The category is 'Memory'
Memory (138)
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- Ihs Manufacturer
- JESD-30 Code
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- Supply Current-Max:
0.07 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Backshell Material, Plating | Access Time-Max | Base Product Number | Bus Type | Clock Frequency-Max (fCLK) | Contact Finish Mating | Contact Materials | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Mfr | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | MSL | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supplier Package | Supply Voltage-Nom (Vsup) | Usage Level | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Part Status | Number of Terminations | Termination | ECCN Code | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Composition | Color | Applications | Power (Watts) | Additional Feature | HTS Code | Fastening Type | Subcategory | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Number of Functions | Ingress Protection | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Shell Finish | Pin Count | Shell Size - Insert | JESD-30 Code | Qualification Status | Output Type | Operating Supply Voltage | Failure Rate | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Note | Memory Size | Number of Ports | Operating Mode | Output Current | Shell Size, MIL | Clock Frequency | Supply Current-Max | Cable Opening | Access Time | Memory Format | Memory Interface | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Power | Data Retention Time-Min | Standby Voltage-Min | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Output Enable | Number of Sectors/Size | Sector Size | Ready/Busy | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Access Mode | Features | Self Refresh | Memory Organization | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating |
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 | Mfr Part No TMM41464P-12 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | 120 ns | TOSHIBA CORP | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP18,.3 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.02 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T18 | Not Qualified | COMMERCIAL | 0.07 mA | 64KX4 | 3-STATE | 4 | 262144 bit | COMMON | PAGE MODE DRAM | 256 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No HM62256P-8 | Hitachi Ltd | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 85 ns | HITACHI LTD | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Transferred | DIP | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 28 | R-PDIP-T28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.07 mA | 32KX8 | 3-STATE | 5.7 mm | 8 | 0.002 A | 262144 bit | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | YES | 35.6 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M5M5256BKP-10LL | Mitsubishi Electric | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 100 ns | MITSUBISHI ELECTRIC CORP | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP28,.3 | DIP28,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | POWER-DOWN | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 28 | R-PDIP-T28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.07 mA | 32KX8 | 3-STATE | 8 | 0.00001 A | 262144 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No SRM20100LM10 | Epson Electronics America Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 100 ns | S-MOS SYSTEMS | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP32,.56 | SOP32,.56 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | EAR99 | TIN LEAD | BATTERY BACKUP | 8542.32.00.41 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.07 mA | 128KX8 | 3-STATE | 8 | 0.00005 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SRM20100LM10 | Seiko Epson Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 100 ns | SEIKO EPSON CORP | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP32,.56 | SOP32,.56 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.41 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.07 mA | 128KX8 | 3-STATE | 3.1 mm | 8 | 0.00005 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | 20.5 mm | 11.3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No HN29W6411ATT-50 | HITACHI | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 50 ns | HITACHI LTD | Hitachi Ltd | HN29W6411ATT-50 | - | 67108864 words | 64000000 | 70 °C | Metal Case | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP40/48,.56.32 | TSOP40/48,.56.32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | TSOP2 | 8.32 | Yes | 3.3 V | -40...