The category is 'Memory'
Memory (144)
- All Manufacturers
- Ihs Manufacturer
- JESD-30 Code
- Memory Density
- Memory IC Type
- Memory Width
- Number of Terminals
- Number of Words
- Number of Words Code
- Operating Temperature-Max
- Organization
- Package Code
- Supply Current-Max
- Supply Current-Max:
0.05 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Ihs Manufacturer | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Endurance | Write Cycle Time-Max (tWC) | Data Retention Time-Min | Standby Voltage-Min | Data Polling | Toggle Bit | Command User Interface | Output Enable | Page Size | Refresh Cycles | Access Mode | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No AM27C128-250/BXA | AMD | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 250 ns | ADVANCED MICRO DEVICES INC | 16384 words | 16000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | WDIP | WDIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | Obsolete | DIP | No | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 28 | R-GDIP-T28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.05 mA | 16KX8 | 3-STATE | 5.588 mm | 8 | 0.00012 A | 131072 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | UVPROM | 5 V | 37.1475 mm | 15.24 mm | ||||||||||||||
| Mfr Part No SST29EE010-120-4I-EH | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | SILICON STORAGE TECHNOLOGY INC | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP32,.8,20 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G32 | Not Qualified | INDUSTRIAL | 0.05 mA | 128KX8 | 8 | 0.00005 A | 1048576 bit | PARALLEL | EEPROM | YES | YES | NO | 128 words | |||||||||||||||||||||||
| Mfr Part No KM41C1000DJ-8 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | 80 ns | SAMSUNG SEMICONDUCTOR INC | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOJ | SOJ, SOJ20/26,.34 | SOJ20/26,.34 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOJ | No | 5 V | e0 | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | J BEND | 1 | 1.27 mm | unknown | 20 | R-PDSO-J20 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.05 mA | 1MX1 | 3-STATE | 3.76 mm | 1 | 0.001 A | 1048576 bit | SEPARATE | FAST PAGE DRAM | 512 | FAST PAGE | 17.145 mm | 7.62 mm | ||||||||||||||
 | Mfr Part No M27C202-80F1 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 80 ns | STMICROELECTRONICS | 131072 words | 128000 | 70 °C | CERAMIC, GLASS-SEALED | WDIP | FRIT SEALED, WINDOWED, CERAMIC, DIP-40 | DIP40,.6 | RECTANGULAR | IN-LINE, WINDOW | Obsolete | DIP | Yes | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 40 | R-GDIP-T40 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX16 | 3-STATE | 5.97 mm | 16 | 0.0001 A | 2097152 bit | PARALLEL | COMMON | UVPROM | 52.195 mm | 15.24 mm | |||||||||||||||||
 | Mfr Part No CXK5T16100TM-12LLX | Sony Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 120 ns | SONY CORP | 65536 words | 64000 | 85 °C | -25 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP44,.46,32 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | 3.3 V | EAR99 | 8542.32.00.41 | DUAL | GULL WING | 1 | 0.8 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 0.05 mA | 64KX16 | 3-STATE | 1.2 mm | 16 | 0.000028 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | 18.41 mm | 10.16 mm | ||||||||||||||||||
| Mfr Part No X28C010KMB-25 | Xicor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 36 | 250 ns | XICOR INC | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | CERAMIC, PGA-36 | PGA36,7X7 | SQUARE | GRID ARRAY | Obsolete | No | 5 V | e0 | TIN LEAD | PAGE WRITE | PERPENDICULAR | PIN/PEG | 1 | 2.54 mm | unknown | S-CPGA-P36 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX8 | 3-STATE | 4.88 mm | 8 | 0.0005 A | 1048576 bit | 38535Q/M;38534H;883B | PARALLEL | EEPROM | 5 V | 10 ms | YES | YES | NO | 256 words | 19.305 mm | 19.305 mm | |||||||||||||
 | Mfr Part No M5M5V416CWG-70HI | Mitsubishi Electric | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | MITSUBISHI ELECTRIC CORP | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA48,6X8,30 | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY | Transferred | BGA | No | 3 V | e0 | 3A991.B.2.A | Tin/Lead (Sn/Pb) | 8542.32.00.41 | BOTTOM | BALL | 1 | 0.75 mm | unknown | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.05 mA | 256KX16 | 3-STATE | 16 | 0.000015 A | 4194304 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | ||||||||||||||||||
