The category is 'Memory'
Memory (40)
- All Manufacturers
- Access Time-Max
- Ihs Manufacturer
- JESD-30 Code
- Memory Density
- Memory IC Type
- Memory Width
- Number of Terminals
- Number of Words
- Number of Words Code
- Operating Temperature-Max
- Package Body Material
- Supply Current-Max
- Supply Current-Max:
0.045 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mount | Mounting Type | Surface Mount | Number of Pins | Shell Material | Insert Material | Number of Terminals | Access Time-Max | Address Bus Width (bit) | Automotive | Chip Density (bit) | Contact Materials | Contact Sizes | Data Rate Architecture | ECCN (US) | EU RoHS | Ihs Manufacturer | Insert Arrangement | Lead Shape | Manufacturer | Manufacturer Part Number | Max. Access Time (ns) | Maximum Operating Supply Voltage (V) | Maximum Operating Temperature (°C) | Minimum Operating Supply Voltage (V) | Minimum Operating Temperature (°C) | Moisture Sensitivity Levels | Mounting | Number of Elements | Number of Bits/Word (bit) | Number of Words | Number of Words Code | Operating Current (mA) | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Height | Package Length | Package Shape | Package Style | Package Width | Part Life Cycle Code | Part Package Code | PCB changed | PPAP | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Service Rating | Standard Package Name | Supplier Package | Supplier Temperature Grade | Supply Voltage-Nom (Vsup) | Timing Type | Typical Operating Supply Voltage (V) | Packaging | JESD-609 Code | Pbfree Code | Part Status | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Contact Style | Temperature Grade | Supply Voltage-Min (Vsup) | Sealing | Max Supply Voltage | Min Supply Voltage | Wire/Cable Type | Number of Ports | Nominal Supply Current | Operating Mode | Propagation Delay | Quiescent Current | Supply Current-Max | Turn On Delay Time | Access Time | Logic Function | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Wire/Cable Diameter | Density | Standby Current-Max | Memory Density | Screening Level | High Level Output Current | Parallel/Serial | I/O Type | Low Level Output Current | Sync/Async | Word Size | Memory IC Type | Programming Voltage | Independent Circuits | Insertion Loss (dB) | Endurance | Write Cycle Time-Max (tWC) | Mode | Data Retention Time-Min | Wire/Cable Color | Standby Voltage-Min | Shell Plating | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Output Enable | Number of Sectors/Size | Sector Size | Return Loss | Page Size | Schmitt Trigger Input | Ready/Busy | Boot Block | Common Flash Interface | Reverse Pinout | Length | Width | Radiation Hardening |
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![]() | Mfr Part No AT49SV322A-80TU | Atmel | Datasheet | 993 | - | Min: 1 Mult: 1 | YES | 48 | 80 ns | ATMEL CORP | Atmel Corporation | AT49SV322A-80TU | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | 12 X 20 MM, GREEN, PLASTIC, MO-142DD, TSOP1-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | 40 | 5.8 | Yes | 1.8 V | e3 | Yes | 3A991.B.1.A | NOR TYPE | Matte Tin (Sn) | 8542.32.00.51 | Flash Memories | CMOS | DUAL | GULL WING | 260 | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 1.95 V | 1.8 V | INDUSTRIAL | 1.65 V | ASYNCHRONOUS | 0.045 mA | 2MX16 | 1.2 mm | 16 | 0.000025 A | 33554432 bit | PARALLEL | FLASH | 1.8 V | 8 | YES | YES | YES | 8,63 | 8K,64K | 4/8 words | YES | BOTTOM | YES | 18.4 mm | 12 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS29GL064L-70GLI | ISSI | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 70 ns | INTEGRATED SILICON SOLUTION INC | Integrated Silicon Solution Inc | IS29GL064L-70GLI | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA64,8X8,40 | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | 5.73 | Yes | 3 V | NOR TYPE | LOWEST ADDRESS SECTOR PROTECTED | Flash Memories | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B56 | Not Qualified | 3.6 V | 3/3.3 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.045 mA | 4MX16 | 1.4 mm | 16 | 0.00002 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 64K | 8/16 words | YES | YES | 13 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TC5563APL-15 