The category is 'Memory'
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GS816272CC
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of Terminals | Access Time-Max | Brand | Data Rate Architecture | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | Pbfree Code | ECCN Code | Type | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Operating Mode | Supply Current-Max | Access Time | Architecture | Organization | Seated Height-Max | Memory Width | Address Bus Width | Product Type | Density | Memory Density | Screening Level | Parallel/Serial | Memory IC Type | Product Category | Length | Width | Radiation Hardening |
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![]() | Mfr Part No GS816272CC-200M | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 21 | Parallel | GSI Technology | 200 MHz | 153.8@Flow-Through/200@Pipelined MHz | 2.7, 3.6 V | + 125 C | SDR | 2.3, 3 V | - 55 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | FBGA | 3.6 V | 2.3 V | Synchronous | SyncBurst | 2.5, 3.3 V | Military grade | -55 to 125 °C | Tray | GS816272CC | Pipeline/Flow Through | Memory & Data Storage | 209 | 18 Mbit | 8 | 6.5 ns | Flow-Through/Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Military | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816272CC-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 6.5 ns | GSI Technology | SDR | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816272CC-200 | 200 MHz | 2.7, 3.6 V | + 70 C | SDR | 2.3, 3 V | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | 256000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.16 | N | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | Commercial grade | 0 to 70 °C | Tray | GS816272CC | No | 3A991.B.2.B | Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | COMMERCIAL | 2.3 V | 18 Mbit | 8 | SYNCHRONOUS | 230 mA, 260 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | |||||||
![]() | Mfr Part No GS816272CC-300I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 21 | Parallel | GSI Technology | 300 MHz | 200@Flow-Through/300@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | FBGA | 3.6 V | 2.3 V | Synchronous | SyncBurst | 2.5, 3.3 V | Industrial grade | -40 to 85 °C | Tray | GS816272CC | Pipeline/Flow Through | Memory & Data Storage | 209 | 18 Mbit | 8 | 300 mA, 375 mA | 5 ns | Flow-Through/Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816272CC-250I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 21 | Parallel | GSI Technology | 250 MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | FBGA | 3.6 V | 2.3 V | Synchronous | SyncBurst | 2.5, 3.3 V | Industrial grade | -40 to 85 °C | Tray | GS816272CC | Pipeline/Flow Through | Memory & Data Storage | 209 | 18 Mbit | 8 | 275 mA, 320 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 72 | SRAM | 18 Mbit | Industrial | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816272CC-200IV | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 6.5 ns | GSI Technology | SDR | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816272CC-200IV | 200 MHz | 153.8@Flow-Through/200@Pipelined MHz | 2, 2.7 V | + 85 C | SDR | 1.7, 2.3 V | - 40 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.16 | No | BGA | 2.7 V | 1.7 V | 1.8 V | Synchronous | SyncBurst | 1.8, 2.5 V | Industrial grade | -40 to 85 °C | Tray | GS816272CC | No | 3A991.B.2.B | SCD/DCD | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2 V | INDUSTRIAL | 1.7 V | 18 Mbit | 8 | SYNCHRONOUS | 240 mA, 300 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | ||||||
![]() | Mfr Part No GS816272CC-300M | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | 21 | Parallel | 300 MHz | + 125 C | - 55 C | SMD/SMT | 3.6 V | 2.3 V | SyncBurst | GS816272CC | Pipeline/Flow Through | 18 Mbit | 340 mA, 465 mA | 5 ns | 256 k x 72 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816272CC-250V | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 5.5 ns | GSI Technology | SDR | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816272CC-250V | 250 MHz | 181.8@Flow-Through/250@Pipelined MHz | 2, 2.7 V | + 70 C | SDR | 1.7, 2.3 V | 0 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | 256000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.16 | N | No | BGA | 2.7 V | 1.7 V | 1.8 V | Synchronous | SyncBurst | 1.8, 2.5 V | Commercial grade | 0 to 70 °C | Tray | GS816272CC | No | 3A991.B.2.B | SCD/DCD | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2 V | COMMERCIAL | 1.7 V | 18 Mbit | 8 | SYNCHRONOUS | 265 mA, 350 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | ||||||
