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The category is 'Memory'

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Series:
GS88237CB

Image	Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	RoHS	Factory Lead Time	Package / Case	Surface Mount	Number of Terminals	Access Time-Max	Brand	Clock Frequency-Max (fCLK)	Data Rate Architecture	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Clock Rate	Maximum Operating Supply Voltage	Maximum Operating Temperature	Memory Types	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Mounting	Mounting Styles	Number of I/O Lines	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Timing Type	Tradename	Typical Operating Supply Voltage	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Pin Count	JESD-30 Code	Qualification Status	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Memory Size	Number of Ports	Operating Mode	Supply Current-Max	Access Time	Architecture	Organization	Output Characteristics	Seated Height-Max	Memory Width	Address Bus Width	Product Type	Density	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Standby Voltage-Min	Product Category	Length	Width	Radiation Hardening
	Mfr Part No GS88237CB-300I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-119	YES	119	2.2 ns	GSI Technology			42	GSI TECHNOLOGY	Parallel	GSI Technology	GS88237CB-300I	300 MHz	300 MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes		SMD/SMT	36 Bit	262144 words	256000	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA,		RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.19		No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V		-40 to 85 °C	Tray	GS88237CB	e0	No	3A991.B.2.B	SCD/DCD Pipeline	Tin/Lead (Sn/Pb)			PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified	2.7 V		INDUSTRIAL	2.3 V	9 Mbit		SYNCHRONOUS	245 mA	2.2		256 k x 36		1.77 mm	36		SRAM			9		PARALLEL		CACHE SRAM		SRAM	22 mm	14 mm
	Mfr Part No GS88237CB-200I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-119	YES	119	2.7 ns	GSI Technology		SDR	42	GSI TECHNOLOGY	Parallel	GSI Technology	GS88237CB-200I	200 MHz	200 MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes	Surface Mount	SMD/SMT	36 Bit	256 kWords	256000	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA,		RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	1.68	N	No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS88237CB	e0	No	3A991.B.2.B	SCD/DCD Pipeline	Tin/Lead (Sn/Pb)			PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified	2.7 V		INDUSTRIAL	2.3 V	9 Mbit	2	SYNCHRONOUS	190 mA	2.7 ns	Pipelined	256 k x 36		1.77 mm	36	18 Bit	SRAM	9 Mbit		9437184 bit	Industrial	PARALLEL		CACHE SRAM		SRAM	22 mm	14 mm
	Mfr Part No GS88237CB-250	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-119	YES	119	2.3 ns	GSI Technology			42	GSI TECHNOLOGY	Parallel	GSI Technology	GS88237CB-250	250 MHz			+ 70 C	SDR		0 C	Yes		SMD/SMT		262144 words	256000	70 °C		PLASTIC/EPOXY	BGA	BGA,		RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.19	N	No		3.6 V	2.3 V	2.5 V		SyncBurst				Tray	GS88237CB	e0	No	3A991.B.2.B	SCD/DCD Pipeline	Tin/Lead (Sn/Pb)			PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified	2.7 V		COMMERCIAL	2.3 V	9 Mbit		SYNCHRONOUS	195 mA			256 k x 36		1.77 mm	36		SRAM			9437184 bit		PARALLEL		CACHE SRAM		SRAM	22 mm	14 mm
