The category is 'Memory'
Memory (72)
- All Manufacturers
- Access Time-Max
- Ihs Manufacturer
- JESD-30 Code
- Memory IC Type
- Memory Width
- Number of Terminals
- Number of Words
- Number of Words Code
- Operating Temperature-Max
- Organization
- Package Code
- Supply Current-Max
- Supply Current-Max:
0.14 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Material | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Number of Ports | Operating Mode | Supply Current-Max | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Density | Standby Current-Max | Memory Density | Max Frequency | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Legend | Standby Voltage-Min | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Output Enable | Page Size | Refresh Cycles | Background Color | Sequential Burst Length | Interleaved Burst Length | Access Mode | Language | Self Refresh | Length | Width | Radiation Hardening |
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![]() | Mfr Part No MT46H32M32LFCM-6:A | Micron | Datasheet | 4 | - | Min: 1 Mult: 1 | YES | 90 | 5.5 ns | 166 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46H32M32LFCM-6:A | 33554432 words | 32000000 | 70 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA90,9X15,32 | BGA90,9X15,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 30 | 5.64 | Yes | 1.8 V | e1 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | AUTO/SELF REFRESH | 8542.32.00.32 | DRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 90 | R-PBGA-B90 | Not Qualified | 1.95 V | 1.8 V | COMMERCIAL | 1.7 V | 1 | SYNCHRONOUS | 0.14 mA | 32MX32 | 3-STATE | 1 mm | 32 | 0.0006 A | 1073741824 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 13 mm | 10 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No MT46H32M32LFCM-75IT:A | Micron | Datasheet | 817 | - | Min: 1 Mult: 1 | YES | 90 | 6 ns | 133 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT46H32M32LFCM-75IT:A | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA90,9X15,32 | BGA90,9X15,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 30 | 5.37 | Yes | 1.8 V | e1 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | AUTO/SELF REFRESH | 8542.32.00.32 | DRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 90 | R-PBGA-B90 | Not Qualified | 1.95 V | 1.8 V | INDUSTRIAL | 1.7 V | 1 | SYNCHRONOUS | 0.14 mA | 32MX32 | 3-STATE | 1 mm | 32 | 0.0006 A | 1 | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 13 mm | 10 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No W9864G2GH-6 | Winbond | Datasheet | 580 | - | Min: 1 Mult: 1 | YES | 86 | 5 ns | 166 MHz | WINBOND ELECTRONICS CORP | Winbond Electronics Corp | W9864G2GH-6 | 3 | 2097152 words | 2000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP86,.46,20 | TSSOP86,.46,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP2 | 40 | 8.4 | Non-Compliant | Yes | 3.3 V | Yes | EAR99 | 70 °C | 0 °C | AUTO/SELF REFRESH | 8542.32.00.02 | DRAMs | CMOS | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 86 | R-PDSO-G86 | Not Qualified | 3.3 V | 3.6 V | 3.3 V | COMMERCIAL | 3 V | 1 | SYNCHRONOUS | 0.14 mA | 32 b | 2MX32 | 3-STATE | 1.2 mm | 32 | 13 b | 64 Mb | 0.003 A | 67108864 bit | 166 MHz | COMMON | DDR DRAM | 4096 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | No | |||||||||||||||||||||
