The category is 'Memory'
Memory (245)
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- JESD-30 Code
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- Supply Current-Max:
0.002 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Shell Material | Supplier Device Package | Material | Insert Material | Shape | Package Cooled | Material Finish | Number of Terminals | Backshell Material, Plating | Base Product Number | Brand | Clock Frequency-Max (fCLK) | Contact Finish Mating | Contact Materials | Data Retention | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Package Code | Manufacturer Part Number | Memory Types | Mfr | Moisture Sensitivity Levels | Mounting | Number of Words | Number of Words Code | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Part Package Code | Primary Material | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Supply Voltage-Nom (Vsup) | Usage Level | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Part Status | Number of Terminations | Termination | ECCN Code | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | Applications | Power (Watts) | Additional Feature | HTS Code | Fastening Type | Subcategory | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Number of Functions | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Shell Finish | Pin Count | Shell Size - Insert | JESD-30 Code | Qualification Status | Brand Name | Operating Supply Voltage | Failure Rate | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Max Supply Voltage | Min Supply Voltage | Memory Size | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Operating Mode | Shell Size, MIL | Clock Frequency | Supply Current-Max | Cable Opening | Access Time | Memory Format | Memory Interface | Organization | Output Characteristics | Halogen Free | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Product Type | Density | Standby Current-Max | Memory Density | Max Frequency | Screening Level | Access Time (Max) | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Write Protection | Alternate Memory Width | I2C Control Byte | Thermal Resistance @ Natural | Power Dissipation @ Temperature Rise | Features | Supply Current | Product Category | Memory Organization | Diameter | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating | Lead Free |
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![]() | Mfr Part No M95010-WMN6 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 5 MHz | STMICROELECTRONICS | STMicroelectronics | M95010-WMN6 | 128 words | 128 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 0.150 INCH, PLASTIC, SOP-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | NOT SPECIFIED | 5.72 | Yes | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | ASYNCHRONOUS | 0.002 mA | 128X8 | 1.75 mm | 8 | 0.000002 A | 1024 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CAT25080YE-G | ON Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | ON SEMICONDUCTOR | ON Semiconductor | CAT25080YE-G | 1024 words | 1000 | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | NOT SPECIFIED | 5.54 | Yes | e4 | Yes | Nickel/Palladium/Gold (Ni/Pd/Au) | EEPROMs | CMOS | DUAL | GULL WING | 260 | 0.635 mm | unknown | R-PDSO-G8 | Not Qualified | 2/5 V | AUTOMOTIVE | 0.002 mA | 1KX8 | 8 | 0.000002 A | 8192 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT93C46-10SA-5.0C | Atmel | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 2 MHz | ATMEL CORP | Atmel Corporation | AT93C46-10SA-5.0C | 1 | 64 words | 64 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | 0.150 INCH, PLASTIC, MS-012AA, SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 30 | 5.72 | No | 5 V | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 240 | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 5 V | AUTOMOTIVE | 4.5 V | SYNCHRONOUS | 0.002 mA | 64X16 | 1.75 mm | 16 | 0.00003 A | 1024 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 