	Mfr Part No GS88237CB-250I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-119	YES	119	2.3 ns	GSI Technology		SDR	42	GSI TECHNOLOGY	Parallel	GSI Technology	GS88237CB-250I	250 MHz	250 MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes	Surface Mount	SMD/SMT	36 Bit	256 kWords	256000	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA,		RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.19	Compliant	No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS88237CB	e0	No	3A991.B.2.B	SCD/DCD Pipeline	Tin/Lead (Sn/Pb)	85 °C	-40 °C	PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified	2.7 V		INDUSTRIAL	2.3 V	9 Mbit	2	SYNCHRONOUS	215 mA		Pipelined	256 k x 36		1.77 mm	36	18 Bit	SRAM	9 Mbit		9437184 bit	Industrial	PARALLEL		CACHE SRAM		SRAM	22 mm	14 mm	No
	Mfr Part No GS88237CB-200	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-119	YES	119	2.7 ns	GSI Technology			42	GSI TECHNOLOGY	Parallel	GSI Technology	GS88237CB-200	200 MHz			+ 70 C	SDR		0 C	Yes		SMD/SMT		262144 words	256000	70 °C		PLASTIC/EPOXY	BGA	BGA,		RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.19	N	No		3.6 V	2.3 V	2.5 V		SyncBurst				Tray	GS88237CB	e0	No	3A991.B.2.B	SCD/DCD Pipeline	Tin/Lead (Sn/Pb)			PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified	2.7 V		COMMERCIAL	2.3 V	9 Mbit		SYNCHRONOUS	170 mA			256 k x 36		1.77 mm	36		SRAM			9437184 bit		PARALLEL		CACHE SRAM		SRAM	22 mm	14 mm
	Mfr Part No GS88237CB-250IV	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-119	YES	119	2.5 ns	GSI Technology	250 MHz	SDR	42	GSI TECHNOLOGY	Parallel	GSI Technology	GS88237CB-250IV	250 MHz	250 MHz	2, 2.7 V	+ 85 C	SDR	1.7, 2.3 V	- 40 C	Yes	Surface Mount	SMD/SMT	36 Bit	256 kWords	256000	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.19	Compliant	No	FBGA	2.7 V	1.7 V	1.8 V	Synchronous	SyncBurst	1.8, 2.5 V	Industrial grade	-40 to 85 °C	Tray	GS88237CB	e0	No	3A991.B.2.B	SCD/DCD Pipeline	Tin/Lead (Sn/Pb)	85 °C	-40 °C	PIPELINED ARCHITECTURE, IT ALSO OPERATES WITH 2.3 V TO 2.7 V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified	2 V	1.8/2.5 V	INDUSTRIAL	1.7 V	9 Mbit	2	SYNCHRONOUS	215 mA		Pipelined	256 k x 36	3-STATE	1.77 mm	36	18 Bit	SRAM	9 Mbit	0.045 A	9437184 bit	Industrial	PARALLEL	COMMON	CACHE SRAM	1.7 V	SRAM	22 mm	14 mm	No
	Mfr Part No GS88237CB-250V	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-119	YES	119	2.5 ns	GSI Technology	250 MHz	SDR	42	GSI TECHNOLOGY	Parallel	GSI Technology	GS88237CB-250V	250 MHz	250 MHz	2, 2.7 V	+ 70 C	SDR	1.7, 2.3 V	0 C	Yes	Surface Mount	SMD/SMT	36 Bit	256 kWords	256000	70 °C		PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.19	N	No	FBGA	2.7 V	1.7 V	1.8 V	Synchronous	SyncBurst	1.8, 2.5 V	Commercial grade	0 to 70 °C	Tray	GS88237CB	e0	No	3A991.B.2.B	SCD/DCD Pipeline	Tin/Lead (Sn/Pb)			PIPELINED ARCHITECTURE, IT ALSO OPERATES WITH 2.3 V TO 2.7 V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified	2 V	1.8/2.5 V	COMMERCIAL	1.7 V	9 Mbit	2	SYNCHRONOUS	195 mA		Pipelined	256 k x 36	3-STATE	1.77 mm	36	18 Bit	SRAM	9 Mbit	0.025 A	9437184 bit	Commercial	PARALLEL	COMMON	CACHE SRAM	1.7 V	SRAM	22 mm	14 mm