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 150 ns | TOSHIBA CORP | 8192 words | 8000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP28,.3 | DIP28,.3 | RECTANGULAR | IN-LINE | Active | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 28 | R-PDIP-T28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.045 mA | 8KX8 | 3-STATE | 4.45 mm | 8 | 0.0001 A | 65536 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | 34.9 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K6T4016U3C-RB10 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 100 ns | SAMSUNG SEMICONDUCTOR INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSOP2-R | TSOP2-R, TSOP44,.46,32 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | No | 3 V | No | 3A991.B.2.A | 8542.32.00.41 | DUAL | GULL WING | 240 | 1 | 0.8 mm | compliant | 30 | 44 | R-PDSO-G44 | Not Qualified | 3.3 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.045 mA | 256KX16 | 3-STATE | 1.2 mm | 16 | 4194304 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | 18.41 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT28C16E-15LM/883 | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 150 ns | ATMEL CORP | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | QCCN, LCC32,.45X.55 | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | BULK ERASE; AUTOMATIC WRITE | 8542.32.00.51 | QUAD | NO LEAD | 1 | 1.27 mm | unknown | 32 | R-CQCC-N32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.045 mA | 2KX8 | 3-STATE | 2.54 mm | 8 | 0.0001 A | 16384 bit | 38535Q/M;38534H;883B | PARALLEL | EEPROM | 5 V | 100000 Write/Erase Cycles | 0.2 ms | YES | NO | NO | 13.97 mm | 11.43 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BR62256F-70LL | ROHM Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 70 ns | ROHM CO LTD | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.45 | SOP28,.45 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | Yes | 5 V | EAR99 | 8542.32.00.41 | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | 28 | R-PDSO-G28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.045 mA | 32KX8 | 3-STATE | 2.85 mm | 8 | 0.000001 A | 262144 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | 18 mm | 8.4 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SRM2B256SLCX70 | Seiko Epson Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 70 ns | SEIKO EPSON CORP | 32768 words | 32000 | 85 °C | -25 °C | PLASTIC/EPOXY | DIP | 0.600 INCH, PLASTIC, DIP2-28 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | TIN LEAD | AT SUPPLY VOLTAGE 3V, ACCESS TIME=120NANO SECOND | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T28 | Not Qualified | 5.5 V | OTHER | 4.5 V | 1 | ASYNCHRONOUS | 0.045 mA | 32KX8 | 3-STATE | 4.7 mm | 8 | 0.000025 A | 262144 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | 36.7 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT28C64-12TI | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 120 ns | ATMEL CORP | 3 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP28,.53,22 | TSSOP28,.53,22 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP | No | 5 V | e0 | EAR99 | TIN LEAD | 10K OR 100K ENDURANCE CYCLES; 10 YEARS DATA RETENTION; SELF-TIMED BYTE WRITE CYCLE | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 0.5 mm | compliant | 28 | R-PDSO-G28 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.045 mA | 8KX8 | 3-STATE | 1.2 mm | 8 | 0.0001 A | 65536 bit | PARALLEL | EEPROM | 5 V | 10000 Write/Erase Cycles | 1 ms | 10 | YES | NO | NO | YES | 11.8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No HM9264BLFP-10L | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 100 ns | RENESAS ELECTRONICS CORP | 8192 words | 8000 | 70 °C | PLASTIC/EPOXY | SOP | SOP28,.45 | RECTANGULAR | SMALL OUTLINE | Obsolete | 5 V | EAR99 | 8542.32.00.41 | DUAL | GULL WING | 1.27 mm | compliant | R-PDSO-G28 | Not Qualified | COMMERCIAL | ASYNCHRONOUS | 0.045 mA | 8KX8 | 3-STATE | 8 | 0.000025 A | 65536 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT28C64-25DI | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 250 ns | ATMEL CORP | 8192 words | 8000 | 85 °C | -40 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | EAR99 | TIN LEAD | AUTOMATIC WRITE | 8542.32.00.51 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | 28 | R-GDIP-T28 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.045 mA | 8KX8 | 3-STATE | 5.72 mm | 8 | 0.0001 A | 65536 bit | MIL-STD-883 | PARALLEL | EEPROM | 5 V | 1 ms | YES | NO | NO | YES | 37.25 mm | 15.24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No UM6264AM-10L | United Microelectronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 100 ns | UNITED MICROELECTRONICS CORP | 8192 words | 8000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.5 | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.41 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G28 | Not Qualified | COMMERCIAL | ASYNCHRONOUS | 0.045 mA | 8KX8 | 3-STATE | 8 | 0.0001 A | 65536 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No WS57C291-55T | Waferscale Integration Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 55 ns | WAFERSCALE INTEGRATION INC | 2048 words | 2000 | 70 °C | CERAMIC | DIP | DIP24,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-XDIP-T24 | Not Qualified | COMMERCIAL | ASYNCHRONOUS | 0.045 mA | 2KX8 | 3-STATE | 8 | 0.045 A | 16384 bit | PARALLEL | COMMON | UVPROM | 13.5 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K6X8016T3B-TQ70 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 70 ns | SAMSUNG SEMICONDUCTOR INC | 524288 words | 512000 | 125 °C | -40 °C | PLASTIC/EPOXY | TSOP | TSOP, TSOP44,.46,32 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | No | e0 | No | 3A991.B.2.A | TIN LEAD | 8542.32.00.41 | DUAL | GULL WING | 0.8 mm | compliant | R-PDSO-G44 | Not Qualified | AUTOMOTIVE | ASYNCHRONOUS | 0.045 mA | 512KX16 | 3-STATE | 16 | 0.00008 A | 8388608 bit | PARALLEL | COMMON | STANDARD SRAM | 1.5 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TC5332202AP | Toshiba America Electronic Components | Datasheet | 15 | - | Min: 1 Mult: 1 | NO | 42 | 120 ns | TOSHIBA CORP | 2097152 words | 2000000 | 70 °C | -10 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | EAR99 | TIN LEAD | TTL COMPATIBLE I/O | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 42 | R-PDIP-T42 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.045 mA | 2MX16 | 4.8 mm | 16 | 33554432 bit | PARALLEL | MASK ROM | 53.2 mm | 15.24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TC531001CP | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 150 ns | TOSHIBA CORP | 131072 words | 128000 | 70 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.600 INCH, PLASTIC, DIP-32 | DIP32,.6 | RECTANGULAR | IN-LINE | Active | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 32 | R-PDIP-T32 | Not Qualified | 5.5 V | OTHER | 4.5 V | ASYNCHRONOUS | 0.045 mA | 128KX8 | 3-STATE | 4.8 mm | 8 | 0.0002 A | 1048576 bit | PARALLEL | MASK ROM | 42 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K6X8016T3B-TF70000 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 44 | 44 | 70 ns | 19 | No | 8M | SDR | 3A991.b.2.a | Not Compliant | SAMSUNG SEMICONDUCTOR INC | Gull-wing | Samsung Semiconductor | K6X8016T3B-TF70000 | 70 | 3.6 | 85 | 2.7 | -40 | 1 | Surface Mount | 16 | 512K | 512000 | 30 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP | TSOP, TSOP44,.46,32 | TSOP44,.46,32 | 1 | 18.81(Max) | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 10.16 | Obsolete | 44 | No | NOT SPECIFIED | 5.92 | Non-Compliant | No | SOP | TSOP-II | Industrial | Asynchronous | 3|3.3 | Tray | No | Obsolete | 85 °C | -40 °C | SRAMs | CMOS | DUAL | GULL WING | 225 | 0.8 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 3/3.3 V | INDUSTRIAL | 3.6 V | 2.7 V | 1 | 30 mA | ASYNCHRONOUS | 0.045 mA | 70 ns | 512KX16 | 3-STATE | 16 | 19 b | 8 Mb | 0.000015 A | 8388608 bit | PARALLEL | COMMON | Asynchronous | 16 b | STANDARD SRAM | 1.5 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT28C16-25SI | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 24 | 250 ns | ATMEL CORP | AT28C16-25SI | 2048 words | 2000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP24,.4 | SOP24,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 30 | 8.35 | No | 5 V | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | compliant | 24 | R-PDSO-G24 | Not Qualified | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.045 mA | 2KX8 | 3-STATE | 2.65 mm | 8 | 0.0001 A | 16384 bit | PARALLEL | EEPROM | 5 V | 10000 Write/Erase Cycles | 1 ms | 10 | YES | NO | NO | 15.4 mm | 7.