The category is 'Memory'

  • All Manufacturers
  • Ihs Manufacturer
  • JESD-30 Code
  • Memory IC Type
  • Number of Terminals
  • Operating Temperature-Max
  • Package Body Material
  • Package Code
  • Package Shape
  • Package Style
  • Part Life Cycle Code
  • Reach Compliance Code
  • Supply Current-Max
  • Supply Current-Max:

    0.07 mA

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Factory Lead Time

Lifecycle Status

Mounting Type

Package / Case

Surface Mount

Number of Pins

Supplier Device Package

Number of Terminals

Access Time-Max

Brand

Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

Manufacturer

Manufacturer Part Number

Maximum Operating Supply Voltage

Memory Types

Mfr

Minimum Operating Supply Voltage

Moisture Sensitivity Levels

Mounting

Number of I/O Lines

Number of Words

Number of Words Code

Operating Temperature-Max

Operating Temperature-Min

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Product Status

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Supplier Package

Supply Voltage-Nom (Vsup)

Timing Type

Typical Operating Supply Voltage

Usage Level

Operating Temperature

Packaging

Series

JESD-609 Code

Pbfree Code

ECCN Code

Type

Terminal Finish

Max Operating Temperature

Min Operating Temperature

Additional Feature

HTS Code

Subcategory

Technology

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Pin Count

JESD-30 Code

Qualification Status

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Voltage

Interface

Max Supply Voltage

Min Supply Voltage

Memory Size

Number of Ports

Nominal Supply Current

Operating Mode

Supply Current-Max

Access Time

Memory Format

Memory Interface

Organization

Output Characteristics

Seated Height-Max

Memory Width

Write Cycle Time - Word, Page

Address Bus Width

Product Type

Density

Standby Current-Max

Memory Density

Screening Level

Parallel/Serial

I/O Type

Sync/Async

Word Size

Memory IC Type

Programming Voltage

Endurance

Standby Voltage-Min

Data Polling

Toggle Bit

Command User Interface

Output Enable

Number of Sectors/Size

Sector Size

Page Size

Ready/Busy

Boot Block

Common Flash Interface

Reverse Pinout

Product Category

Memory Organization

Length

Width

Radiation Hardening

SRM20100LRM10

Mfr Part No

SRM20100LRM10

Seiko Epson Corporation Datasheet

-

-

Min: 1

Mult: 1

YES

32

100 ns

SEIKO EPSON CORP

131072 words

128000

70 °C

PLASTIC/EPOXY

TSOP1-R

TSOP1-R, TSSOP32,.8,20

TSSOP32,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

Obsolete

No

5 V

e0

EAR99

Tin/Lead (Sn/Pb)

8542.32.00.41

DUAL

GULL WING

1

0.5 mm

unknown

R-PDSO-G32

Not Qualified

5.5 V

COMMERCIAL

4.5 V

1

ASYNCHRONOUS

0.07 mA

128KX8

3-STATE

1.2 mm

8

0.00005 A

1048576 bit

PARALLEL

COMMON

STANDARD SRAM

2 V

YES

YES

18.4 mm

8 mm

STK15C88-WF45I

Mfr Part No

STK15C88-WF45I

Cypress Semiconductor Datasheet

-

-

Min: 1

Mult: 1

NO

28

45 ns

SIMTEK CORP

32768 words

32000

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP, DIP28,.6

DIP28,.6

RECTANGULAR

IN-LINE

Obsolete

DIP

Yes

5 V

e3

Yes

EAR99

MATTE TIN

8542.32.00.41

DUAL

THROUGH-HOLE

260

1

2.54 mm

unknown

28

R-PDIP-T28

Not Qualified

5.5 V

INDUSTRIAL

4.5 V

ASYNCHRONOUS

0.07 mA

32KX8

4.57 mm

8

0.0015 A

262144 bit

PARALLEL

NON-VOLATILE SRAM

36.83 mm

15.24 mm

CY7C187-35PC

Mfr Part No

CY7C187-35PC

Cypress Semiconductor Datasheet

4
In Stock

-

Min: 1

Mult: 1

NO

22

35 ns

CYPRESS SEMICONDUCTOR CORP

Cypress Semiconductor

CY7C187-35PC

65536 words

64000

70 °C

PLASTIC/EPOXY

DIP

0.300 INCH, PLASTIC, DIP-22

DIP22,.3

RECTANGULAR

IN-LINE

Obsolete

DIP

NOT SPECIFIED

8.65

No

5 V

e0

EAR99

Tin/Lead (Sn/Pb)

