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Memory (608)

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JESD-30 Code
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Supply Current-Max

Supply Current-Max:
0.003 mA

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Mounting Type	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Base Product Number	Bus Type	Clock Frequency-Max (fCLK)	Dimensions	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer Part Number	Maximum Operating Supply Voltage	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Package Type	Part Life Cycle Code	Part Package Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Samacsys Description	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Unit Weight	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Type	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Pin Count	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Interface	Max Supply Voltage	Min Supply Voltage	Memory Size	Operating Mode	Clock Frequency	Supply Current-Max	Access Time	Memory Format	Memory Interface	Data Bus Width	Organization	Output Characteristics	Seated Height-Max	Memory Width	Write Cycle Time - Word, Page	Density	Standby Current-Max	Memory Density	Max Frequency	Screening Level	Parallel/Serial	Memory IC Type	Serial Bus Type	Endurance	Write Cycle Time-Max (tWC)	Data Retention Time-Min	Write Protection	Data Polling	Page Size	I2C Control Byte	Reverse Pinout	Memory Organization	Height	Length	Width	Radiation Hardening
Mfr Part No 24LC014-I/PG	Microchip	Datasheet	-	-	Min: 1 Mult: 1			NO			8			0.4 MHz			MICROCHIP TECHNOLOGY INC		24LC014-I/PG											128 words	128	85 °C	-40 °C		PLASTIC/EPOXY	DIP	DIP, DIP8,.3	DIP8,.3	RECTANGULAR	IN-LINE		Active	DIP		NOT SPECIFIED	5.24		Yes					3 V						e3	Yes	EAR99		Matte Tin (Sn)				8542.32.00.51			DUAL	THROUGH-HOLE	NOT SPECIFIED	1	2.54 mm	compliant	8	R-PDIP-T8	Not Qualified		5.5 V	2/5 V	INDUSTRIAL	2.5 V					SYNCHRONOUS		0.003 mA					128X8		5.334 mm	8			0.000001 A	1024 bit			SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	5 ms	200	HARDWARE			1010DDDR				9.271 mm	7.62 mm
Mfr Part No 24LC16BH-E/MNY	Microchip	Datasheet	-	-	Min: 1 Mult: 1			YES	8		8			0.4 MHz			MICROCHIP TECHNOLOGY INC		24LC16BH-E/MNY											256 words	256	125 °C	-40 °C		PLASTIC/EPOXY	HVSON	2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8	SOLCC8,.11,20	RECTANGULAR	SMALL OUTLINE		Active	DFN			5.12	Compliant	Yes					2.5 V								EAR99			125 °C	-40 °C		8542.32.00.51			DUAL	NO LEAD		1	0.5 mm	compliant	8	R-PDSO-N8	Not Qualified	5 V	5.5 V	3/5 V	AUTOMOTIVE	1.7 V	I2C, Serial	5.5 V	2.5 V	2 kB	SYNCHRONOUS		0.003 mA	900 ns				256X8		0.8 mm	8		16 kb	0.000005 A	2048 bit	400 kHz		SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	5 ms	200	HARDWARE			1010MMMR				3 mm	2 mm	No