	Mfr Part No GS88237CB-333	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-119				GSI Technology		SDR	42		Parallel	GSI Technology		333 MHz	333 MHz	2.7, 3.6 V	+ 70 C	SDR	2.3, 3 V	0 C	Yes	Surface Mount	SMD/SMT	36 Bit	256 kWords														Compliant		FBGA	3.6 V	2.3 V		Synchronous	SyncBurst	2.5, 3.3 V	Commercial grade	0 to 70 °C	Tray	GS88237CB				SCD/DCD Pipeline		70 °C	0 °C			Memory & Data Storage								119							9 Mbit	2		240 mA		Pipelined	256 k x 36				18 Bit	SRAM	9 Mbit			Commercial					SRAM			No
	Mfr Part No GS88237CB-333I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-119				GSI Technology		SDR	42		Parallel	GSI Technology		333 MHz	333 MHz	2.7, 3.6 V	+ 85 C	SDR	2.3, 3 V	- 40 C	Yes	Surface Mount	SMD/SMT	36 Bit	256 kWords																FBGA	3.6 V	2.3 V		Synchronous	SyncBurst	2.5, 3.3 V	Industrial grade	-40 to 85 °C	Tray	GS88237CB				SCD/DCD Pipeline						Memory & Data Storage								119							9 Mbit	2		260 mA		Pipelined	256 k x 36				18 Bit	SRAM	9 Mbit			Industrial					SRAM
	Mfr Part No GS88237CB-300	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1			BGA-119				GSI Technology		SDR	42		Parallel	GSI Technology		300 MHz	300 MHz	2.7, 3.6 V	+ 70 C	SDR	2.3, 3 V	0 C	Yes	Surface Mount	SMD/SMT	36 Bit	256 kWords														N		FBGA	3.6 V	2.3 V		Synchronous	SyncBurst	2.5, 3.3 V	Commercial grade	0 to 70 °C	Tray	GS88237CB				SCD/DCD Pipeline						Memory & Data Storage								119							9 Mbit	2		225 mA		Pipelined	256 k x 36				18 Bit	SRAM	9 Mbit			Commercial					SRAM
	Mfr Part No GS88237CB-200V	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-119	YES	119	2.5 ns	GSI Technology	200 MHz	SDR	42	GSI TECHNOLOGY	Parallel	GSI Technology	GS88237CB-200V	200 MHz	200 MHz	2, 2.7 V	+ 70 C	SDR	1.7, 2.3 V	0 C	Yes	Surface Mount	SMD/SMT	36 Bit	256 kWords	256000	70 °C		PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.19	N	No	FBGA	2.7 V	1.7 V	1.8 V	Synchronous	SyncBurst	1.8, 2.5 V	Commercial grade	0 to 70 °C	Tray	GS88237CB	e0	No	3A991.B.2.B	SCD/DCD Pipeline	Tin/Lead (Sn/Pb)	70 °C	0 °C	PIPELINED ARCHITECTURE, IT ALSO OPERATES WITH 2.3 V TO 2.7 V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified	2 V	1.8/2.5 V	COMMERCIAL	1.7 V	9 Mbit	2	SYNCHRONOUS	170 mA		Pipelined	256 k x 36	3-STATE	1.77 mm	36	18 Bit	SRAM	9 Mbit	0.025 A	9437184 bit	Commercial	PARALLEL	COMMON	CACHE SRAM	1.7 V	SRAM	22 mm	14 mm	No
	Mfr Part No GS88237CB-200IV	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks	BGA-119	YES	119	2.5 ns	GSI Technology	200 MHz	SDR	42	GSI TECHNOLOGY	Parallel	GSI Technology	GS88237CB-200IV	200 MHz	200 MHz	2, 2.7 V	+ 85 C	SDR	1.7, 2.3 V	- 40 C	Yes	Surface Mount	SMD/SMT	36 Bit	256 kWords	256000	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.19	Compliant	No	FBGA	2.7 V	1.7 V	1.8 V	Synchronous	SyncBurst	1.8, 2.5 V	Industrial grade	-40 to 85 °C	Tray	GS88237CB	e0	No	3A991.B.2.B	SCD/DCD Pipeline	Tin/Lead (Sn/Pb)	85 °C	-40 °C	PIPELINED ARCHITECTURE, IT ALSO OPERATES WITH 2.3 V TO 2.7 V SUPPLY	8542.32.00.41	Memory & Data Storage	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified	2 V	1.8/2.5 V	INDUSTRIAL	1.7 V	9 Mbit	2	SYNCHRONOUS	190 mA		Pipelined	256 k x 36	3-STATE	1.77 mm	36	18 Bit	SRAM	9 Mbit	0.045 A	9437184 bit	Industrial	PARALLEL	COMMON	CACHE SRAM	1.7 V	SRAM	22 mm	14 mm	No