AUTOMATIC POWER-DOWN

8542.32.00.41

SRAMs

CMOS

DUAL

THROUGH-HOLE

NOT SPECIFIED

1

2.54 mm

not_compliant

22

R-PDIP-T22

Not Qualified

5.5 V

5 V

COMMERCIAL

4.5 V

1

ASYNCHRONOUS

0.07 mA

64KX1

3-STATE

4.826 mm

1

0.02 A

65536 bit

PARALLEL

SEPARATE

STANDARD SRAM

4.5 V

NO

27.813 mm

7.62 mm

M58WR064KB7AZB6F

Mfr Part No

M58WR064KB7AZB6F

Micron Datasheet

-

-

Min: 1

Mult: 1

Obsolete (Last Updated: 2 years ago)

YES

56

56

70 ns

MICRON TECHNOLOGY INC

Micron Technology Inc

M58WR064KB7AZB6F

NOR

4194304 words

4000000

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

VFBGA, BGA56,7X8,30

BGA56,7X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Obsolete

BGA

30

5.33

Compliant

Yes

1.8 V

Tape & Reel

e1

Yes

3A991.B.1.A

NOR TYPE

TIN SILVER COPPER

85 °C

-40 °C

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8542.32.00.51

Flash Memories

CMOS

BOTTOM

BALL

260

1

0.75 mm

compliant

56

R-PBGA-B56

Not Qualified

1.8 V

2 V

1.8 V

INDUSTRIAL

1.7 V

1.7 V

Parallel, Serial

2 V

1.7 V

30 mA

ASYNCHRONOUS

0.07 mA

70 ns

4MX16

1 mm

16

22 b

64 Mb

0.00005 A

67108864 bit

PARALLEL

Asynchronous

16 b

FLASH

1.8 V

NO

NO

YES

8,127

4K,32K

4 words

BOTTOM

YES

9 mm

7.7 mm

No

GS71108AU-12I

Mfr Part No

GS71108AU-12I

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

6 Weeks

YES

48

12 ns

GSI Technology

240

GSI TECHNOLOGY

GSI Technology

GS71108AU-12I

3.6 V

3 V

3

Surface Mount

8 Bit

128 kWords

128000

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

TFBGA, BGA48,6X8,30

BGA48,6X8,30

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

BGA

NOT SPECIFIED

5.22

No

FBGA

3.3 V

Asynchronous

3.3000 V

Industrial grade

-40 to 85 °C

GS71108AGU

e0

No

3A991.B.2.B

Tin/Lead (Sn/Pb)

8542.32.00.41

Memory & Data Storage

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

0.75 mm

compliant

48

R-PBGA-B48

Not Qualified

3.6 V

3.3 V

INDUSTRIAL

3 V

1

ASYNCHRONOUS

0.07 mA

128KX8

3-STATE

1.2 mm

8

17 Bit

SRAM

1 Mbit

0.005 A

1048576 bit

Industrial

PARALLEL

COMMON

STANDARD SRAM

3 V

SRAM

8 mm

6 mm

M58WR064KB70ZB6F

Mfr Part No

M58WR064KB70ZB6F

Micron Datasheet

2
In Stock

-

Min: 1

Mult: 1

YES

56

70 ns

MICRON TECHNOLOGY INC

Micron Technology Inc

M58WR064KB70ZB6F

4194304 words

4000000

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

VFBGA, BGA56,7X8,30

BGA56,7X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Obsolete

BGA

30

5.33

Yes

1.8 V

e1

Yes

3A991.B.1.A

NOR TYPE

TIN SILVER COPPER

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8542.32.00.51

Flash Memories

CMOS

BOTTOM

BALL

260

1

0.75 mm

compliant

56

R-PBGA-B56

Not Qualified

2 V

1.8 V

INDUSTRIAL

1.7 V

ASYNCHRONOUS

0.07 mA

4MX16

1 mm

16

0.00005 A

67108864 bit

PARALLEL

FLASH

1.8 V

NO

NO

YES

8,127

4K,32K

4 words

BOTTOM

YES

9 mm

7.7 mm

NM29N16S

Mfr Part No

NM29N16S

National Semiconductor Datasheet

-

-

Min: 1

Mult: 1

YES

40

48 ns

NATIONAL SEMICONDUCTOR CORP

National Semiconductor Corporation

NM29N16S

2097152 words

2000000

70 °C

PLASTIC/EPOXY

TSOP2

TSOP2, TSOP40/44,.46,32

TSOP40/44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

Obsolete

NOT SPECIFIED

5.86

No

5 V

e0

EAR99

Tin/Lead (Sn/Pb)

100K WRITE/ERASE ENDURANCE MIN.