Mfr Part No 24LC04BH-I/MNY	Microchip	Datasheet	-	-	Min: 1 Mult: 1			YES			8			0.4 MHz			MICROCHIP TECHNOLOGY INC		24LC04BH-I/MNY											256 words	256	85 °C	-40 °C		PLASTIC/EPOXY	HVSON	HVSON, SOLCC8,.11,20	SOLCC8,.11,20	RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		Active	DFN			5.35		Yes							Automotive grade				e4		EAR99		Nickel/Palladium/Gold (Ni/Pd/Au)				8542.32.00.51			DUAL	NO LEAD		1	0.5 mm	compliant	8	R-PDSO-N8	Not Qualified		5.5 V	3/5 V	INDUSTRIAL	2.5 V					SYNCHRONOUS		0.003 mA					256X8	OPEN-DRAIN	0.8 mm	8			0.000005 A	4096 bit		ISO/TS-16949	SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	5 ms	200	HARDWARE	YES	16 words	1010XXMR	NO			3 mm	2 mm
Mfr Part No 24VL024H/MNY	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1			YES			8			0.1 MHz			MICROCHIP TECHNOLOGY INC		24VL024H/MNY											256 words	256	85 °C	-20 °C		PLASTIC/EPOXY	HVSON	2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8	SOLCC8,.11,20	RECTANGULAR	SMALL OUTLINE		Active	DFN		NOT SPECIFIED	5.41		Yes					1.8 V						e4		EAR99						8542.32.00.51			DUAL	NO LEAD	NOT SPECIFIED	1	0.5 mm	compliant	8	R-PDSO-N8	Not Qualified		3.6 V	1.8/3.3 V	OTHER	1.5 V					SYNCHRONOUS		0.003 mA					256X8		0.8 mm	8			0.000001 A	2048 bit			SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	5 ms	200	HARDWARE			1010DDDR				3 mm	2 mm
Mfr Part No 24LC64-I/MNY	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1			YES	8		8			0.4 MHz			MICROCHIP TECHNOLOGY INC		24LC64-I/MNY								1			8192 words	8000	85 °C	-40 °C		PLASTIC/EPOXY	VSON	VSON, SOLCC8,.11,20	SOLCC8,.11,20	RECTANGULAR	SMALL OUTLINE, VERY THIN PROFILE		Active	DFN		40	5.36	Compliant	Yes					5 V						e4	Yes	EAR99		Nickel/Palladium/Gold (Ni/Pd/Au)	85 °C	-40 °C		8542.32.00.51			DUAL	NO LEAD	260	1	0.5 mm	compliant	8	R-PDSO-N8	Not Qualified	5 V	5.5 V	3/5 V	INDUSTRIAL	2.5 V	I2C, Serial	5.5 V	2.5 V	8 kB	SYNCHRONOUS		0.003 mA	900 ns				8KX8		0.8 mm	8		64 kb	0.000001 A	65536 bit	400 kHz		SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	5 ms	200	HARDWARE			1010DDDR				3 mm	2 mm	No
Mfr Part No 24AA04-I/MNY	Microchip	Datasheet	-	-	Min: 1 Mult: 1			YES			8			0.1 MHz			MICROCHIP TECHNOLOGY INC		24AA04-I/MNY								1			512 words	512	85 °C	-40 °C		PLASTIC/EPOXY	HVSON	HVSON, SOLCC8,.11,20	SOLCC8,.11,20	RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		Active	DFN		40	5.39		Yes											e4	Yes	EAR99		Nickel/Palladium/Gold (Ni/Pd/Au)				8542.32.00.51			DUAL	NO LEAD	260	1	0.5 mm	compliant	8	R-PDSO-N8	Not Qualified		5.5 V		INDUSTRIAL	1.7 V					SYNCHRONOUS		0.003 mA					512X8		0.8 mm	8			0.000001 A	4096 bit			SERIAL	EEPROM	I2C		5 ms	200	HARDWARE				NO			3 mm	2 mm
Mfr Part No 24AA64-I/MNY	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1			YES			8			0.4 MHz			MICROCHIP TECHNOLOGY INC		24AA64-I/MNY								1			8192 words	8000	85 °C	-40 °C		PLASTIC/EPOXY	VSON	VSON, SOLCC8,.11,20	SOLCC8,.11,20	RECTANGULAR	SMALL OUTLINE, VERY THIN PROFILE		Active	DFN		40	5.36		Yes					2.5 V						e4	Yes	EAR99		Nickel/Palladium/Gold (Ni/Pd/Au)				8542.32.00.51			DUAL	NO LEAD	260	1	0.5 mm	compliant	8	R-PDSO-N8	Not Qualified		5.5 V	2/5 V	INDUSTRIAL	1.7 V					SYNCHRONOUS		0.003 mA					8KX8		0.8 mm	8			0.000001 A	65536 bit			SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	5 ms	200	HARDWARE			1010DDDR				3 mm	2 mm