![]() | Mfr Part No GS816272CC-250 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 21 | Parallel | GSI Technology | 250 MHz | 181.8@Flow-Through/250@Pipelined MHz | 2.7, 3.6 V | + 70 C | SDR | 2.3, 3 V | 0 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | Compliant | FBGA | 3.6 V | 2.3 V | Synchronous | SyncBurst | 2.5, 3.3 V | Commercial grade | 0 to 70 °C | Tray | GS816272CC | Pipeline/Flow Through | 70 °C | 0 °C | Memory & Data Storage | 209 | 18 Mbit | 8 | 265 mA, 310 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Commercial | SRAM | No | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816272CC-150I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 7.5 ns | GSI Technology | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816272CC-150I | 150 MHz | 133.3@Flow-Through/150@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | 3 | SMD/SMT | 72 Bit | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.16 | Compliant | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | -40 to 85 °C | Tray | GS816272CC | No | 3A991.B.2.B | Pipeline/Flow Through | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | INDUSTRIAL | 2.3 V | 18 Mbit | 8 | SYNCHRONOUS | 220 mA, 220 mA | 7.5@Flow-Through/3.8 | 256 k x 72 | 1.7 mm | 72 | 18 b | SRAM | 18 Mb | 18 | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | No | ||||||
![]() | Mfr Part No GS816272CC-150IV | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 7.5 ns | GSI Technology | SDR | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816272CC-150IV | 150 MHz | 133.3@Flow-Through/150@Pipelined MHz | 2, 2.7 V | + 85 C | SDR | 1.7, 2.3 V | - 40 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.16 | Compliant | No | BGA | 2.7 V | 1.7 V | 1.8 V | Synchronous | SyncBurst | 1.8, 2.5 V | Industrial grade | -40 to 85 °C | Tray | GS816272CC | No | 3A991.B.2.B | SCD/DCD | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2 V | INDUSTRIAL | 1.7 V | 18 Mbit | 8 | SYNCHRONOUS | 220 mA, 240 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | No | ||
![]() | Mfr Part No GS816272CC-150V | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 7.5 ns | GSI Technology | SDR | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816272CC-150V | 150 MHz | 133.3@Flow-Through/150@Pipelined MHz | 2, 2.7 V | + 70 C | SDR | 1.7, 2.3 V | 0 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | 256000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.16 | N | No | BGA | 2.7 V | 1.7 V | 1.8 V | Synchronous | SyncBurst | 1.8, 2.5 V | Commercial grade | 0 to 70 °C | Tray | GS816272CC | No | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2 V | COMMERCIAL | 1.7 V | 18 Mbit | 8 | SYNCHRONOUS | 210 mA, 230 mA | 7.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | ||||||
![]() | Mfr Part No GS816272CC-200I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 6.5 ns | GSI Technology | SDR | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816272CC-200I | 200 MHz | 153.8@Flow-Through/200@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.16 | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | Industrial grade | -40 to 85 °C | Tray | GS816272CC | No | 3A991.B.2.B | Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | INDUSTRIAL | 2.3 V | 18 Mbit | 8 | SYNCHRONOUS | 240 mA, 270 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | |||||
![]() | Mfr Part No GS816272CC-200V | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 6.5 ns | GSI Technology | SDR | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816272CC-200V | 200 MHz | 153.8@Flow-Through/200@Pipelined MHz | 2, 2.7 V | + 70 C | SDR | 1.7, 2.3 V | 0 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | 256000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.16 | N | No | BGA | 2.7 V | 1.7 V | 1.8 V | Synchronous | SyncBurst | 1.8, 2.5 V | Commercial grade | 0 to 70 °C | Tray | GS816272CC | No | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2 V | COMMERCIAL | 1.7 V | 18 Mbit | 8 | SYNCHRONOUS | 230 mA, 290 mA | 6.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | ||||||