8542.32.00.51

Flash Memories

CMOS

DUAL

GULL WING

NOT SPECIFIED

1

0.8 mm

unknown

R-PDSO-G40

Not Qualified

5.25 V

5 V

COMMERCIAL

4.75 V

ASYNCHRONOUS

0.07 mA

2MX8

3-STATE

1.2 mm

8

0.0001 A

16777216 bit

PARALLEL

FLASH

5 V

100000 Write/Erase Cycles

NO

NO

YES

512

4K

256 words

YES

18.41 mm

10.16 mm

M58WR064KT70ZB6E

Mfr Part No

M58WR064KT70ZB6E

Micron Datasheet

7196
In Stock

-

Min: 1

Mult: 1

YES

56

70 ns

MICRON TECHNOLOGY INC

Micron Technology Inc

M58WR064KT70ZB6E

4194304 words

4000000

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

7.70 X 9 MM, 0.75 MM PITCH, ROHS COMPLIANT, VFBGA-56

BGA56,7X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Obsolete

BGA

30

5.83

Yes

1.8 V

e1

Yes

3A991.B.1.A

NOR TYPE

TIN SILVER COPPER

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8542.32.00.51

Flash Memories

CMOS

BOTTOM

BALL

260

1

0.75 mm

compliant

56

R-PBGA-B56

Not Qualified

2 V

1.8 V

INDUSTRIAL

1.7 V

ASYNCHRONOUS

0.07 mA

4MX16

1 mm

16

0.00005 A

67108864 bit

PARALLEL

FLASH

1.8 V

NO

NO

YES

8,127

4K,32K

4 words

TOP

YES

9 mm

7.7 mm

M58WR032KB7AZB6F

Mfr Part No

M58WR032KB7AZB6F

Micron Datasheet

-

-

Min: 1

Mult: 1

YES

56

70 ns

MICRON TECHNOLOGY INC

Micron Technology Inc

M58WR032KB7AZB6F

2097152 words

2000000

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

VFBGA, BGA56,7X8,30

BGA56,7X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Obsolete

BGA

30

5.33

Yes

1.8 V

e1

Yes

3A991.B.1.A

NOR TYPE

TIN SILVER COPPER

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8542.32.00.51

Flash Memories

CMOS

BOTTOM

BALL

260

1

0.75 mm

compliant

56

R-PBGA-B56

Not Qualified

2 V

1.8 V

INDUSTRIAL

1.7 V

ASYNCHRONOUS

0.07 mA

2MX16

1 mm

16

0.00005 A

33554432 bit

PARALLEL

FLASH

1.8 V

NO

NO

YES

8,63

4K,32K

4 words

BOTTOM

YES

9 mm

7.7 mm

M58WR032KT70ZB6E

Mfr Part No

M58WR032KT70ZB6E

Micron Datasheet

-

-

Min: 1

Mult: 1

YES

56

70 ns

NUMONYX

Numonyx Memory Solutions

M58WR032KT70ZB6E

2097152 words

2000000

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

VFBGA, BGA56,7X8,30

BGA56,7X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Transferred

BGA

NOT SPECIFIED

5.21

Yes

1.8 V

