The category is 'Memory'
Memory (144)
- All Manufacturers
- Ihs Manufacturer
- JESD-30 Code
- Memory Density
- Memory IC Type
- Memory Width
- Number of Terminals
- Number of Words
- Number of Words Code
- Operating Temperature-Max
- Organization
- Package Code
- Supply Current-Max
- Supply Current-Max:
0.05 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact plating | Surface Mount | Number of pins | Number of Terminals | Access Time-Max | Category | Clock Frequency-Max (fCLK) | Connector | Connector pinout layout | Contacts pitch | Electrical mounting | Gross weight | Ihs Manufacturer | Kind of connector | Manufacturer | Manufacturer Part Number | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Row pitch | Spatial orientation | Supply Voltage-Nom (Vsup) | Type of connector | Usage Level | Operating temperature | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Current rating | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Endurance | Write Cycle Time-Max (tWC) | Standby Voltage-Min | Rated voltage | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Output Enable | Number of Sectors/Size | Sector Size | Page Size | Boot Block | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Access Mode | Profile | Self Refresh | Length | Width | Plating thickness | Flammability rating |
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![]() | Mfr Part No X28C010DM-25 | Xicor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 250 ns | XICOR INC | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | HERMETIC SEALED, CERDIP-32 | DIP32,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | TIN LEAD | PAGE WRITE | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX8 | 3-STATE | 5.9 mm | 8 | 0.0005 A | 1048576 bit | PARALLEL | EEPROM | 5 V | 10 ms | YES | YES | NO | 256 words | 15.24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M5M5V416CWG-70HI | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | RENESAS TECHNOLOGY CORP | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA48,6X8,30 | BGA48,6X8,30 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 3 V | 3A991.B.2.A | 8542.32.00.41 | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.75 mm | unknown | NOT SPECIFIED | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.05 mA | 256KX16 | 3-STATE | 1.06 mm | 16 | 8e-7 A | 4194304 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | 8.5 mm | 7 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No UPD41416-15 | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | 150 ns | RENESAS ELECTRONICS CORP | 16384 words | 16000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.02 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T18 | Not Qualified | COMMERCIAL | 0.05 mA | 16KX4 | 3-STATE | 4 | 65536 bit | COMMON | PAGE MODE DRAM | 128 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No KM616FS2000TI-12 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 120 ns | SAMSUNG SEMICONDUCTOR INC | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP44,.46,32 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | No | 2.5 V | e0 | 3A991.B.2.A | TIN LEAD | 8542.32.00.41 | DUAL | GULL WING | 1 | 0.8 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 3.3 V | INDUSTRIAL | 2.3 V | ASYNCHRONOUS | 0.05 mA | 128KX16 | 3-STATE | 1.2 mm | 16 | 0.00001 A | 2097152 bit | PARALLEL | COMMON | STANDARD SRAM | 1.5 V | 18.41 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K4M64163PK-BC90 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 54 | 7 ns | 111 MHz | SAMSUNG SEMICONDUCTOR INC | 1 | 4194304 words | 4000000 | 70 °C | -25 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA54,9X9,32 | BGA54,9X9,32 | SQUARE | GRID ARRAY, FINE PITCH | Obsolete | Yes | 1.8 V | e3 | Yes | EAR99 | MATTE TIN | 8542.32.00.02 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B54 | Not Qualified | OTHER | 0.05 mA | 4MX16 | 3-STATE | 16 | 0.0003 A | 67108864 bit | COMMON | SYNCHRONOUS DRAM | 4096 | 1,2,4,8,FP | 1,2,4,8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AS27C512-20ECAM | Micross Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 200 ns | MICROSS COMPONENTS | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | WQCCN | 0.450 X 0.550 INCH, WINDOWED, CERAMIC, LCC-32 | RECTANGULAR | CHIP CARRIER, WINDOW | Active | QFJ | 5 V | e4 | 3A001.A.2.C | PALLADIUM GOLD | 8542.32.00.61 | QUAD | NO LEAD | 1 | 1.27 mm | compliant | 32 | R-CQCC-N32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.05 mA | 64KX8 | 3.048 mm | 8 | 524288 bit | PARALLEL | UVPROM | 13.97 mm | 11.43 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS62LV1024L-70TI | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | INTEGRATED SILICON SOLUTION INC | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSOP1-32 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3.3 V | e0 | EAR99 | TIN LEAD | 8542.32.00.41 | DUAL | GULL WING | 1 | 0.5 mm | compliant | 32 | R-PDSO-G32 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | 1 | ASYNCHRONOUS | 0.05 mA | 128KX8 | 3-STATE | 1.2 mm | 8 | 0.00005 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | 18.4 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M5M27C512AK-10 | Mitsubishi Electric | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 100 ns | MITSUBISHI ELECTRIC CORP | 65536 words | 64000 | 70 °C | CERAMIC, GLASS-SEALED | WDIP | WDIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | Obsolete | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 28 | R-GDIP-T28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 64KX8 | 3-STATE | 5.1 mm | 8 | 0.0001 A | 524288 bit | PARALLEL | COMMON | UVPROM | 36.7 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TC55V200FT-85 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 85 ns | TOSHIBA CORP | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP48,.55,20 | TSSOP48,.55,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 3 V | e0 | 3A991.B.2.A | Tin/Lead (Sn/Pb) | 8542.32.00.41 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.05 mA | 128KX16 | 3-STATE | 1.2 mm | 16 | 2097152 bit | PARALLEL | COMMON | STANDARD SRAM | 1.5 V | 12.4 mm | 12 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CXK5864BSP-12L | Sony Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 120 ns | SONY CORP | 8192 words | 8000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP28,.3 | DIP28,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 28 | R-PDIP-T28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.05 mA | 8KX8 | 3-STATE | 4.4 mm | 8 | 0.000035 A | 65536 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | 35.1 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No WS57C128FB-70DM | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 70 ns | STMICROELECTRONICS | 16384 words | 16000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | WDIP | WDIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | Obsolete | DIP | No | 5 V | e0 | 3A001.A.2.C | TIN LEAD | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 28 | R-GDIP-T28 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.05 mA | 16KX8 | 3-STATE | 5.72 mm | 8 | 0.0005 A | 131072 bit | PARALLEL | COMMON | UVPROM | 12.75 V | 37.215 mm | 15.24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MX23L6410TC-10G | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 25 ns | MACRONIX INTERNATIONAL CO LTD | 4194304 words | 4000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | Yes | 5 V | EAR99 | 8542.32.00.71 | DUAL | GULL WING | 1 | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 32KX8 | 8 | 0.000015 A | 262144 bit | PARALLEL | MASK ROM | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MX23L12810MC-13 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 130 ns | MACRONIX INTERNATIONAL CO LTD | 8388608 words | 8000000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP44,.63 | SOP44,.63 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.3 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.05 mA | 8MX16 | 3 mm | 16 | 0.000015 A | 134217728 bit | PARALLEL | MASK ROM | 28.5 mm | 12.6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MB838000-20P | FUJITSU Semiconductor Limited | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 150 ns | FUJITSU SEMICONDUCTOR AMERICA INC | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | 5 V | EAR99 | INPUT & OUTPUT TTL COMPATIBLE | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 4KX8 | 3-STATE | 5 mm | 8 | 32768 bit | PARALLEL | MASK ROM | 40.44 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MX23L12824XI-12 | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 200 ns | MACRONIX INTERNATIONAL CO LTD | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | BGA | BGA, BGA64,8X8,40 | BGA64,8X8,40 | SQUARE | GRID ARRAY | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | BOTTOM | BALL | 1 | 1 mm | unknown | S-PBGA-B64 | Not Qualified | OTHER | ASYNCHRONOUS | 0.05 mA | 256KX16 | 16 | 0.000015 A | 4194304 bit | PARALLEL | MASK ROM | 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MB834000B-15P | FUJITSU Limited | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 150 ns | FUJITSU LTD | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | IN-LINE | Contact Manufacturer | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | R-PDIP-T32 | Not Qualified | COMMERCIAL | ASYNCHRONOUS | 0.05 mA | 512KX8 | 8 | 0.00001 A | 4194304 bit | PARALLEL | MASK ROM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LH538500CD | Sharp Corp | Datasheet | - | - | Min: 1 Mult: 1 | NO | 42 | 150 ns | SHARP CORP | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | DIP | 0.600 INCH, PLASTIC, DIP-42 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T42 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 1MX8 | 3-STATE | 5.4 mm | 8 | 8388608 bit | PARALLEL | MASK ROM | 53.8 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No H5AN8G8NDJR-XNC | HYNIX | Datasheet | - | - | Min: 1 Mult: 1 | gold-plated | YES | 20 | 78 | Integrated Circuits (ICs)/Memory/Memory (ICs) | 1600 MHz | socket | 2x10 | 2.54mm | THT | 1.1 g | SK HYNIX INC | female | 1073741824 words | 1000000000 | 85 °C | FBGA-78(7.5x11) | PLASTIC/EPOXY | TFBGA | FBGA-78 | BGA78,9X13,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | End Of Life | Yes | 2.54mm | straight | 1.2 V | pin strips | -40...163°C | EAR99 | AUTO/SELF REFRESH | 8542.32.00.36 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 3A | R-PBGA-B78 | 1.26 V | 1.14 V | 1 | SYNCHRONOUS | 0.05 mA | 1GX8 | 1.2 mm | 8 | 0.033 A | 8589934592 bit | COMMON | DDR4 DRAM | 150V | 4,8 | 4,8 | MULTI BANK PAGE BURST | beryllium copper | YES | 11 mm | 7.5 mm | 0.75µm | UL94V-0 | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT28C256-20PC | Atmel | Datasheet | 10 | - | Min: 1 Mult: 1 | NO | 28 | 200 ns | ATMEL CORP | Atmel Corporation | AT28C256-20PC | 1 | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | NOT SPECIFIED | 8.6 | No | 5 V | Military grade | e0 | EAR99 | Tin/Lead (Sn/Pb) | AUTOMATIC WRITE | 8542.32.00.51 | EEPROMs | CMOS | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | compliant | 28 | R-PDIP-T28 | Not Qualified | 5.5 V | 5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 32KX8 | 3-STATE | 4.826 mm | 8 | 0.0002 A | 262144 bit | MIL-STD-883 | PARALLEL | EEPROM | 5 V | 10000 Write/Erase Cycles | 10 ms | YES | YES | NO | 64 words | 37.0205 mm | 15.24 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT49LV001NT-70TI | Atmel | Datasheet | 320 | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | ATMEL CORP | Atmel Corporation | AT49LV001NT-70TI | 3 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | 8 X 20 MM, PLASTIC, MO-142BD, TSOP1-32 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | 30 | 5.87 | No | 3.3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | Flash Memories | CMOS | DUAL | GULL WING | 240 | 1 | 0.5 mm | compliant | 32 | R-PDSO-G32 | Not Qualified | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.05 mA | 128KX8 | 1.2 mm | 8 | 0.00005 A | 1048576 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 1,2,1,1 | 16K,8K,32K,64K | TOP | 18.4 mm | 8 mm |
X28C010DM-25
Xicor Inc
Package:Memory
Price: please inquire
M5M5V416CWG-70HI
Renesas Electronics Corporation
Package:Memory
Price: please inquire
UPD41416-15
Renesas Electronics Corporation
Package:Memory
Price: please inquire
KM616FS2000TI-12
Samsung Semiconductor
Package:Memory
Price: please inquire
K4M64163PK-BC90
Samsung Semiconductor
Package:Memory
Price: please inquire
AS27C512-20ECAM
Micross Components
Package:Memory
Price: please inquire
IS62LV1024L-70TI
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
M5M27C512AK-10
Mitsubishi Electric
Package:Memory
Price: please inquire
TC55V200FT-85
Toshiba America Electronic Components
Package:Memory
Price: please inquire
CXK5864BSP-12L
Sony Semiconductor
Package:Memory
Price: please inquire
WS57C128FB-70DM
STMicroelectronics
Package:Memory
Price: please inquire
MX23L6410TC-10G
Macronix International Co Ltd
Package:Memory
Price: please inquire
MX23L12810MC-13
Macronix International Co Ltd
Package:Memory
Price: please inquire
MB838000-20P
FUJITSU Semiconductor Limited
Package:Memory
Price: please inquire
MX23L12824XI-12
Macronix International Co Ltd
Package:Memory
Price: please inquire
MB834000B-15P
FUJITSU Limited
Package:Memory
Price: please inquire
LH538500CD
Sharp Corp
Package:Memory
Price: please inquire
H5AN8G8NDJR-XNC
HYNIX
Package:Memory
Price: please inquire
AT28C256-20PC
Atmel
Package:Memory
Price: please inquire
AT49LV001NT-70TI
Atmel
Package:Memory
Price: please inquire