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AM29DL323DT-70REI | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | ADVANCED MICRO DEVICES INC | AMD | AM29DL323DT70REI | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | TSOP1 | 5.13 | Non-Compliant | No | 3.3 V | e0 | 3A991.B.1.A | NOR TYPE | Tin/Lead (Sn/Pb) | Orange | MINIMUM 1000K PROGRAM/ERASE CYCLE; 20 YEAR DATA RETENTION | 8542.32.00.51 | Flash Memories | CMOS | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | Twin Zip | ASYNCHRONOUS | 0.045 mA | 2MX16 | 1.2 mm | 16 | 1.8 mm | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | 0.5 dB | Multimode | 20 | Orange | 8 | YES | YES | YES | 8,63 | 8K,64K | 0 dB | YES | TOP | YES | 64 m | 12 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS29GL064T-70TLI | ISSI | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 16 | 48 | 70 ns | INTEGRATED SILICON SOLUTION INC | Integrated Silicon Solution Inc | IS29GL064T-70TLI | 2 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | NOT SPECIFIED | 5.5 | Compliant | Yes | 3 V | Tape & Reel (TR) | NOR TYPE | 125 °C | -40 °C | TOP BOOT SECTOR | Flash Memories | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | compliant | R-PDSO-G48 | Not Qualified | 5 V | 3.6 V | 3/3.3 V | INDUSTRIAL | 2.7 V | 6 V | 2 V | ASYNCHRONOUS | 19 ns | 8 µA | 0.045 mA | 370 ns | Multivibrator | 4MX16 | 1.2 mm | 16 | 0.00002 A | 67108864 bit | -5.2 mA | PARALLEL | 5.2 mA | FLASH | 3 V | 2 | 8 | YES | YES | YES | 8,127 | 8K,64K | 8/16 words | Yes | YES | TOP | YES | 18.4 mm | 12 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AM29DL800BB90EF | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | 50 microinches Gold Plate | Wall - Front Mount - Thru Holes | YES | Composite | Hard Dielectric | 48 | 90 ns | Copper Alloy | 6#20 | SPANSION INC | B98 | Spansion | AM29DL800BB90EF | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | LEAD FREE, MO-142BDD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | 40 | 5.15 | Yes | I | 3 V | e3 | Yes | EAR99 | NOR TYPE | Matte Tin (Sn) | BOTTOM BOOT BLOCK | 8542.32.00.51 | Flash Memories | CMOS | DUAL | GULL WING | Yes | 260 | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | 3/3.3 V | Socket | INDUSTRIAL | 2.7 V | Meets IP67 | ASYNCHRONOUS | 0.045 mA | 512KX16 | 1.2 mm | 16 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 3 V | Electroless Nickel | 8 | YES | YES | YES | 2,4,2,14 | 16K,8K,32K,64K | YES | BOTTOM | 18.4 mm | 12 mm |
AT49SV322A-80TU
Atmel
Package:Memory
Price: please inquire
IS29GL064L-70GLI
ISSI
Package:Memory
Price: please inquire
TC5563APL-15
Toshiba America Electronic Components
Package:Memory
Price: please inquire
K6T4016U3C-RB10
Samsung Semiconductor
Package:Memory
Price: please inquire
AT28C16E-15LM/883
Atmel Corporation
Package:Memory
Price: please inquire
BR62256F-70LL
ROHM Semiconductor
Package:Memory
Price: please inquire
SRM2B256SLCX70
Seiko Epson Corporation
Package:Memory
Price: please inquire
AT28C64-12TI
Atmel Corporation
Package:Memory
Price: please inquire
HM9264BLFP-10L
Renesas Electronics Corporation
Package:Memory
Price: please inquire
AT28C64-25DI
Atmel Corporation
Package:Memory
Price: please inquire
UM6264AM-10L
United Microelectronics Corporation
Package:Memory
Price: please inquire
WS57C291-55T
Waferscale Integration Inc
Package:Memory
Price: please inquire
K6X8016T3B-TQ70
Samsung Semiconductor
Package:Memory
Price: please inquire
TC5332202AP
Toshiba America Electronic Components
Package:Memory
Price: please inquire
TC531001CP
Toshiba America Electronic Components
Package:Memory
Price: please inquire
K6X8016T3B-TF70000
Samsung Semiconductor
Package:Memory
Price: please inquire
AT28C16-25SI
Atmel (Microchip Technology)
Package:Memory
Price: please inquire
AM29DL323DT-70REI
AMD
Package:Memory
Price: please inquire
IS29GL064T-70TLI
ISSI
Package:Memory
Price: please inquire
AM29DL800BB90EF
Spansion
Package:Memory
Price: please inquire
