The category is 'Memory'

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  • Series:

    SiT8208

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Factory Lead Time

Mounting Type

Package / Case

Surface Mount

Supplier Device Package

Number of Terminals

Access Time-Max

Base Product Number

Clock Frequency-Max (fCLK)

Ihs Manufacturer

Manufacturer

Manufacturer Part Number

Memory Types

Mfr

Number of Words

Number of Words Code

Operating Temperature-Max

Operating Temperature-Min

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Product Status

Risk Rank

RoHS

Rohs Code

Supply Voltage-Nom (Vsup)

Operating Temperature

Packaging

Series

Size / Dimension

Part Status

ECCN Code

Type

Max Operating Temperature

Min Operating Temperature

Additional Feature

HTS Code

Subcategory

Technology

Voltage - Supply

Terminal Position

Terminal Form

Number of Functions

Terminal Pitch

Reach Compliance Code

Frequency

Frequency Stability

Output

Pin Count

JESD-30 Code

Function

Base Resonator

Current - Supply (Max)

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Current - Supply (Disable) (Max)

Interface

Memory Size

Operating Mode

Clock Frequency

Spread Spectrum Bandwidth

Supply Current-Max

Access Time

Memory Format

Memory Interface

Organization

Output Characteristics

Seated Height-Max

Memory Width

Write Cycle Time - Word, Page

Standby Current-Max

Memory Density

Parallel/Serial

I/O Type

Memory IC Type

Absolute Pull Range (APR)

Standby Voltage-Min

Memory Organization

Height Seated (Max)

Length

Width

Ratings

WS1M32-25G3I

Mfr Part No

WS1M32-25G3I

Microchip Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

4-SMD, No Lead

YES

84

25 ns

WHITE MICROELECTRONICS

White Microelectronics

WS1M32-25G3I

SiTime

4194304 words

4000000

85 °C

-40 °C

Tape & Reel (TR)

CERAMIC, METAL-SEALED COFIRED

SQUARE

MICROELECTRONIC ASSEMBLY

Transferred

Active

5.65

5 V

-20°C ~ 70°C

SiT8208

0.106 L x 0.094 W (2.70mm x 2.40mm)

XO (Standard)

CAN ALSO BE CONFIGURED AS 1M X 32 AND 2M X 16

CMOS

1.8V

QUAD

GULL WING

1

unknown

14 MHz

±10ppm

LVCMOS, LVTTL

S-CQMA-G84

Enable/Disable

MEMS

31mA

Not Qualified

5.5 V

INDUSTRIAL

4.5 V

30mA

ASYNCHRONOUS

-

4MX8

8

33554432 bit

PARALLEL

SRAM MODULE

-

0.031 (0.80mm)

-

W25Q80BVNB01

Mfr Part No

W25Q80BVNB01

Winbond Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

4-SMD, No Lead

-

W25Q80

Non-Volatile

SiTime

Tape & Reel (TR)

Active

-20°C ~ 70°C

SiT8208

0.276 L x 0.197 W (7.00mm x 5.00mm)

XO (Standard)

FLASH - NOR

1.8V

33.333 MHz

±10ppm

LVCMOS, LVTTL

Standby (Power Down)

MEMS

31mA

10µA

8Mbit

104 MHz

-

6 ns

FLASH

SPI - Quad I/O

50µs, 3ms

-

1M x 8

0.039 (1.00mm)

-

IDT709279L12PF8

Mfr Part No

IDT709279L12PF8

Renesas Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

4-SMD, No Lead

RAM, SRAM

SiTime

Tape & Reel (TR)

Active

Non-Compliant

-40°C ~ 85°C

Tape & Reel (TR)

SiT8208

0.126 L x 0.098 W (3.20mm x 2.50mm)

XO (Standard)

70 °C

0 °C

3.3V

31.25 MHz

±10ppm

LVCMOS, LVTTL

Standby (Power Down)

MEMS

33mA

70µA

Parallel

-

-

0.031 (0.80mm)

-

70V09S15PF

Mfr Part No

70V09S15PF

Renesas Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

4-SMD, No Lead

SiTime

Tape & Reel (TR)

Active

-40°C ~ 85°C

SiT8208

0.106 L x 0.094 W (2.70mm x 2.40mm)

XO (Standard)

2.8V

38.4 MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

31mA

-

-

0.031 (0.80mm)

-

GS8342Q36BD-250IT

Mfr Part No

GS8342Q36BD-250IT

GSI Datasheet

-

-

Min: 1

Mult: 1

12 Weeks

Surface Mount

4-SMD, No Lead

YES

165

0.45 ns

250 MHz

GSI TECHNOLOGY

GSI Technology

GS8342Q36BD-250IT

1048576 words

1000000

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

LBGA, BGA165,11X15,40

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

5.36

No

1.8 V

-20°C ~ 70°C

Tape & Reel (TR)

SiT8208

0.276 L x 0.197 W (7.00mm x 5.00mm)

Active

3A991.B.2.B

XO (Standard)

PIPELINED ARCHITECTURE

8542.32.00.41

SRAMs

CMOS

2.5V

BOTTOM

BALL

1

1 mm

compliant

20MHz

±10ppm

LVCMOS, LVTTL

165

R-PBGA-B165

Standby (Power Down)

MEMS

33mA

Not Qualified

1.9 V

1.5/1.8,1.8 V

INDUSTRIAL

1.7 V

70µA

SYNCHRONOUS

0.835 mA

1MX36

3-STATE

1.4 mm

36

0.215 A

37748736 bit

PARALLEL

SEPARATE

QDR SRAM

--

1.7 V

0.039 (1.00mm)

15 mm

13 mm

--

SDINBDG4-16G

Mfr Part No

SDINBDG4-16G

Western Digital Corporation Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

4-SMD, No Lead

-20°C ~ 70°C

Tape & Reel (TR)

SiT8208

0.276 L x 0.197 W (7.00mm x 5.00mm)

Active

XO (Standard)

3.3V

30MHz

±10ppm

LVCMOS, LVTTL

Standby (Power Down)

MEMS

33mA

70µA

--

0.039 (1.00mm)

--