The category is 'Memory'
Memory (52)
- All Manufacturers
- Access Time-Max
- I/O Type
- Ihs Manufacturer
- JESD-30 Code
- Memory Density
- Memory IC Type
- Memory Width
- Number of Terminals
- Number of Words
- Number of Words Code
- Output Characteristics
- Supply Current-Max
- Supply Current-Max:
0.13 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Surface Mount | Number of Pins | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Nom (Vsup) | Timing Type | Typical Operating Supply Voltage | Usage Level | Operating Temperature | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Max Supply Voltage | Min Supply Voltage | Number of Ports | Nominal Supply Current | Operating Mode | Supply Current-Max | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Density | Standby Current-Max | Memory Density | Max Frequency | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Output Enable | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Access Mode | Self Refresh | Length | Width | Radiation Hardening | Lead Free |
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![]() | Mfr Part No M5M465805ATP-5 | Mitsubishi Electric | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 50 ns | MITSUBISHI ELECTRIC CORP | 8388608 words | 8000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP32,.46 | TSOP32,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | No | 3.3 V | e0 | No | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | 1 | ASYNCHRONOUS | 0.13 mA | 8MX8 | 3-STATE | 1.2 mm | 8 | 0.0005 A | 67108864 bit | COMMON | EDO DRAM | 4096 | FAST PAGE WITH EDO | NO | 20.95 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M10B11664A-35J | Elite Semiconductor Memory Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 35 ns | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | SOJ | SOJ, SOJ40,.44 | SOJ40,.44 | RECTANGULAR | SMALL OUTLINE | Obsolete | 5 V | EAR99 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | J BEND | 1 | 1.27 mm | unknown | R-PDSO-J40 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.13 mA | 64KX16 | 3-STATE | 3.76 mm | 16 | 0.002 A | 1048576 bit | COMMON | FAST PAGE DRAM | 256 | FAST PAGE | NO | 26.04 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PDM41256LA15SO | Paradigm Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 15 ns | PARADIGM TECHNOLOGY INC | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | SOJ | SOJ, SOJ28,.34 | SOJ28,.34 | RECTANGULAR | SMALL OUTLINE | Transferred | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.41 | DUAL | J BEND | 1 | 1.27 mm | unknown | R-PDSO-J28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.13 mA | 32KX8 | 3-STATE | 8 | 0.0005 A | 262144 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No HM624100HCLJP-12 | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 12 ns | RENESAS TECHNOLOGY CORP | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOJ | SOJ, SOJ32,.44 | SOJ32,.44 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOJ | 5 V | 3A991.B.2.A | 8542.32.00.41 | DUAL | J BEND | 1 | 1.27 mm | unknown | 32 | R-PDSO-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.13 mA | 1MX4 | 3-STATE | 3.76 mm | 4 | 4194304 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | 20.71 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No P4C169-20PC | Pyramid Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | 20 ns | PYRAMID SEMICONDUCTOR CORP | 4096 words | 4000 | 70 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, DIP-20 | DIP20,.3 | RECTANGULAR | IN-LINE | Active | DIP | No | 5 V | e0 | No | EAR99 | TIN LEAD | FAST CHIP SELECT CONTROL | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | 20 | R-PDIP-T20 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.13 mA | 4KX4 | 3-STATE | 5.08 mm | 4 | 16384 bit | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | 25.908 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT48LC8M16LFB4-75M:G | Micron | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 54 | 54 | 5.4 ns | 133 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT48LC8M16LFB4-75M:G | 8388608 words | 8000000 | 70 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA54,9X9,32 | BGA54,9X9,32 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 30 | 5.79 | Compliant | Yes | 3.3 V | e1 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | AUTO/SELF REFRESH | 8542.32.00.02 | DRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 54 | S-PBGA-B54 | Not Qualified | 3.3 V | 3.6 V | 3.3 V | COMMERCIAL | 3 V | 3.6 V | 3 V | 1 | 115 mA | SYNCHRONOUS | 0.13 mA | 16 b | 8MX16 | 3-STATE | 1 mm | 16 | 14 b | 128 Mb | 0.00045 A | 134217728 bit | 133 MHz | COMMON | SYNCHRONOUS DRAM | 4096 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 8 mm | 8 mm | Lead Free | |||||||||||||||||||
![]() | Mfr Part No GS71116AGP-8IT | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 6 Weeks | YES | 44 | 8 ns | GSI TECHNOLOGY | GSI Technology | GS71116AGP-8IT | 3.6 V | 3 V | 3 | Surface Mount | 16 Bit | 64 kWords | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP44,.46,32 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Active | TSOP2 | NOT SPECIFIED | 5.46 | Yes | TSOP-II | 3.3 V | Asynchronous | 3.3000 V | Industrial grade | -40 to 85 °C | e3 | Yes | 3A991.B.2.B | PURE MATTE TIN | 8542.32.00.41 | SRAMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.8 mm | compliant | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | 1 | ASYNCHRONOUS | 0.13 mA | 64KX16 | 3-STATE | 1.2 mm | 16 | 16 Bit | 1 Mbit | 0.005 A | 1048576 bit | Industrial | PARALLEL | COMMON | STANDARD SRAM | 3 V | 18.41 mm | 10.16 mm | ||||||||||||||||||||||