![]() | Mfr Part No GS816272CC-250IV | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 21 | Parallel | GSI Technology | 250 MHz | 181.8@Flow-Through/250@Pipelined MHz | 2, 2.7 V | + 85 C | SDR | 1.7, 2.3 V | - 40 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | Compliant | BGA | 2.7 V | 1.7 V | Synchronous | SyncBurst | 1.8, 2.5 V | Industrial grade | -40 to 85 °C | Tray | GS816272CC | SCD/DCD | 85 °C | -40 °C | Memory & Data Storage | 209 | 18 Mbit | 8 | 275 mA, 360 mA | 5.5 ns | Flow-Through/Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Industrial | SRAM | No | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816272CC-300 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-209 | GSI Technology | SDR | 21 | Parallel | GSI Technology | 300 MHz | 200@Flow-Through/300@Pipelined MHz | 2.7, 3.6 V | + 70 C | SDR | 2.3, 3 V | 0 C | Yes | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | N | FBGA | 3.6 V | 2.3 V | Synchronous | SyncBurst | 2.5, 3.3 V | Commercial grade | 0 to 70 °C | Tray | GS816272CC | Pipeline/Flow Through | Memory & Data Storage | 209 | 18 Mbit | 8 | 290 mA, 365 mA | 5 ns | Flow-Through/Pipelined | 256 k x 72 | 18 Bit | SRAM | 18 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816272CC-333I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 4.5 ns | GSI Technology | SDR | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816272CC-333I | 333 MHz | 222.2@Flow-Through/333@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.16 | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | Industrial grade | -40 to 85 °C | Tray | GS816272CC | No | 3A991.B.2.B | Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | INDUSTRIAL | 2.3 V | 18 Mbit | 8 | SYNCHRONOUS | 330 mA, 400 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Industrial | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | |||||
![]() | Mfr Part No GS816272CC-333 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 4.5 ns | GSI Technology | SDR | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS816272CC-333 | 333 MHz | 222.2@Flow-Through/333@Pipelined MHz | 2.7, 3.6 V | + 70 C | SDR | 2.3, 3 V | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | 256000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.16 | N | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | Commercial grade | 0 to 70 °C | Tray | GS816272CC | No | 3A991.B.2.B | Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | COMMERCIAL | 2.3 V | 18 Mbit | 8 | SYNCHRONOUS | 320 mA, 390 mA | 4.5 ns | Flow-Through/Pipelined | 256 k x 72 | 1.7 mm | 72 | 18 Bit | SRAM | 18 Mbit | 18874368 bit | Commercial | PARALLEL | CACHE SRAM | SRAM | 22 mm | 14 mm | |||||
![]() | Mfr Part No GS816272CC-150 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 7.5 ns | SDR | GSI TECHNOLOGY | Parallel | GSI Technology | GS816272CC-150 | 150 MHz | 133.3@Flow-Through/150@Pipelined MHz | 2.7, 3.6 V | + 70 C | 2.3, 3 V | 0 C | 3 | Surface Mount | SMD/SMT | 72 Bit | 256 kWords | 256000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.16 | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | 2.5, 3.3 V | Commercial grade | 0 to 70 °C | GS816272CC | No | 3A991.B.2.B | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | COMMERCIAL | 2.3 V | 18 Mbit | 8 | SYNCHRONOUS | 210 mA, 210 mA | 7.5 ns | Flow-Through/Pipelined | 256KX72 | 1.7 mm | 72 | 18 Bit | 18 Mbit | 18874368 bit | Commercial | PARALLEL | CACHE SRAM | 22 mm | 14 mm |
GS816272CC-200M
GSI Technology
Package:Memory
Price: please inquire
GS816272CC-200
GSI Technology
Package:Memory
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GS816272CC-300I
GSI Technology
Package:Memory
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GS816272CC-250I
GSI Technology
Package:Memory
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GS816272CC-200IV
GSI Technology
Package:Memory
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GS816272CC-300M
GSI Technology
Package:Memory
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GS816272CC-250V
GSI Technology
Package:Memory
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GS816272CC-250
GSI Technology
Package:Memory
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GS816272CC-150I
GSI Technology
Package:Memory
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GS816272CC-150IV
GSI Technology
Package:Memory
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GS816272CC-150V
GSI Technology
Package:Memory
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GS816272CC-200I
GSI Technology
Package:Memory
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GS816272CC-200V
GSI Technology
Package:Memory
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GS816272CC-250IV
GSI Technology
Package:Memory
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GS816272CC-300
GSI Technology
Package:Memory
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GS816272CC-333I
GSI Technology
Package:Memory
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GS816272CC-333
GSI Technology
Package:Memory
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GS816272CC-150
GSI Technology
Package:Memory
Price: please inquire