| Mfr Part No D27C040-200V10 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 200 ns | INTEL CORP | 524288 words | 512000 | 70 °C | CERAMIC | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-XDIP-T32 | Not Qualified | COMMERCIAL | ASYNCHRONOUS | 0.05 mA | 512KX8 | 3-STATE | 8 | 0.0001 A | 4194304 bit | PARALLEL | COMMON | UVPROM | ||||||||||||||||||||||||
| Mfr Part No M27C202-70F3 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 70 ns | STMICROELECTRONICS | 131072 words | 128000 | 125 °C | -40 °C | CERAMIC, GLASS-SEALED | WDIP | FRIT SEALED, WINDOWED, CERAMIC, DIP-40 | DIP40,.6 | RECTANGULAR | IN-LINE, WINDOW | Obsolete | DIP | Yes | 5 V | e3 | EAR99 | MATTE TIN | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | 40 | R-GDIP-T40 | Not Qualified | 5.5 V | AUTOMOTIVE | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX16 | 3-STATE | 5.97 mm | 16 | 0.0001 A | 2097152 bit | PARALLEL | COMMON | UVPROM | 52.195 mm | 15.24 mm | ||||||||||||||||
| Mfr Part No IS64WV2568EDBLL-10KLA1 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 36 | 10 ns | INTEL CORP | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOJ | SOJ, SOJ36,.44 | SOJ36,.44 | RECTANGULAR | SMALL OUTLINE | Active | Yes | 3 V | 3A991.B.2.A | 8542.32.00.41 | DUAL | J BEND | 1.27 mm | compliant | R-PDSO-J36 | Not Qualified | INDUSTRIAL | ASYNCHRONOUS | 0.05 mA | 256KX8 | 3-STATE | 8 | 0.015 A | 2097152 bit | AEC-Q100 | PARALLEL | COMMON | STANDARD SRAM | 2 V | ||||||||||||||||||||||||
 | Mfr Part No CY7C187-45LC | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 22 | 45 ns | CYPRESS SEMICONDUCTOR CORP | 65536 words | 64000 | 70 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | QCCN, LCC22,.3X.5 | LCC22,.3X.5 | RECTANGULAR | CHIP CARRIER | Obsolete | LCC | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | AUTOMATIC POWER-DOWN | 8542.32.00.41 | QUAD | NO LEAD | 1 | 1.27 mm | not_compliant | 22 | R-CQCC-N22 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.05 mA | 64KX1 | 3-STATE | 1.905 mm | 1 | 0.02 A | 65536 bit | PARALLEL | SEPARATE | STANDARD SRAM | 4.5 V | NO | 12.446 mm | 7.366 mm | |||||||||||||
 | Mfr Part No X28C010FMB-12 | Intersil Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | INTERSIL CORP | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DFP | DFP, FL32,.5 | FL32,.5 | RECTANGULAR | FLATPACK | Obsolete | DFP | Yes | 5 V | e3 | 3A001.A.2.C | MATTE TIN | 8542.32.00.51 | DUAL | FLAT | 1 | 1.27 mm | compliant | 32 | R-CDFP-F32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX8 | 3.05 mm | 8 | 0.0005 A | 1048576 bit | 38535Q/M;38534H;883B | PARALLEL | EEPROM | 5 V | 10 ms | YES | YES | NO | 256 words | 11.049 mm | ||||||||||||
| Mfr Part No X28C010FMB-12 | Xicor Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | XICOR INC | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DFP | CERAMIC, FP-32 | FL32,.5 | RECTANGULAR | FLATPACK | Obsolete | No | 5 V | e0 | TIN LEAD | PAGE WRITE | DUAL | FLAT | 1 | 1.27 mm | unknown | R-CDFP-F32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX8 | 3-STATE | 3.05 mm | 8 | 0.0005 A | 1048576 bit | 38535Q/M;38534H;883B | PARALLEL | EEPROM | 5 V | 10 ms | YES | YES | NO | 256 words | 11.6586 mm | ||||||||||||||
 | Mfr Part No IS62LV1024LL-45H | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 45 ns | INTEGRATED SILICON SOLUTION INC | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSOP1 | 8 X 13.40 MM, STSOP1-32 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3 V | e0 | EAR99 | TIN LEAD | TTL COMPATIBLE INPUTS AND OUTPUTS | 8542.32.00.41 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 3.15 V | COMMERCIAL | 2.85 V | ASYNCHRONOUS | 0.05 mA | 128KX8 | 3-STATE | 1.2 mm | 8 | 0.000025 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | 11.8 mm | 8 mm | |||||||||||||||
| Mfr Part No X28C512EMB-12 | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | ROCHESTER ELECTRONICS LLC | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | HQCCN | HQCCN, | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | Obsolete | 5 V | 3A001.A.2.C | 8542.32.00.51 | QUAD | NO LEAD | 1 | 1.27 mm | unknown | R-CQCC-N32 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.05 mA | 64KX8 | 3.05 mm | 8 | 524288 bit | MIL-STD-883 | PARALLEL | EEPROM | 5 V | 10 ms | 13.965 mm | 11.425 mm | |||||||||||||||||||||||