![]() | Mfr Part No MT48V8M16LFB4-8AT:G | Micron | Datasheet | - | - | Min: 1 Mult: 1 | YES | 54 | 7 ns | 125 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT48V8M16LFB4-8AT:G | 8388608 words | 8000000 | 105 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA54,9X9,32 | BGA54,9X9,32 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 30 | 5.79 | Compliant | Yes | 2.5 V | e1 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | AUTO/SELF REFRESH | 8542.32.00.02 | DRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 54 | S-PBGA-B54 | Not Qualified | 2.5 V | 2.7 V | 1.8/2.5,2.5 V | INDUSTRIAL | 2.3 V | 1 | SYNCHRONOUS | 0.13 mA | 8MX16 | 3-STATE | 1 mm | 16 | 0.00045 A | 134217728 bit | COMMON | SYNCHRONOUS DRAM | 4096 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 8 mm | 8 mm | Lead Free | |||||||||||||||||||||||||||||
![]() | Mfr Part No K4B1G0846G-BCH9000 | Samsung | Datasheet | - | - | Min: 1 Mult: 1 | YES | 78 | 0.255 ns | 667 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4B1G0846G-BCH9000 | 134217728 words | 128000000 | PLASTIC/EPOXY | FBGA | FBGA, BGA78,9X13,32 | BGA78,9X13,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | Obsolete | 5.84 | Yes | 1.5 V | DRAMs | CMOS | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B78 | Not Qualified | 1.5 V | 0.13 mA | 128MX8 | 3-STATE | 8 | 1073741824 bit | COMMON | DDR DRAM | 8192 | 4,8 | 4,8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT5C1008ECA-25L/IT | Micross | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 25 ns | MICROSS COMPONENTS | Micross Components | MT5C1008ECA-25L/IT | 131072 words | 128000 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | QCCN, LCC32,.45X.55 | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | End Of Life | QFJ | NOT SPECIFIED | 5 | Compliant | No | 5 V | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | TTL COMPATIBLE INPUTS/OUTPUTS, 2V DATA RETENTION, BATTERY BACKUP, LOW POWER STANDBY | 8542.32.00.41 | SRAMs | CMOS | QUAD | NO LEAD | NOT SPECIFIED | 1 | 1.27 mm | compliant | 32 | R-CQCC-N32 | Not Qualified | 5 V | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.13 mA | 128KX8 | 3-STATE | 3.048 mm | 8 | 17 b | 1 Mb | 0.001 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | 13.97 mm | 11.43 mm | No | ||||||||||||||||||||||||||||
![]() | Mfr Part No MT5C1008F-25/IT | Micross | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 32 | 25 ns | MICROSS COMPONENTS | Micross Components | MT5C1008F-25/IT | 131072 words | 128000 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | SOF | FLATPACK-32 | FL32,.4 | RECTANGULAR | SMALL OUTLINE | End Of Life | DFP | NOT SPECIFIED | 5.02 | Compliant | No | 5 V | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | TTL COMPATIBLE INPUTS/OUTPUTS, 2V DATA RETENTION, BATTERY BACKUP, LOW POWER STANDBY | 8542.32.00.41 | SRAMs | CMOS | DUAL | FLAT | NOT SPECIFIED | 1 | 1.27 mm | compliant | 32 | R-CDSO-F32 | Not Qualified | 5 V | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.13 mA | 128KX8 | 3-STATE | 3.175 mm | 8 | 17 b | 1 Mb | 0.01 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | 10.414 mm | No | ||||||||||||||||||||||||||||
![]() | Mfr Part No MT5C1008F-25L/IT | Micross | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 32 | 25 ns | MICROSS COMPONENTS | Micross Components | MT5C1008F-25L/IT | 131072 words | 128000 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | SOF | FLATPACK-32 | FL32,.4 | RECTANGULAR | SMALL OUTLINE | End Of Life | DFP | NOT SPECIFIED | 5.02 | Compliant | No | 5 V | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | TTL COMPATIBLE INPUTS/OUTPUTS, 2V DATA RETENTION, BATTERY BACKUP, LOW POWER STANDBY | 8542.32.00.41 | SRAMs | CMOS | DUAL | FLAT | NOT SPECIFIED | 1 | 1.27 mm | compliant | 32 | R-CDSO-F32 | Not Qualified | 5 V | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.13 mA | 128KX8 | 3-STATE | 3.175 mm | 8 | 17 b | 1 Mb | 0.001 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | 10.414 mm | No |
M5M465805ATP-5
Mitsubishi Electric
Package:Memory
Price: please inquire
M10B11664A-35J
Elite Semiconductor Memory Technology Inc
Package:Memory
Price: please inquire
PDM41256LA15SO
Paradigm Technology Inc
Package:Memory
Price: please inquire
HM624100HCLJP-12
Renesas Electronics Corporation
Package:Memory
Price: please inquire
P4C169-20PC
Pyramid Semiconductor Corporation
Package:Memory
Price: please inquire
MT48LC8M16LFB4-75M:G
Micron
Package:Memory
Price: please inquire
GS71116AGP-8IT
GSI Technology
Package:Memory
Price: please inquire
MT48V8M16LFB4-8AT:G
Micron
Package:Memory
Price: please inquire
K4B1G0846G-BCH9000
Samsung
Package:Memory
Price: please inquire
MT5C1008ECA-25L/IT
Micross
Package:Memory
Price: please inquire
MT5C1008F-25/IT
Micross
Package:Memory
Price: please inquire
MT5C1008F-25L/IT
Micross
Package:Memory
Price: please inquire
