The category is 'Memory'
Memory (1)
- All Manufacturers
- Access Time
- Access Time-Max
- Base Product Number
- Data Bus Width
- ECCN Code
- Factory Lead Time
- Factory Pack QuantityFactory Pack Quantity
- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- Length
- Supply Current-Max
- Supply Current-Max:
0.057 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Access Time-Max | Base Product Number | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Pd - Power Dissipation | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Operating Supply Current | Operating Mode | Supply Current-Max | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Standby Current-Max | Memory Density | Parallel/Serial | Memory IC Type | Memory Organization | Length | Width |
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 | Mfr Part No CY14B108N-ZSP45XI | Infineon Technologies | Datasheet | - | - | Min: 1 Mult: 1 | 1 Week | Surface Mount | TSOP-54 | YES | 54-TSOP II | 54 | 45 ns | CY14B108 | 540 | CYPRESS SEMICONDUCTOR CORP | CY14B108N-ZSP45XI | + 85 C | Non-Volatile | Infineon Technologies | - 40 C | Yes | 3 | SMD/SMT | 524288 words | 512000 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP54,.46,32 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Active | TSOP2 | 1 W | Active | 30 | 1.96 | Details | Yes | 3.6 V | 2.7 V | 3 V | 0.020460 oz | -40°C ~ 85°C (TA) | Tray | CY14B108N | e3 | 3A991.B.2.A | Matte Tin (Sn) | 8542.32.00.41 | NVSRAM (Non-Volatile SRAM) | 2.7V ~ 3.6V | DUAL | GULL WING | 260 | 1 | 0.8 mm | compliant | 54 | R-PDSO-G54 | Not Qualified | 3 V | 3.6 V | 3/3.3 V | INDUSTRIAL | 2.7 V | 8 Mbit | 75 mA | ASYNCHRONOUS | 0.057 mA | 45 ns | NVSRAM | Parallel | 16 bit | 512 k x 16 | 1.2 mm | 16 | 45ns | 0.01 A | 8388608 bit | PARALLEL | NON-VOLATILE SRAM | 512K x 16 | 22.415 mm | 10.16 mm |