3A991.B.1.A

NOR TYPE

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8542.32.00.51

Flash Memories

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

0.75 mm

unknown

56

R-PBGA-B56

Not Qualified

2 V

1.8 V

INDUSTRIAL

1.7 V

ASYNCHRONOUS

0.07 mA

2MX16

1 mm

16

0.00005 A

33554432 bit

PARALLEL

FLASH

1.8 V

NO

NO

YES

8,63

4K,32K

4 words

TOP

YES

9 mm

7.7 mm

GS71108AU-12IT

Mfr Part No

GS71108AU-12IT

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

6 Weeks

YES

48

12 ns

GSI TECHNOLOGY

GSI Technology

GS71108AU-12IT

3

131072 words

128000

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

TFBGA, BGA48,6X8,30

BGA48,6X8,30

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

BGA

NOT SPECIFIED

5.22

Compliant

No

3.3 V

Tape & Reel

e0

No

3A991.B.2.B

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.32.00.41

SRAMs

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

0.75 mm

compliant

48

R-PBGA-B48

Not Qualified

3.3 V

3.6 V

3.3 V

INDUSTRIAL

3 V

1

ASYNCHRONOUS

0.07 mA

128KX8

3-STATE

1.2 mm

8

17 b

1 Mb

0.005 A

1048576 bit

PARALLEL

COMMON

STANDARD SRAM

3 V

8 mm

6 mm

No

IS61WV6416DBLL-8TLI

Mfr Part No

IS61WV6416DBLL-8TLI

ISSI Datasheet

885
In Stock

-

Min: 1

Mult: 1

YES

44

8 ns

INTEGRATED SILICON SOLUTION INC

Integrated Silicon Solution Inc

IS61WV6416DBLL-8TLI

65536 words

64000

85 °C

-40 °C

PLASTIC/EPOXY

TSOP2

TSOP2, TSOP44,.46,32

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

Active

TSOP2

5.58

Yes

3 V

3A991.B.2.B

8542.32.00.41

SRAMs

CMOS

DUAL

GULL WING

1

0.8 mm

compliant

44

R-PDSO-G44

Not Qualified

3.6 V

2.5/3.3 V

INDUSTRIAL

2.4 V

ASYNCHRONOUS

0.07 mA

64KX16

3-STATE

1.2 mm

16

0.000055 A

1048576 bit

PARALLEL

COMMON

STANDARD SRAM

2 V

18.41 mm

10.16 mm

8403606JA

Mfr Part No

8403606JA

Intersil Datasheet

44
In Stock

-

Min: 1

Mult: 1

Through Hole

24-CDIP (0.600, 15.24mm)

NO

24-CERDIP

24

70 ns

INTERSIL CORP

Intersil Corporation

8403606JA

Volatile

Intersil

2048 words

2000

125 °C

-55 °C

Bulk

CERAMIC, GLASS-SEALED

DIP

DIP, DIP24,.6

DIP24,.6

RECTANGULAR

IN-LINE

Transferred

DIP

Active

NOT APPLICABLE

5.25

Compliant

No

5 V

Military grade

-55°C ~ 125°C (TA)