+85°C | TEP | AND TYPE | IT ALSO OPERATES AT 5 V NOMONAL SUPPLY VOLTAGE; 10 YEARS DATA RETENTION | Flash Memories | CMOS | DUAL | GULL WING | 1 | 0.8 mm | unknown | 48/40 | R-PDSO-G48 | Not Qualified | single | 3.6 V | 3.3/5 V | COMMERCIAL | 3 V | - | SYNCHRONOUS | 8 A | 0.07 mA | 64MX1 | 1.2 mm | 1 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 40 W | 10 | NO | NO | YES | 16K | 512 | YES | 19.68 mm | 12.7 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CY14B101KA-SP25XIT | Infineon Technologies | Datasheet | 39 |
| Min: 1 Mult: 1 | Surface Mount | 48-BSSOP (0.295, 7.50mm Width) | YES | 48-SSOP | 48 | 25 ns | CY14B101 | Parallel | 1000 | CYPRESS SEMICONDUCTOR CORP | CY14B101KA-SP25XIT | Non-Volatile | Infineon Technologies | Yes | 3 | Surface Mount | 65536 words | 64000 | 85 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | SSOP | SSOP, SSOP48,.4 | SSOP48,.4 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Active | SSOP | Active | 30 | 5.43 | Details | Yes | SSOP | 3 V | Industrial grade | -40 to 85 °C | Reel | CY14B101KA | e4 | EAR99 | NVSRAM | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.41 | NVSRAM (Non-Volatile SRAM) | 2.7V ~ 3.6V | DUAL | GULL WING | 260 | 1 | 0.635 mm | compliant | 48 | R-PDSO-G48 | Not Qualified | 3 V | 3.6 V | 3/3.3 V | INDUSTRIAL | 2.7 V | 1Mbit | SYNCHRONOUS | 0.07 mA | 25 ns | NVSRAM | Parallel | 8 Bit | 128Kx8 | 2.794 mm | 16 | 25ns | 1 Mb | 0.005 A | 1048576 bit | Industrial | PARALLEL | NON-VOLATILE SRAM | 8 | 128K x 8 | 15.875 mm | 7.5057 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CY14B104NA-ZSP25XIT | Infineon Technologies | Datasheet | 8 |
| Min: 1 Mult: 1 | Surface Mount | 54-TSOP (0.400, 10.16mm Width) | YES | 54-TSOP II | 54 | 25 ns | CY14B104 | 1000 | CYPRESS SEMICONDUCTOR CORP | CY14B104NA-ZSP25XIT | Non-Volatile | Infineon Technologies | Yes | 3 | 262144 words | 256000 | 85 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP54,.46,32 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Active | TSOP2 | Active | 30 | 5.45 | Details | Yes | 3 V | -40°C ~ 85°C (TA) | Reel | CY14B104NA | e3 | 3A991.B.2.A | Matte Tin (Sn) | 8542.32.00.41 | NVSRAM (Non-Volatile SRAM) | 2.7V ~ 3.6V | DUAL | GULL WING | 260 | 1 | 0.8 mm | compliant | 54 | R-PDSO-G54 | Not Qualified | 3.6 V | 3/3.3 V | INDUSTRIAL | 2.7 V | 4Mbit | ASYNCHRONOUS | 0.07 mA | 25 ns | NVSRAM | Parallel | 256KX16 | 1.2 mm | 16 | 25ns | 0.005 A | 4194304 bit | PARALLEL | NON-VOLATILE SRAM | 256K x 16 | 22.415 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M27C800-100F1 | STMicroelectronics | Datasheet | 1040 | - | Min: 1 Mult: 1 | NO | 42 | 100 ns | STMICROELECTRONICS | STMicroelectronics | M27C800-100F1 | 524288 words | 512000 | 70 °C | CERAMIC, GLASS-SEALED | WDIP | WINDOWED, FRIT SEALED, CERAMIC, DIP-42 | DIP42,.6 | RECTANGULAR | IN-LINE, WINDOW | Obsolete | DIP | NOT SPECIFIED | 5.82 | No | EPROM 1Mx8 or 512Kx16 100n | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 00.1.142 | 8542.32.00.61 | EPROMs | CMOS | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | not_compliant | 42 | R-GDIP-T42 | Not Qualified | 5.5 V | 5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.07 mA | 512KX16 | 3-STATE | 5.97 mm | 16 | 0.00005 A | 8388608 bit | PARALLEL | COMMON | UVPROM | 8 | 54.635 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No W988D6FBGX7I | Winbond | Datasheet | 920 | - | Min: 1 Mult: 1 | Panel Mount | 54-TFBGA | YES | Flange | Aluminum | 54-VFBGA (8x9) | Thermoplastic | 54 | - | 5.4 ns | TVP00RQW | 133 MHz | Gold | Copper Alloy | WINBOND ELECTRONICS CORP | Winbond Electronics Corp | W988D6FBGX7I | Volatile | Amphenol Aerospace Operations | 16777216 words | 16000000 | 85 °C | -40 °C | Bulk | PLASTIC/EPOXY | TFBGA | 8 X 9 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-54 | BGA54,9X9,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Metal | Active | NOT SPECIFIED | 5.68 | Yes | 1.8 V | - | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ TV | Crimp | Receptacle, Female Sockets | 6 (Quadrax) | Olive Drab | Aviation, Marine, Military | AUTO/SELF REFRESH | Threaded | DRAMs | - | SDRAM - Mobile LPSDR | 1.7V ~ 1.95V | BOTTOM | N (Normal) | BALL | Shielded | NOT SPECIFIED | 1 | Environment Resistant | 0.8 mm | compliant | Olive Drab Cadmium | 23-6 | R-PBGA-B54 | Not Qualified | 1.95 V | 1.8 V | INDUSTRIAL | 1.7 V | 256Mbit | 1 | SYNCHRONOUS | - | 133 MHz | 0.07 mA | - | 5.4 ns | DRAM | LVCMOS | 16MX16 | 3-STATE | 1.025 mm | 16 | 15ns | 0.00001 A | 268435456 bit | COMMON | SYNCHRONOUS DRAM | 8192 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | - | YES | 16M x 16 | 9 mm | 8 mm | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LP621024DM55LLTF | AMIC Technology | Datasheet | - | - | Min: 1 Mult: 1 | Axial | YES | Axial | 32 | 55 ns | AMIC TECHNOLOGY CORP | AMIC Technology | LP621024DM-55LLTF | 131072 words | 128000 | 85 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP, SOP32,.56 | SOP32,.56 | RECTANGULAR | SMALL OUTLINE | Contact Manufacturer | 5.79 | Yes | 5 V | -55°C ~ 175°C | Tape & Reel (TR) | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±0.5% | Active | 2 | ±50ppm/°C | 39.2 Ohms | Metal Film | 0.5W, 1/2W | SRAMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | R-PDSO-G32 | Not Qualified | -- | 5.5 V | 5 V | OTHER | 4.5 V | ASYNCHRONOUS | 0.07 mA | 128KX8 | 3-STATE | 3 mm | 8 | 0.00002 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | Flame Retardant Coating, Moisture Resistant, Safety | -- | 20.45 mm | 11.3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LP621024DV-70LLIF | AMIC Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | AMIC TECHNOLOGY CORP | AMIC Technology | LP621024DV-70LLIF | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP32,.8,20 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Contact Manufacturer | 5.79 | Yes | 5 V | SRAMs | CMOS | DUAL | GULL WING | 1 | 0.5 mm | unknown | R-PDSO-G32 | Not Qualified | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.07 mA | 128KX8 | 3-STATE | 1.2 mm | 8 | 0.00002 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | 18.4 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LP621024DM-70LLF | AMIC Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | AMIC TECHNOLOGY CORP | AMIC Technology | LP621024DM-70LLF | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP32,.56 | SOP32,.56 | RECTANGULAR | SMALL OUTLINE | Contact Manufacturer | SOIC | 5.5 | Yes | 5 V | Yes | EAR99 | 8542.32.00.41 | SRAMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | unknown | NOT SPECIFIED | 32 | R-PDSO-G32 | Not Qualified | 5.5 V | 5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.07 mA | 128KX8 | 3-STATE | 3 mm | 8 | 0.00001 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | 20.45 mm | 11.3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LP621024D-70LLF | AMIC Technology | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 70 ns | AMIC TECHNOLOGY CORP | AMIC Technology | LP621024D-70LLF | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | IN-LINE | Contact Manufacturer | DIP | 5.5 | Yes | 5 V | Yes | EAR99 | 8542.32.00.41 | SRAMs | CMOS | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | unknown | NOT SPECIFIED | 32 | R-PDIP-T32 | Not Qualified | 5.5 V | 5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.07 mA | 128KX8 | 3-STATE | 5.33 mm | 8 | 0.00001 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | 41.91 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LP621024DV-55LLTF | AMIC Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 55 ns | AMIC TECHNOLOGY CORP | AMIC Technology | LP621024DV-55LLTF | 131072 words | 128000 | 85 °C | -25 °C | PLASTIC/EPOXY | TSOP1 | TSOP1, TSSOP32,.8,20 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Contact Manufacturer | 5.8 | Yes | 5 V | SRAMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | unknown | NOT SPECIFIED | R-PDSO-G32 | Not Qualified | 5.5 V | 5 V | OTHER | 4.5 V | ASYNCHRONOUS | 0.07 mA | 128KX8 | 3-STATE | 1.2 mm | 8 | 0.00002 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | 18.4 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No U62H256ASK55LLG1 | Alliance Memory | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 55 ns | ZENTRUM MIKROELEKTRONIK DRESDEN AG | ZMDI | U62H256ASK55LLG1 | 3 | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.4 | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | 40 | 5.48 | Yes | 5 V | e3 | EAR99 | Matte Tin (Sn) | 8542.32.00.41 | SRAMs | CMOS | DUAL | GULL WING | 250 | 1 | 1.27 mm | compliant | 28 | R-PDSO-G28 | Not Qualified | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.07 mA | 32KX8 | 3-STATE | 2.65 mm | 8 | 262144 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | 17.9 mm | 7.