The category is 'Memory'
Memory (2)
- All Manufacturers
- Clock Frequency-Max (fCLK)
- Data Retention Time-Min
- Endurance
- I2C Control Byte
- Ihs Manufacturer
- JESD-30 Code
- Length
- Memory Density
- Memory IC Type
- Memory Width
- Number of Terminals
- Supply Current-Max
- Supply Current-Max:
0.0008 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Surface Mount | Contact Shape | Number of Terminals | Clock Frequency-Max (fCLK) | Contact Finish Mating | Contact Materials | Ihs Manufacturer | Insulation Materials | Manufacturer | Manufacturer Part Number | Mated Stacking Heights | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Risk Rank | Rohs Code | Supply Voltage-Nom (Vsup) | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | Termination | ECCN Code | Connector Type | Number of Positions | Terminal Finish | Applications | Number of Rows | Additional Feature | HTS Code | Fastening Type | Contact Type | Technology | Terminal Position | Terminal Form | Number of Functions | Ingress Protection | Terminal Pitch | Insulation Height | Style | Number of Positions Loaded | Reach Compliance Code | Current Rating | Pitch - Mating | Insulation Color | Pin Count | JESD-30 Code | Qualification Status | Row Spacing - Mating | Contact Length - Post | Contact Finish - Post | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | Memory IC Type | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | I2C Control Byte | Features | Length | Width | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating |
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 | Mfr Part No GT24C256A-2UDLI-TR | Giantec | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole, Right Angle | YES | Square | 8 | 1 MHz | Gold | Phosphor Bronze | GIANTEC SEMICONDUCTOR INC | Polyphenylene Sulfide (PPS) | Giantec Semiconductor Inc | GT24C256A-2UDLI-TR | -- | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | HVSON, SOLCC8,.12,20 | SOLCC8,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH | Contact Manufacturer | 5.71 | Yes | 5 V | -- | -- | Tube | MIL-C-55302, AMPMODU Mod II | Active | Solder | Receptacle | 58 | -- | 2 | IT ALSO OPERATES AT 0.4 MHZ FREQUENCY AT 1.7 TO 2.5 V SUPPLY VOLTAGE | Push-Pull | Female Socket | CMOS | DUAL | NO LEAD | 1 | -- | 0.5 mm | 0.238 (6.05mm) | Board to Board | All | unknown | -- | 0.100 (2.54mm) | Natural | R-PDSO-N8 | 0.100 (2.54mm) | 0.115 (2.92mm) | Gold | 5.5 V | INDUSTRIAL | 2.5 V | 0.0008 mA | 32KX8 | 0.6 mm | 8 | 0.000001 A | 262144 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE | 1010DDDR | Guide Pin Ears | 3 mm | 2 mm | 50.0µin (1.27µm) | 50.0µin (1.27µm) | -- | ||||||||||||
 | Mfr Part No M24C02-RDW6 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | STMICROELECTRONICS | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 0.169 INCH, TSSOP-8 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | SOIC | No | 2.5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.65 mm | not_compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.0008 mA | 256X8 | OPEN-DRAIN | 1.2 mm | 8 | 0.000001 A | 2048 bit | AEC-Q100 | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 10 ms | 40 | HARDWARE | 1010DDDR | 4.4 mm | 3 mm |