Bulk

-

e0

No

3A001.A.2.C

Tin/Lead (Sn/Pb) - hot dipped

125 °C

-55 °C

8542.32.00.41

SRAMs

SRAM - Asynchronous

4.5V ~ 5.5V

DUAL

THROUGH-HOLE

NOT APPLICABLE

1

2.54 mm

not_compliant

24

R-GDIP-T24

Qualified

5 V

5.5 V

5 V

MILITARY

4.5 V

16Kbit

1

ASYNCHRONOUS

0.07 mA

70 ns

SRAM

Parallel

2KX8

3-STATE

5.72 mm

8

70ns

11 b

16 kb

0.000025 A

16384 bit

MIL-STD-883

PARALLEL

COMMON

STANDARD SRAM

2 V

2K x 8

15.24 mm

No

M58WR064KT70ZB6F

Mfr Part No

M58WR064KT70ZB6F

Micron Datasheet

-

-

Min: 1

Mult: 1

YES

56

70 ns

MICRON TECHNOLOGY INC

Micron Technology Inc

M58WR064KT70ZB6F

4194304 words

4000000

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

7.70 X 9 MM, 0.75 MM PITCH, ROHS COMPLIANT, VFBGA-56

BGA56,7X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Obsolete

BGA

30

5.83

Yes

1.8 V

e1

Yes

3A991.B.1.A

NOR TYPE

TIN SILVER COPPER

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8542.32.00.51

Flash Memories

CMOS

BOTTOM

BALL

260

1

0.75 mm

compliant

56

R-PBGA-B56

Not Qualified

2 V

1.8 V

INDUSTRIAL

1.7 V

ASYNCHRONOUS

0.07 mA

4MX16

1 mm

16

0.00005 A

67108864 bit

PARALLEL

FLASH

1.8 V

NO

NO

YES

8,127

4K,32K

4 words

TOP

YES

9 mm

7.7 mm

M5M51008DRV70HI

Mfr Part No

M5M51008DRV70HI

Renesas Datasheet

25296
In Stock

-

Min: 1

Mult: 1

YES

32

70 ns

RENESAS ELECTRONICS CORP

Renesas Electronics Corporation

M5M51008DRV-70HI

2

131072 words

128000

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1-R

8 X 20 MM, REVERSE, TSOP-32

TSSOP32,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

Transferred

TSOP

20

5.48

Yes

5 V

EAR99

8542.32.00.41

SRAMs

CMOS

DUAL

GULL WING

260

1

0.5 mm

unknown

32

R-PDSO-G32

Not Qualified

5.5 V

5 V

INDUSTRIAL

4.5 V

ASYNCHRONOUS

0.07 mA

128KX8

3-STATE

1.2 mm

8

1048576 bit

PARALLEL

COMMON

STANDARD SRAM

2 V

YES

18.4 mm

8 mm

M58WR032KT70ZB6F

Mfr Part No

M58WR032KT70ZB6F

Micron Datasheet

-

-

Min: 1

Mult: 1

YES

56

70 ns

MICRON TECHNOLOGY INC

Micron Technology Inc

M58WR032KT70ZB6F

2097152 words

2000000

85 °C

-40 °C

PLASTIC/EPOXY

VFBGA

VFBGA, BGA56,7X8,30

BGA56,7X8,30

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Obsolete

BGA

30

5.82

Yes

1.8 V

e1

Yes

3A991.B.1.A

NOR TYPE

TIN SILVER COPPER

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8542.32.00.51

Flash Memories

CMOS

BOTTOM

BALL

260

1

0.75 mm

compliant

56

R-PBGA-B56

Not Qualified

2 V

1.8 V

INDUSTRIAL

1.7 V

ASYNCHRONOUS

0.07 mA

2MX16

1 mm

16

0.00005 A

33554432 bit

PARALLEL

FLASH

1.8 V

NO

NO

YES

8,63

4K,32K

4 words

TOP

YES

9 mm

7.7 mm

5962-9232404MXC

Mfr Part No

5962-9232404MXC

Cypress Semiconductor Datasheet

-

-

Min: 1

Mult: 1

NO

28

55 ns

SIMTEK CORP

Simtek Corporation

5962-9232404MXC

8192 words

8000

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP, DIP28,.3

DIP28,.3

RECTANGULAR

IN-LINE

Transferred

NOT SPECIFIED

5.78

No

5 V

Military grade

e0

3A001.A.2.C

Tin/Lead (Sn85Pb15)

SOFTWARE STORE/RECALL

8542.32.00.41

SRAMs

CMOS

DUAL

THROUGH-HOLE

NOT SPECIFIED

1

2.54 mm

unknown

R-CDIP-T28

Not Qualified

5.5 V

5 V

MILITARY

4.5 V

1

ASYNCHRONOUS

0.07 mA

8KX8

3-STATE

4.14 mm

8

0.002 A

65536 bit

MIL-STD-883

PARALLEL

NON-VOLATILE SRAM

YES

35.56 mm

7.62 mm

NM29N16R

Mfr Part No

NM29N16R

National Semiconductor Datasheet

-

-

Min: 1

Mult: 1

YES

40

48 ns

NATIONAL SEMICONDUCTOR CORP

National Semiconductor Corporation

NM29N16R

2097152 words

2000000

70 °C

PLASTIC/EPOXY

TSOP2-R

TSOP2-R, TSOP40/44,.46,32

TSOP40/44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

Obsolete

NOT SPECIFIED

5.91

No

5 V

e0

EAR99

Tin/Lead (Sn/Pb)

100K WRITE/ERASE ENDURANCE MIN.

8542.32.00.51

Flash Memories

CMOS

DUAL

GULL WING

NOT SPECIFIED

1

0.8 mm

unknown

R-PDSO-G40

Not Qualified

5.25 V

5 V

COMMERCIAL

4.75 V

ASYNCHRONOUS

0.07 mA

2MX8

3-STATE

1.2 mm

8

0.0001 A

16777216 bit

PARALLEL

FLASH

5 V

100000 Write/Erase Cycles

NO

NO

YES

512

4K

256 words

YES

YES

18.41 mm

10.16 mm