| Mfr Part No X28C512EMB-12 | Xicor Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | XICOR INC | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | QCCN, LCC32,.45X.55 | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | Obsolete | No | 5 V | e0 | TIN LEAD | 100000 ENDURANCE CYCLES; 10 YEARS DATA RETENTION; 128-BYTE PAGE | QUAD | NO LEAD | 1 | 1.27 mm | unknown | R-CQCC-N32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.05 mA | 64KX8 | 3-STATE | 3.048 mm | 8 | 0.0005 A | 524288 bit | MIL-STD-883 | PARALLEL | EEPROM | 5 V | 10000 Write/Erase Cycles | 10 ms | 10 | YES | YES | NO | 128 words | 13.97 mm | 11.43 mm | |||||||||||
| Mfr Part No X28C512EMB-12 | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 120 ns | RENESAS ELECTRONICS CORP | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC | QCCN | QCCN, LCC32,.45X.55 | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | Obsolete | No | 5 V | 3A001.A.2.C | 8542.32.00.51 | QUAD | NO LEAD | 1 | 1.27 mm | not_compliant | R-XQCC-N32 | Not Qualified | MILITARY | ASYNCHRONOUS | 0.05 mA | 64KX8 | 8 | 0.0005 A | 524288 bit | 38535Q/M;38534H;883B | PARALLEL | EEPROM | 100000 Write/Erase Cycles | 10 ms | YES | YES | NO | 128 words | ||||||||||||||||||||
| Mfr Part No AM27C4096-95DC | AMD | Datasheet | 758 | - | Min: 1 Mult: 1 | NO | 40 | 90 ns | ADVANCED MICRO DEVICES INC | 262144 words | 256000 | 70 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 40 | R-CDIP-T40 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.05 mA | 256KX16 | 3-STATE | 16 | 0.0001 A | 4194304 bit | PARALLEL | COMMON | UVPROM | ||||||||||||||||||||
| Mfr Part No AM27C4096-95DC | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 90 ns | SPANSION INC | 262144 words | 256000 | 70 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | 5 V | EAR99 | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 40 | R-CDIP-T40 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.05 mA | 256KX16 | 5.588 mm | 16 | 4194304 bit | PARALLEL | UVPROM | 52.26 mm | 15.24 mm | ||||||||||||||||||||||||
| Mfr Part No MX27C2048DC-90 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 90 ns | MACRONIX INTERNATIONAL CO LTD | 131072 words | 128000 | 70 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | EAR99 | TIN LEAD | QUICK PULSE PROGRAMMING ALGORITHM | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 40 | R-GDIP-T40 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX16 | 3-STATE | 5.7912 mm | 16 | 0.0001 A | 2097152 bit | PARALLEL | COMMON | UVPROM | 52.07 mm | 15.24 mm |
-
AM27C128-250/BXA
AMD
Package:Memory
Price: please inquire
-
SST29EE010-120-4I-EH
Silicon Storage Technology
Package:Memory
Price: please inquire
-
KM41C1000DJ-8
Samsung Semiconductor
Package:Memory
Price: please inquire
-
M27C202-80F1
STMicroelectronics
Package:Memory
Price: please inquire
-
CXK5T16100TM-12LLX
Sony Semiconductor
Package:Memory
Price: please inquire
-
X28C010KMB-25
Xicor Inc
Package:Memory
Price: please inquire
-
M5M5V416CWG-70HI
Mitsubishi Electric
Package:Memory
Price: please inquire
-
D27C040-200V10
Intel Corporation
Package:Memory
Price: please inquire
-
M27C202-70F3
STMicroelectronics
Package:Memory
Price: please inquire
-
IS64WV2568EDBLL-10KLA1
Intel Corporation
Package:Memory
Price: please inquire
-
CY7C187-45LC
Cypress Semiconductor
Package:Memory
Price: please inquire
-
X28C010FMB-12
Intersil Corporation
Package:Memory
Price: please inquire
-
X28C010FMB-12
Xicor Inc
Package:Memory
Price: please inquire
-
IS62LV1024LL-45H
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
-
X28C512EMB-12
Rochester Electronics LLC
Package:Memory
Price: please inquire
-
X28C512EMB-12
Xicor Inc
Package:Memory
Price: please inquire
-
X28C512EMB-12
Renesas Electronics Corporation
Package:Memory
Price: please inquire
-
AM27C4096-95DC
AMD
Package:Memory
Price: please inquire
-
AM27C4096-95DC
Spansion
Package:Memory
Price: please inquire
-
MX27C2048DC-90
Macronix International Co Ltd
Package:Memory
Price: please inquire