Mfr Part No 24VL025/MNY	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1			YES			8			0.4 MHz			MICROCHIP TECHNOLOGY INC		24VL025/MNY								1			256 words	256	85 °C	-20 °C		PLASTIC/EPOXY	HVSON	2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8	SOLCC8,.11,20	RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		Active	DFN		40	5.6		Yes					1.8 V						e4	Yes	EAR99		Nickel/Palladium/Gold (Ni/Pd/Au)				8542.32.00.51			DUAL	NO LEAD	260	1	0.5 mm	compliant	8	R-PDSO-N8	Not Qualified		3.6 V	1.8/3.3 V	OTHER	1.5 V					SYNCHRONOUS		0.003 mA					256X8		0.8 mm	8			0.000001 A	2048 bit			SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	5 ms	200	SOFTWARE			1010DDDR				3 mm	2 mm
Mfr Part No 24LC02B-I/MNY	Microchip	Datasheet	-	-	Min: 1 Mult: 1			YES			8			0.4 MHz			MICROCHIP TECHNOLOGY INC		24LC02B-I/MNY								1			256 words	256	85 °C	-40 °C		PLASTIC/EPOXY	HVSSOP	2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8	SOLCC8,.11,20	RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH		Active	DFN		40	5.38		Yes					5 V						e4	Yes	EAR99		Nickel/Palladium/Gold (Ni/Pd/Au)				8542.32.00.51			DUAL	GULL WING	260	1	0.5 mm	compliant	8	R-PDSO-G8	Not Qualified		5.5 V	3/5 V	INDUSTRIAL	2.5 V					SYNCHRONOUS		0.003 mA					256X8		0.8 mm	8			0.000001 A	2048 bit			SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	5 ms	200	HARDWARE			1010XXXR				3 mm	2 mm
Mfr Part No 24AA32A-I/MNY	Microchip	Datasheet	-	-	Min: 1 Mult: 1			YES			8			0.1 MHz			MICROCHIP TECHNOLOGY INC		24AA32A-I/MNY								1			4096 words	4000	85 °C	-40 °C		PLASTIC/EPOXY	VSON	VSON, SOLCC8,.11,20	SOLCC8,.11,20	RECTANGULAR	SMALL OUTLINE, VERY THIN PROFILE		Active	DFN		40	5.36		Yes					2.5 V						e4	Yes	EAR99		Nickel/Palladium/Gold (Ni/Pd/Au)			2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED	8542.32.00.51			DUAL	NO LEAD	260	1	0.5 mm	compliant	8	R-PDSO-N8	Not Qualified		5.5 V	2/5 V	INDUSTRIAL	1.7 V					SYNCHRONOUS		0.003 mA					4KX8		0.8 mm	8			0.000001 A	32768 bit			SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	5 ms	200	HARDWARE			1010DDDR				3 mm	2 mm
Mfr Part No 24AA025-I/MNY	Microchip	Datasheet	-	-	Min: 1 Mult: 1			YES			8			0.4 MHz			MICROCHIP TECHNOLOGY INC		24AA025-I/MNY								1			256 words	256	85 °C	-40 °C		PLASTIC/EPOXY	HVSON	2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8	SOLCC8,.11,20	RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		Active	DFN		40	5.36		Yes					2.5 V						e4	Yes	EAR99		NICKEL PALLADIUM GOLD				8542.32.00.51			DUAL	NO LEAD	260	1	0.5 mm	compliant	8	R-PDSO-N8	Not Qualified		5.5 V	2/5 V	INDUSTRIAL	1.7 V					SYNCHRONOUS		0.003 mA					256X8		0.8 mm	8			0.000001 A	2048 bit			SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	5 ms	200				1010DDDR				3 mm	2 mm