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TC55257CSPL-10L | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 100 ns | TOSHIBA CORP | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP28,.3 | DIP28,.3 | RECTANGULAR | IN-LINE | Active | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 28 | R-PDIP-T28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.07 mA | 32KX8 | 3-STATE | 4.45 mm | 8 | 0.00001 A | 262144 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | 34.9 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No HM3-65162C-5 | Temic Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 70 ns | TEMIC SEMICONDUCTORS | 2048 words | 2000 | 70 °C | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | TIN LEAD | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T24 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.07 mA | 2KX8 | 3-STATE | 8 | 0.00003 A | 16384 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M5M5256FP-10LL | Mitsubishi Electric | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 100 ns | MITSUBISHI ELECTRIC CORP | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.5 | SOP28,.5 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.41 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.07 mA | 32KX8 | 3-STATE | 8 | 0.00001 A | 262144 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TC55257P-10 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 100 ns | TOSHIBA CORP | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | 5 V | EAR99 | 8542.32.00.41 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T28 | Not Qualified | COMMERCIAL | ASYNCHRONOUS | 0.07 mA | 32KX8 | 3-STATE | 8 | 0.001 A | 262144 bit | PARALLEL | COMMON | STANDARD SRAM |
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TMM41464P-12
Toshiba America Electronic Components
Package:Memory
Price: please inquire
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HM62256P-8
Hitachi Ltd
Package:Memory
Price: please inquire
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M5M5256BKP-10LL
Mitsubishi Electric
Package:Memory
Price: please inquire
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SRM20100LM10
Epson Electronics America Inc
Package:Memory
Price: please inquire
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SRM20100LM10
Seiko Epson Corporation
Package:Memory
Price: please inquire
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HN29W6411ATT-50
HITACHI
Package:Memory
Price: please inquire
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CY14B101KA-SP25XIT
Infineon Technologies
Package:Memory
32.603756
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CY14B104NA-ZSP25XIT
Infineon Technologies
Package:Memory
35.018122
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M27C800-100F1
STMicroelectronics
Package:Memory
Price: please inquire
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W988D6FBGX7I
Winbond
Package:Memory
Price: please inquire
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LP621024DM55LLTF
AMIC Technology
Package:Memory
Price: please inquire
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LP621024DV-70LLIF
AMIC Technology
Package:Memory
Price: please inquire
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LP621024DM-70LLF
AMIC Technology
Package:Memory
Price: please inquire
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LP621024D-70LLF
AMIC Technology
Package:Memory
Price: please inquire
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LP621024DV-55LLTF
AMIC Technology
Package:Memory
Price: please inquire
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U62H256ASK55LLG1
Alliance Memory
Package:Memory
Price: please inquire
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TC55257CSPL-10L
Toshiba America Electronic Components
Package:Memory
Price: please inquire
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HM3-65162C-5
Temic Semiconductors
Package:Memory
Price: please inquire
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M5M5256FP-10LL
Mitsubishi Electric
Package:Memory
Price: please inquire
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TC55257P-10
Toshiba America Electronic Components
Package:Memory
Price: please inquire