The category is 'Memory'
Memory (2)
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GS8182T18BGD
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of Terminals | Access Time-Max | Brand | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Memory Types | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of Words | Number of Words Code | Operating Temperature-Max | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Tradename | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Operating Mode | Supply Current-Max | Access Time | Organization | Seated Height-Max | Memory Width | Address Bus Width | Product Type | Density | Memory Density | Parallel/Serial | Memory IC Type | Product Category | Length | Width | Radiation Hardening |
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 | Mfr Part No GS8182T18BGD-300 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-165 | YES | 165 | 0.45 ns | GSI Technology | 18 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8182T18BGD-300 | 300 MHz | + 70 C | DDR | 0 C | Yes | 3 | SMD/SMT | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 4.65 | Details | Yes | 1.9 V | 1.7 V | 1.8 V | SigmaDDR-II | Tray | GS8182T18BGD | e1 | Yes | 3A991.B.2.B | SigmaDDR-II B2 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.8 V | 1.9 V | COMMERCIAL | 1.7 V | 18 Mbit | 1 | SYNCHRONOUS | 405 mA | 450 ps | 1 M x 18 | 1.4 mm | 18 | 20 b | SRAM | 18 Mb | 18874368 bit | PARALLEL | DDR SRAM | SRAM | 15 mm | 13 mm | No | |
| Mfr Part No GS8182T18BGD-250 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | BGA-165 | GSI Technology | 18 | Parallel | GSI Technology | 250 MHz | + 70 C | DDR | 0 C | Yes | SMD/SMT | Details | 1.9 V | 1.7 V | SigmaDDR-II | Tray | GS8182T18BGD | SigmaDDR-II B2 | 70 °C | 0 °C | Memory & Data Storage | 1.8 V | 18 Mbit | 1 | 350 mA | 450 ps | 1 M x 18 | 20 b | SRAM | 18 Mb | SRAM | No |