Mfr Part No 24LC16B-I/MNY	Microchip	Datasheet	-	-	Min: 1 Mult: 1			YES	8		8			0.4 MHz			MICROCHIP TECHNOLOGY INC		24LC16B-I/MNY								1			2048 words	2000	85 °C	-40 °C		PLASTIC/EPOXY	VSSOP	2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8	SOLCC8,.11,20	RECTANGULAR	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH		Active	DFN		40	5.12	Compliant	Yes					5 V						e4	Yes	EAR99		Nickel/Palladium/Gold (Ni/Pd/Au)	85 °C	-40 °C		8542.32.00.51			DUAL	GULL WING	260	1	0.5 mm	compliant	8	R-PDSO-G8	Not Qualified	5 V	5.5 V	3/5 V	INDUSTRIAL	2.5 V	I2C, Serial	5.5 V	2.5 V	2 kB	SYNCHRONOUS		0.003 mA	900 ns				2KX8		0.8 mm	8		16 kb	0.000001 A	16384 bit	400 kHz		SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	5 ms	200	HARDWARE			1010MMMR				3 mm	2 mm	No
Mfr Part No 24LC64T-E/MC	Microchip	Datasheet	-	-	Min: 1 Mult: 1			YES			8			0.4 MHz			MICROCHIP TECHNOLOGY INC		24LC64T-E/MC								1			8192 words	8000	125 °C	-40 °C		PLASTIC/EPOXY	VSON	VSON, SOLCC8,.11,20	SOLCC8,.11,20	RECTANGULAR	SMALL OUTLINE, VERY THIN PROFILE		Active	DFN		40	5.2		Yes					5 V						e3	Yes	EAR99		Matte Tin (Sn)				8542.32.00.51			DUAL	NO LEAD	260	1	0.5 mm	compliant	8	R-PDSO-N8	Not Qualified		5.5 V	3/5 V	AUTOMOTIVE	2.5 V					SYNCHRONOUS		0.003 mA					8KX8		1 mm	8			0.000001 A	65536 bit			SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	5 ms	200	HARDWARE			1010DDDR				3 mm	2 mm
Mfr Part No 24AA52-I/SNG	Microchip	Datasheet	-	-	Min: 1 Mult: 1			YES			8						MICROCHIP TECHNOLOGY INC		24AA52-I/SNG											256 words	256	85 °C	-40 °C		PLASTIC/EPOXY	SOP		SOP8,.25	RECTANGULAR	SMALL OUTLINE		Active				5.47		Yes											e3				Matte Tin (Sn)							DUAL	GULL WING			1.27 mm	compliant		R-PDSO-G8	Not Qualified			2/5 V	INDUSTRIAL								0.003 mA					256X8			8			0.000001 A	2048 bit			SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles		200	HARDWARE/SOFTWARE			1010DDDR
Mfr Part No 24LC02B-E/MNY	Microchip	Datasheet	-	-	Min: 1 Mult: 1			YES			8			0.4 MHz			MICROCHIP TECHNOLOGY INC		24LC02B-E/MNY								1			256 words	256	125 °C	-40 °C		PLASTIC/EPOXY	HVSSOP	2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8	SOLCC8,.11,20	RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH		Active	DFN		40	5.38	Compliant	Yes					5 V						e4	Yes	EAR99		Nickel/Palladium/Gold (Ni/Pd/Au)				8542.32.00.51			DUAL	GULL WING	260	1	0.5 mm	compliant	8	R-PDSO-G8	Not Qualified		5.5 V	3/5 V	AUTOMOTIVE	2.5 V					SYNCHRONOUS		0.003 mA					256X8		0.8 mm	8			0.000005 A	2048 bit			SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	5 ms	200	HARDWARE			1010XXXR				3 mm	2 mm
Mfr Part No 24LCS62/ST	Microchip	Datasheet	-	-	Min: 1 Mult: 1			YES			8			0.1 MHz			MICROCHIP TECHNOLOGY INC		24LCS62/ST								1			256 words	256	70 °C			PLASTIC/EPOXY	TSSOP	TSSOP-8	TSSOP8,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		Obsolete	SOIC		40	5.84		Yes					3.3 V						e3	Yes	EAR99		Matte Tin (Sn)			1000000 ERASE/WRITE CYCLES GUARANTEED	8542.32.00.51			DUAL	GULL WING	260	1	0.65 mm	unknown	8	R-PDSO-G8	Not Qualified		5.5 V	3/5 V	COMMERCIAL	2.5 V					SYNCHRONOUS		0.003 mA					256X8		1.1 mm	8			0.00005 A	2048 bit			SERIAL	EEPROM	I2C	10000000 Write/Erase Cycles	10 ms		SOFTWARE			0110TCCC				4.4 mm	3 mm