10 ms | 100 | SOFTWARE | 8 | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CAT25080VE-GT3 | ON Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | 1 Week | YES | 8 | 8 | 5 MHz | ON SEMICONDUCTOR | ON Semiconductor | 751BD | CAT25080VE-GT3 | onsemi | 1 | 1024 words | 1000 | 125 °C | -40 °C | Bulk | PLASTIC/EPOXY | SOP | SOIC-8 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | Active | 40 | 5.5 | Compliant | Yes | 5 V | * | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 100 YEAR DATA RETENTION | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | ON Semiconductor | 5.5 V | 2/5 V | AUTOMOTIVE | 1.8 V | SYNCHRONOUS | 0.002 mA | 1KX8 | Halogen Free | 1.75 mm | 8 | 0.000002 A | 8192 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CAT24C02ZE-GT3A | ON Semiconductor | Datasheet | 160 | - | Min: 1 Mult: 1 | 1 Week | Surface Mount | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | YES | 8-MSOP | 8 | CAT24C02 | 0.4 MHz | ON SEMICONDUCTOR | ON Semiconductor | CAT24C02ZE-GT3A | Non-Volatile | onsemi | 1 | 256 words | 256 | 125 °C | -40 °C | Bulk | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.19 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | Active | 40 | 7.62 | Yes | 3.3 V | -40°C ~ 125°C (TA) | - | e4 | Yes | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | EEPROMs | EEPROM | 1.7V ~ 5.5V | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | S-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | AUTOMOTIVE | 1.8 V | 2Kbit | SYNCHRONOUS | 400 kHz | 0.002 mA | 900 ns | EEPROM | I²C | 256X8 | 1.2 mm | 8 | 5ms | 0.000005 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE | 1010DDDR | 256 x 8 | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CAT24C02HU4EGT3A | ON Semiconductor | Datasheet | 1600 | - | Min: 1 Mult: 1 | YES | 8 | Molex | 0.4 MHz | 1 | ON SEMICONDUCTOR | Molex | CAT24C02HU4EGT3A | 1 | 256 words | 256 | 125 °C | -40 °C | PLASTIC/EPOXY | HVSON | UDFN-8 | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | SON | NOT SPECIFIED | 7.81 | Not Applicable | Yes | 8542320050 | 3.3 V | T0001 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | Tools | CMOS | DUAL | NO LEAD | NOT SPECIFIED | 1 | 0.5 mm | unknown | 8 | R-PDSO-N8 | Not Qualified | 5.5 V | 2/5 V | AUTOMOTIVE | 1.8 V | SYNCHRONOUS | 0.002 mA | 256X8 | 0.55 mm | 8 | Hand Tools | 0.000005 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE | 1010DDDR | Other Tools | 3 mm | 2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CAT24C08ZI-G | ON Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | ON SEMICONDUCTOR | ON Semiconductor | CAT24C08ZI-G | 1 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MSOP-8 | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | NOT SPECIFIED | 5.49 | Yes | 3.3 V | e4 | Yes | Nickel/Palladium/Gold (Ni/Pd/Au) | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | S-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.002 mA | 8KX1 | 1.1 mm | 1 | 0.000001 A | 8192 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE | 1010DMMR | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 93C46B-I/STG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 3 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 93C46B-I/STG | 1 | 64 words | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | SOIC | 40 | 5.07 | Yes | 5 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 0.002 mA | 64X16 | 1.2 mm | 16 | 0.000001 A | 1024 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 4.4 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 93LC66C-I/PG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 3 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | 93LC66C-I/PG | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Active | DIP | NOT SPECIFIED | 5.17 | Yes | 2.5 V | e3 | Yes | EAR99 | Matte Tin (Sn) | ALSO CONFIGURABLE AS 512 X 8 | 8542.32.00.51 | EEPROMs | CMOS | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.002 mA | 256X16 | 5.33 mm | 16 | 0.000001 A | 4096 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 8 | 9.27 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 93AA46BT-I/STG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 1 MHz | MICROCHIP TECHNOLOGY INC | 93AA46BT-I/STG | 1 | 64 words | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | SOIC | 40 | 5.43 | Yes | 2.5 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.002 mA | 64X16 | 1.2 mm | 16 | 0.000001 A | 1024 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 4.4 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 93AA66A-I/STG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 1 MHz | MICROCHIP TECHNOLOGY INC | 93AA66A-I/STG | 1 | 512 words | 512 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | SOIC | 40 | 5.26 | Yes | 2.5 V | e3 | Yes | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.002 mA | 512X8 | 1.2 mm | 8 | 0.000001 A | 4096 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 4.4 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 93LC66C-I/STG | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 3 MHz | MICROCHIP TECHNOLOGY INC | 93LC66C-I/STG | 1 | 256 words | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | SOIC | 40 | 5.09 | Yes | 3 V | e3 | Yes | EAR99 | Matte Tin (Sn) | ALSO CONFIGURABLE AS 512 X 8 | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.002 mA | 256X16 | 1.2 mm | 16 | 0.000001 A | 4096 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 8 | 4.4 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR24T08FVM-WGTR | ROHM Semicon | Datasheet | 24000 |
| Min: 1 Mult: 1 | YES | 8 | 0.4 MHz | ROHM CO LTD | ROHM Semiconductor | BR24T08FVM-WGTR | 1024 words | 1000 | 85 °C | -40 °C | PLASTIC/EPOXY | VSSOP | HALOGEN FREE AND ROHS COMPLIANT, MSOP-8 | TSSOP8,.16 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | Active | MSOP | NOT SPECIFIED | 5.58 | Yes | 2.5 V | Yes | EEPROMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.7 V | SYNCHRONOUS | 0.002 mA | 1KX8 | 0.9 mm | 8 | 0.000002 A | 8192 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE | 1010DMMR | 2.9 mm | 2.8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M93C86-RMN6TP | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 1 MHz | STMICROELECTRONICS | M93C86-RMN6TP | 1 | 1024 words | 1000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | SOIC | 40 | 5.45 | 5 V | e4 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | STMicroelectronics | 5.5 V | 5 V | INDUSTRIAL | 1.8 V | SYNCHRONOUS | 0.002 mA | 1KX16 | 1.75 mm | 16 | 0.000002 A | 16384 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 10 ms | 40 | SOFTWARE | 8 | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M93C46-WBN3P/S | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 2 MHz | STMICROELECTRONICS | M93C46-WBN3P/S | 64 words | 64 | 125 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | NOT SPECIFIED | 5.7 | Yes | 5 V | e3 | EAR99 | Tin (Sn) | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 3/5 V | AUTOMOTIVE | 2.5 V | SYNCHRONOUS | 0.002 mA | 64X16 | 5.33 mm | 16 | 0.000005 A | 1024 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | SOFTWARE | 8 | 9.27 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT93C86A-10SQ-2.7-T | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | YES | 8 | 2 MHz | MICROCHIP TECHNOLOGY INC | AT93C86A-10SQ-2.7-T | 1024 words | 1000 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Active | NOT SPECIFIED | 5.72 | Yes | 5 V | Automotive grade | ALSO OPERATES AT 1MHZ AT 2.7MIN | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | R-PDSO-G8 | 5.5 V | AUTOMOTIVE | 4.5 V | SYNCHRONOUS | 0.002 mA | 1KX16 | 3-STATE | 1.75 mm | 16 | 0.000015 A | 16384 bit | AEC-Q100 | SERIAL | EEPROM | 5 V | MICROWIRE | 1000000 Write/Erase Cycles | 10 ms | 100 | 8 | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT93C46DU3-UU-T | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 years ago) | Axial | YES | 2 | Axial | 8 | 2 MHz | MICROCHIP TECHNOLOGY INC | Microchip Technology Inc | AT93C46DU3-UU-T | 64 words | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA8,2X4,40/20 | BGA8,2X4,40/20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | 5.52 | Compliant | Yes | 5 V | -65°C ~ 175°C | Bulk | Military, MIL-R-10509/7, RN55 | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±0.1% | Active | 2 | EAR99 | ±50ppm/°C | 9.88 kOhms | 85 °C | -40 °C | Metal Film | 0.125W, 1/8W | ALSO OPERATES AT 1MHZ AT 2.7MIN | 8542.32.00.51 | EEPROMs | CMOS | BOTTOM | BALL | 1 | 0.5 mm | compliant | R-PBGA-B8 | Not Qualified | 5 V | -- | 5.5 V | 2/5 V | INDUSTRIAL | 4.5 V | 5.5 V | 1.8 V | 128 B | SYNCHRONOUS | 0.002 mA | 64X16 | 0.85 mm | 16 | 0.000015 A | 1024 bit | 2 MHz | SERIAL | SEPARATE | EEPROM | 5 V | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 100 | SOFTWARE | 8 | Flame Retardant Coating, Military, Moisture Resistant, Safety | -- | 2 mm | 1.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR93C46-DW6TP | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | YES | - | Composite | - | 8 | - | BACC63CT19 | 2 MHz | Gold | Copper Alloy | ROHM CO LTD | ROHM Semiconductor | BR93C46-DW6TP | Amphenol Aerospace Operations | 1024 words | 1000 | 85 °C | -40 °C | Bulk | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP8,.25 | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSSOP | Composite | Active | 10 | 5.78 | Yes | 5 V | - | -65°C ~ 175°C | BACC63 | e3/e2 | Yes | Crimp | EAR99 | Plug, Female Sockets | 66 | TIN/TIN COPPER | Olive Drab | - | 8542.32.00.51 | Threaded | EEPROMs | - | CMOS | DUAL | A | GULL WING | - | 260 | 1 | - | 0.65 mm | compliant | Olive Drab Cadmium | 8 | 19-35 | R-PDSO-G8 | Not Qualified | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | - | 0.002 mA | - | 1KX1 | 1.2 mm | 1 | 0.000015 A | 1024 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 40 | SOFTWARE | Coupling Nut | 4.4 mm | 3 mm | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR24T04-W | ROHM Semiconductor | Datasheet | 1588 | - | Min: 1 Mult: 1 | NO | 8 | 0.4 MHz | 40 | ROHM CO LTD | Serial (2-Wire) | ROHM Semiconductor | BR24T04-W | 1 | Through Hole | 512 words | 512 | 5.5(V) | 1.6(V) | 1.8/2.5/3.3/5(V) | -40C to 85C | 85C | -40C | Industrial | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | DIP-T | Obsolete | Yes | No | NOT SPECIFIED | 8.5 | Yes | 2.5 V | Rail/Tube | e3 | Yes | Matte Tin (Sn) | EEPROMs | CMOS | DUAL | THROUGH-HOLE | 225 | 1 | 2.54 mm | compliant | 0.4(MHz) | 8 | R-PDIP-T8 | Not Qualified | 5.5 V | 1.8/5 V | INDUSTRIAL | 1.6 V | SYNCHRONOUS | 0.002 mA | 512x8 | 4.21 mm | 8 | 4096(Bit) | 0.000002 A | 4096 bit | 900(ns) | SERIAL | EEPROM | 1.6 TO 5.5 | I2C | 1000000 Write/Erase Cycles | 5 ms | 40 | Yes | 1010DDMR | 2(mA) | 9.3 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR24L01AF-W | ROHM Semiconductor | Datasheet | 1216 | - | Min: 1 Mult: 1 | YES | Aluminum | Rectangular, Fins | Assorted (BGA, LGA, CPU, ASIC...) | Blue Anodized | 8 | 0.1 MHz | ROHM CO LTD | ROHM Semiconductor | BR24L01AF-W | 128 words | 128 | 85 °C | -40 °C | PLASTIC/EPOXY | LSOP | LSOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | Active | SOIC | 10 | 5.4 | Yes | 2.5 V | pushPIN™ | e2 | Yes | Active | EAR99 | Top Mount | Tin/Copper (Sn/Cu) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | GULL WING | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | Not Qualified | 5.5 V | 2/5 V | INDUSTRIAL | 1.8 V | Push Pin | 0.374 (9.50mm) | 28.32°C/W @ 100 LFM | SYNCHRONOUS | 0.002 mA | 128X8 | 1.71 mm | 8 | 0.000002 A | 1024 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 40 | HARDWARE | 1010DDDR | -- | -- | -- | 1.772 (45.00mm) | 1.575 (40.00mm) |
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