The category is 'Memory'
Memory (7)
- All Manufacturers
- Ihs Manufacturer
- JESD-30 Code
- Length
- Memory Density
- Memory IC Type
- Memory Width
- Number of Functions
- Number of Terminals
- Number of Words
- Number of Words Code
- Operating Temperature-Max
- Supply Current-Max
- Supply Current-Max:
0.0003 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Access Time-Max | Base Product Number | Clock Frequency-Max (fCLK) | Dimensions | Factory Pack QuantityFactory Pack Quantity | Gross weight | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Transport packaging size/quantity | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Standby Current-Max | Memory Density | Parallel/Serial | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | I2C Control Byte | Memory Organization | Height | Length | Width |
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 | Mfr Part No BL24C512A-PARC | Shanghai Belling Co Ltd | Datasheet | 8000 |
| Min: 1 Mult: 1 | YES | 8 | 1 MHz | SHANGHAI BELLING CO LTD | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Contact Manufacturer | Yes | 5 V | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G8 | 5.5 V | 2.5 V | SYNCHRONOUS | 0.0003 mA | 64KX8 | 1.75 mm | 8 | 5e-7 A | 524288 bit | SERIAL | EEPROM | 5 V | I2C | 1000000 Write/Erase Cycles | 3 ms | 100 | HARDWARE | 1010DDDR | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BR24CF16F | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 3000 ns | ROHM CO LTD | 2048 words | 2000 | 85 °C | -40 °C | PLASTIC/EPOXY | LSOP | LSOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | Obsolete | SOIC | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.41 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 0.0003 mA | 2KX8 | 1.6 mm | 8 | 0.00006 A | 16384 bit | SERIAL | NON-VOLATILE SRAM | 5 mm | 4.4 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No FM24CL64B-DG | Infineon Technologies | Datasheet | 1579 |
| Min: 1 Mult: 1 | Surface Mount | TDFN-8 | YES | 8-DFN (4x4.5) | 8 | FM24CL64 | 1620 | CYPRESS SEMICONDUCTOR CORP | I2C | FM24CL64B-DG | + 85 C | Non-Volatile | Infineon Technologies | - 40 C | Yes | 3 | SMD/SMT | 8192 words | 8000 | 85 °C | -40 °C | Tube | PLASTIC/EPOXY | HVSON | HVSON, SOLCC8,.16,37 | SOLCC8,.16,37 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Active | DFN | Active | 30 | 0.82 | Details | Yes | F-RAM,8KB,I2C,1MHz,3V,DFN8 | 3.65 V | 2.7 V | 3.3 V | 0.001764 oz | -40°C ~ 85°C (TA) | Tube | FM24CL64B | e3 | EAR99 | Tin (Sn) | 8542.32.00.71 | FRAM (Ferroelectric RAM) | 2.7V ~ 3.6V | DUAL | NO LEAD | 260 | 1 | 0.95 mm | compliant | 8 | R-PDSO-N8 | Not Qualified | 2.7 V to 3.6 V | 3.65 V | 3/3.3 V | INDUSTRIAL | 2.7 V | 64 kbit | SYNCHRONOUS | 1 MHz | 0.0003 mA | 550 ns | FRAM | I²C | 8 k x 8 | 0.85 mm | 8 | - | 0.000006 A | 65536 bit | MEMORY CIRCUIT | 8K x 8 | 4.5 mm | 4 mm | ||||||||||||||||||||||
| Mfr Part No FM24CL64B-GTR | Infineon Technologies | Datasheet | 28000 | - | Min: 1 Mult: 1 | Surface Mount | SOIC-8 | YES | 8-SOIC | 8 | FM24CL64 | 4.97 x 3.98 x 1.48mm | 2500 | CYPRESS SEMICONDUCTOR CORP | I2C | FM24CL64B-GTR | 3.6 V | + 85 C | Non-Volatile | Infineon Technologies | 2.7 V | - 40 C | Yes | 3 | SMD/SMT | 8K | 8000 | 85 °C | -40 °C | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | SOIC | Active | Active | 30 | 0.82 | Details | Yes | 3.65 V | 2.7 V | 3.3 V | 0.019048 oz | -40°C ~ 85°C (TA) | MouseReel | FM24CL64B | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | FRAM (Ferroelectric RAM) | 2.7V ~ 3.65V | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 3 V | 3.65 V | 3/3.3 V | INDUSTRIAL | 2.7 V | 64 kbit | SYNCHRONOUS | 1 MHz | 0.0003 mA | 550 ns | FRAM | I²C | 8bit | 8 k x 8 | 1.75 mm | 8 | - | 0.000006 A | 65536 bit | MEMORY CIRCUIT | 8K x 8 | 1.48mm | 4.97mm | 3.98mm | |||||||||||||||||
| Mfr Part No FM24CL04-S | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | RAMTRON INTERNATIONAL CORP | FM24CL04-S | 1 | 512 words | 512 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 30 | 5.64 | No | 3 V | e0 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | GULL WING | 240 | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | 3.65 V | 3/3.3 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.0003 mA | 512X8 | 1.75 mm | 8 | 0.000001 A | 4096 bit | MEMORY CIRCUIT | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No FM24CL04-G | Cypress | Datasheet | 62 | - | Min: 1 Mult: 1 | YES | 8 | RAMTRON INTERNATIONAL CORP | Ramtron International Corporation | FM24CL04-G | 1 | 512 words | 512 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 5.14 | Yes | 3 V | 8542.32.00.71 | SRAMs | CMOS | DUAL | GULL WING | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | 3.65 V | 3/3.3 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.0003 mA | 512X8 | 1.75 mm | 8 | 0.000001 A | 4096 bit | MEMORY CIRCUIT | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BL24C512A-SFRC | Shanghai Belling Co Ltd | Datasheet | 5801 |
| Min: 1 Mult: 1 | YES | 8 | 1 MHz | 1.98 | SHANGHAI BELLING CO LTD | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP-8 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Contact Manufacturer | 5 V | 43*26*20/5000 | DUAL | GULL WING | 1 | 0.65 mm | unknown | R-PDSO-G8 | 5.5 V | 2.5 V | SYNCHRONOUS | 0.0003 mA | 64KX8 | 1.2 mm | 8 | 5e-7 A | 524288 bit | SERIAL | EEPROM | 5 V | I2C | 1000000 Write/Erase Cycles | 3 ms | 100 | HARDWARE | 1010DDDR | 4.4 mm | 3 mm |
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BL24C512A-PARC
Shanghai Belling Co Ltd
Package:Memory
0.226276
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BR24CF16F
ROHM Semiconductor
Package:Memory
Price: please inquire
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FM24CL64B-DG
Infineon Technologies
Package:Memory
3.472303
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FM24CL64B-GTR
Infineon Technologies
Package:Memory
Price: please inquire
-
FM24CL04-S
Cypress Semiconductor
Package:Memory
Price: please inquire
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FM24CL04-G
Cypress
Package:Memory
Price: please inquire
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BL24C512A-SFRC
Shanghai Belling Co Ltd
Package:Memory
0.203595