Mfr Part No FM25L16B-G	Infineon Technologies	Datasheet	2 In Stock	-	Min: 1 Mult: 1	Surface Mount	SOIC-8	YES		8-SOIC	8	FM25L16	Serial (SPI)		4.97 x 3.98 x 1.48mm	1940	CYPRESS SEMICONDUCTOR CORP	SPI	FM25L16B-G	3.6 V	+ 85 C	Non-Volatile	Infineon Technologies	2.7 V	- 40 C	Yes	3	Surface Mount	SMD/SMT	2k	2000	85 °C	-40 °C	Tube	PLASTIC/EPOXY	SOP	SOP, SOP8,.25	SOP8,.25	RECTANGULAR	SMALL OUTLINE	SOIC	Active	SOIC	Active	30	0.81	Details	Yes	FRAM 16kbit serial 20MHz SPI 3V SOIC8	SOIC	3.6 V	2.7 V	3.3 V	0.019048 oz	Industrial grade	-40 to 85 °C	Tube	FM25L16B-G	e3	Yes	EAR99	FRAM	Matte Tin (Sn)				8542.32.00.71	FRAM (Ferroelectric RAM)	2.7V ~ 3.6V	DUAL	GULL WING	260	1	1.27 mm	compliant	8	R-PDSO-G8	Not Qualified	3.3 V	3.6 V	3/3.3 V	INDUSTRIAL	2.7 V				16 kbit	SYNCHRONOUS	20 MHz	0.003 mA	10 ms	FRAM	SPI	8 Bit	2 k x 8		1.75 mm	8	-	16 Kb	0.000006 A	16		Industrial		MEMORY CIRCUIT										2K x 8	1.48mm	4.97mm	3.98mm
Mfr Part No FM25CL64B-GTR	Infineon Technologies	Datasheet	72000 In Stock	-	Min: 1 Mult: 1	Surface Mount	SOIC-8	YES		8-SOIC	8	FM25CL64	Serial (SPI)			2500	CYPRESS SEMICONDUCTOR CORP	SPI	FM25CL64B-GTR		+ 85 C	Non-Volatile	Infineon Technologies		- 40 C	Yes	3	Surface Mount	SMD/SMT	8192 words	8000	85 °C	-40 °C	Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;	PLASTIC/EPOXY	SOP	SOP, SOP8,.25	SOP8,.25	RECTANGULAR	SMALL OUTLINE		Active	SOIC	Active	30	0.82	Details	Yes		SOIC	3.65 V	2.7 V	3.3 V	0.019048 oz	Industrial grade	-40 to 85 °C	MouseReel	FM25CL64B-G	e3		EAR99	FRAM	Tin (Sn)				8542.32.00.71	FRAM (Ferroelectric RAM)	2.7V ~ 3.65V	DUAL	GULL WING	260	1	1.27 mm	compliant	8	R-PDSO-G8	Not Qualified	3.3 V	3.65 V	3.3 V	INDUSTRIAL	2.7 V				64 kbit	SYNCHRONOUS	20 MHz	0.003 mA		FRAM	SPI	8 Bit	8 k x 8		1.75 mm	8	-	64 Kb	0.000006 A	65536 bit		Industrial		MEMORY CIRCUIT										8K x 8		4.9 mm	3.9 mm
Mfr Part No IS24C01-2GI	Integrated Silicon Solution, Inc. (ISSI)	Datasheet	-	-	Min: 1 Mult: 1			YES			8			0.1 MHz			INTEGRATED SILICON SOLUTION INC		IS24C01-2GI											128 words	128	85 °C	-40 °C		PLASTIC/EPOXY	SOP	SOIC-8	SOP8,.25	RECTANGULAR	SMALL OUTLINE		Obsolete	SOIC		NOT SPECIFIED	5.91		No					2.5 V						e0	No	EAR99		Tin/Lead (Sn/Pb)				8542.32.00.51			DUAL	GULL WING	NOT SPECIFIED	1	1.27 mm	unknown	8	R-PDSO-G8	Not Qualified		5.5 V	2/5 V	INDUSTRIAL	1.8 V					SYNCHRONOUS		0.003 mA					128X8		1.75 mm	8			0.000004 A	1024 bit			SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	10 ms	100	HARDWARE			1010DDDR				4.9 mm	3.9 mm
Mfr Part No IS24C01B-2ZLI-TR	Integrated Silicon Solution, Inc. (ISSI)	Datasheet	-	-	Min: 1 Mult: 1			YES			8			0.4 MHz			INTEGRATED SILICON SOLUTION INC		IS24C01B-2ZLI-TR											128 words	128	85 °C	-40 °C		PLASTIC/EPOXY	TSOP1	3 X 4.40 MM, LEAD FREE, MO-153, TSSOP-8	TSSOP8,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE		Obsolete	TSSOP			5.83		Yes					2.5 V								EAR99						8542.32.00.51			DUAL	GULL WING		1	0.65 mm	compliant	8	R-PDSO-G8	Not Qualified		5.5 V	2/5 V	INDUSTRIAL	1.8 V					SYNCHRONOUS		0.003 mA					128X8		1.2 mm	8			0.000001 A	1024 bit			SERIAL	EEPROM	I2C	1000000 Write/Erase Cycles	5 ms	100	HARDWARE			1010DDDR				4.4 mm	3 mm

Memory (608)