | Number of Words Code | Operating Temperature-Max | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Tradename | Packaging | Series | ECCN Code | Type | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Operating Mode | Supply Current-Max | Organization | Seated Height-Max | Memory Width | Memory Density | Parallel/Serial | Memory IC Type | Length | Width |
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 | Mfr Part No GS81313LD36GK-833 | GSI | Datasheet | - | - | Min: 1 Mult: 1 | BGA-260 | YES | 260 | GSI TECHNOLOGY | Parallel | GSI Technology | GS81313LD36GK-833 | 833 MHz | + 85 C | 0 C | SMD/SMT | 4194304 words | 4000000 | 85 °C | PLASTIC/EPOXY | BGA | BGA, | RECTANGULAR | GRID ARRAY | Active | NOT SPECIFIED | 5.75 | Yes | 1.35 V | 1.2 V | 1.25 V | GS81313LD36GK | 3A991.B.2.B | 8542.32.00.41 | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | R-PBGA-B260 | 1.35 V | OTHER | 1.2 V | 144 Mbit | SYNCHRONOUS | 2.55 A | 4 M x 36 | 2.3 mm | 36 | 150994944 bit | PARALLEL | DDR SRAM | 22 mm | 14 mm | ||||||||
| Mfr Part No GS81313LD36GK-833I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-260 | YES | 260 | 10 | GSI TECHNOLOGY | Parallel | GS81313LD36GK-833I | 833 MHz | + 100 C | DDR | - 40 C | Yes | SMD/SMT | 4194304 words | 4000000 | PLASTIC/EPOXY | BGA | BGA, | RECTANGULAR | GRID ARRAY | Active | NOT SPECIFIED | 5.75 | Details | Yes | 1.35 V | 1.2 V | 1.25 V | SigmaQuad-IIIe | Tray | GS81313LD36GK | 3A991.B.2.B | SigmaQuad-IIIe B4 | 8542.32.00.41 | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | R-PBGA-B260 | 1.35 V | 1.2 V | 144 Mbit | SYNCHRONOUS | 2.55 A | 4 M x 36 | 2.3 mm | 36 | 150994944 bit | PARALLEL | DDR SRAM | 22 mm | 14 mm | ||||
| Mfr Part No GS81313LD36GK-625 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-260 | YES | 260 | 10 | GSI TECHNOLOGY | Parallel | GS81313LD36GK-625 | 625 MHz | + 85 C | DDR | 0 C | Yes | SMD/SMT | 4194304 words | 4000000 | 85 °C | PLASTIC/EPOXY | HBGA | HBGA, | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | Active | NOT SPECIFIED | 5.75 | Details | Yes | 1.35 V | 1.2 V | 1.2 V | SigmaQuad-IIIe | Tray | GS81313LD36GK | 3A991.B.2.B | SigmaQuad-IIIe B4 | 8542.32.00.41 | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | R-PBGA-B260 | 1.3 V | OTHER | 1.15 V | 144 Mbit | SYNCHRONOUS | 2.1 A | 4 M x 36 | 2.3 mm | 36 | 150994944 bit | PARALLEL | QDR SRAM | 22 mm | 14 mm |