![]() | Mfr Part No MT5C2568DCJ-25/IT | Micross | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 25 ns | MICROSS COMPONENTS | Micross Components | MT5C2568DCJ-25/IT | 32768 words | 32000 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | SOJ | SOJ, SOJ28,.44 | SOJ28,.44 | RECTANGULAR | SMALL OUTLINE | Active | SOJ | NOT SPECIFIED | 5.47 | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.41 | SRAMs | CMOS | DUAL | J BEND | NOT SPECIFIED | 1 | 1.27 mm | compliant | 28 | R-CDSO-J28 | Not Qualified | 5.5 V | 5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.14 mA | 32KX8 | 3-STATE | 4.2164 mm | 8 | 0.005 A | 262144 bit | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | 10.16 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W9864G2IH-6 | Winbond | Datasheet | 40 | - | Min: 1 Mult: 1 | YES | 86 | 5 ns | 166 MHz | WINBOND ELECTRONICS CORP | Winbond Electronics Corp | W9864G2IH-6 | 2097152 words | 2000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSSOP86,.46,20 | TSSOP86,.46,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Active | TSOP2 | NOT SPECIFIED | 5.19 | Yes | 3.3 V | EAR99 | AUTO/SELF REFRESH | 8542.32.00.02 | DRAMs | CMOS | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.5 mm | compliant | 86 | R-PDSO-G86 | Not Qualified | 3.6 V | 3.3 V | COMMERCIAL | 3 V | 1 | SYNCHRONOUS | 0.14 mA | 2MX32 | 3-STATE | 1.2 mm | 32 | 0.002 A | 67108864 bit | COMMON | SYNCHRONOUS DRAM | 4096 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No AS7C32096A-15TI | Alliance Memory | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 15 ns | ALLIANCE MEMORY INC | Miscellaneous | 483520987283 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP44,.46,32 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | 30 | 5.51 | No | 3.3 V | e0 | No | 3A991.B.2.A | TIN LEAD | 8542.32.00.41 | SRAMs | CMOS | DUAL | GULL WING | 240 | 1 | 0.8 mm | compliant | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | 3/3.3 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.14 mA | 256KX8 | 3-STATE | 1.2 mm | 8 | 0.008 A | 2097152 bit | PARALLEL | COMMON | STANDARD SRAM | 3 V | 18.415 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IDT70V07L25PF | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | YES | Polystyrene | 80 | 25 ns | INTEGRATED DEVICE TECHNOLOGY INC | Brady | IDT70V07L25PF | RAM, SRAM | 3 | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | LQFP | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-80 | QFP80,.64SQ | SQUARE | FLATPACK, LOW PROFILE | Obsolete | QFP | 20 | 5.14 | Non-Compliant | No | 3.3 V | e0 | No | EAR99 | Safety Signs | Tin/Lead (Sn85Pb15) | 70 °C | 0 °C | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | 8542.32.00.41 | SRAMs | CMOS | QUAD | GULL WING | 240 | 1 | 0.65 mm | not_compliant | 80 | S-PQFP-G80 | Not Qualified | 3.6 V | 3.3 V | COMMERCIAL | 3 V | Parallel | 2 | ASYNCHRONOUS | 0.14 mA | 32KX8 | 3-STATE | 1.6 mm | 8 | 0.003 A | 262144 bit | PARALLEL | COMMON | DUAL-PORT SRAM | Watch Your Step. Falls Can Result In Injury. | 3 V | YES | White | English | 14 mm | 14 mm | |||||||||||||||||||||
![]() | Mfr Part No MSM548262-60JS | LAPIS Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 60 ns | LAPIS SEMICONDUCTOR CO LTD | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | SOJ | 0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-40 | SOJ40,.44 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOJ | 5 V | EAR99 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 8 SAM PORT | 8542.32.00.02 | DUAL | J BEND | 1 | 1.27 mm | unknown | 40 | R-PDSO-J40 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 2 | ASYNCHRONOUS | 0.14 mA | 256KX8 | 3.75 mm | 8 | 0.008 A | 2097152 bit | VIDEO DRAM | FAST PAGE | 26.03 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5962-87515123A | Teledyne e2v | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 25 ns | TELEDYNE E2V (UK) LTD | 8192 words | 8000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | WQCCN | LCC28,.45SQ | SQUARE | CHIP CARRIER, WINDOW | Active | 5 V | e0 | 3A001.A.2.C | TIN LEAD | POWER SWITCHED PROM | 8542.32.00.61 | QUAD | NO LEAD | 1 | 1.27 mm | compliant | S-CQCC-N28 | Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.14 mA | 8KX8 | 3-STATE | 2.8956 mm | 8 | 0.05 A | 65536 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | UVPROM | 11.43 mm | 11.43 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS42S16800A-10TL | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 54 | 7 ns | 100 MHz | INTEGRATED SILICON SOLUTION INC | 8388608 words | 8000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP54,.46,32 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | Yes | 3.3 V | e3 | EAR99 | MATTE TIN | AUTO/SELF REFRESH | 8542.32.00.02 | DUAL | GULL WING | 260 | 1 | 0.8 mm | compliant | 10 | 54 | R-PDSO-G54 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | 1 | SYNCHRONOUS | 0.14 mA | 8MX16 | 3-STATE | 1.2 mm | 16 | 0.002 A | 134217728 bit | COMMON | SYNCHRONOUS DRAM | 4096 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No W9812G6IH-5 | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 54 | 4.5 ns | 200 MHz | WINBOND ELECTRONICS CORP | 8388608 words | 8000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP54,.46,32 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Not Recommended | TSOP2 | Yes | 3.3 V | EAR99 | AUTO/SELF REFRESH | 8542.32.00.02 | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.8 mm | compliant | NOT SPECIFIED | 54 | R-PDSO-G54 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | 1 | SYNCHRONOUS | 0.14 mA | 8MX16 | 3-STATE | 1.2 mm | 16 | 0.002 A | 134217728 bit | COMMON | SYNCHRONOUS DRAM | 4096 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No KM44V16104AS-6 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 60 ns | SAMSUNG SEMICONDUCTOR INC | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP32,.46 | TSOP32,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | No | 3.3 V | e0 | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | 1 | ASYNCHRONOUS | 0.14 mA | 16MX4 | 3-STATE | 1.2 mm | 4 | 0.0005 A | 67108864 bit | COMMON | EDO DRAM | 4096 | FAST PAGE WITH EDO | NO | 20.95 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CMRD-67130L-55 | Temic Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 55 ns | TEMIC SEMICONDUCTORS | 1024 words | 1000 | 70 °C | CERAMIC, METAL-SEALED COFIRED | QFP | QFP64,.47SQ,20 | SQUARE | FLATPACK | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | QUAD | FLAT | 1 | 0.5 mm | unknown | S-CQFP-F64 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 2 | ASYNCHRONOUS | 0.14 mA | 1KX8 | 3-STATE | 8 | 0.000005 A | 8192 bit | PARALLEL | COMMON | MULTI-PORT SRAM | 2 V | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TC55V1403J-15 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 15 ns | TOSHIBA CORP | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOJ | SOJ, SOJ32,.44 | SOJ32,.44 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOJ | No | 3.3 V | e0 | 3A991.B.2.A | Tin/Lead (Sn/Pb) | CAN ALSO BE CONFIGURED AS 1M X 4 | 8542.32.00.41 | DUAL | J BEND | 1 | 1.27 mm | unknown | 32 | R-PDSO-J32 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.14 mA | 1MX4 | 3-STATE | 3.7 mm | 4 | 0.01 A | 4194304 bit | PARALLEL | CONFIGURABLE | CACHE SRAM | 3 V | 1 | 20.96 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MSM5416125A-40JS | LAPIS Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 40 ns | LAPIS SEMICONDUCTOR CO LTD | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOJ | SOJ, SOJ40,.44 | SOJ40,.44 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOJ | No | 5 V | e0 | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | J BEND | 1 | 1.27 mm | unknown | 40 | R-PDSO-J40 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.14 mA | 128KX16 | 3-STATE | 3.75 mm | 16 | 0.002 A | 2097152 bit | COMMON | FAST PAGE DRAM | 512 | FAST PAGE | NO | 26.03 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AS7C1024A-20JI | Alliance Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 20 ns | ALLIANCE SEMICONDUCTOR CORP | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOJ | SOJ, SOJ32,.44 | SOJ32,.44 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOJ | No | 5 V | e0 | 3A991.B.2.B | TIN LEAD | 8542.32.00.41 | DUAL | J BEND | 225 | 1 | 1.27 mm | unknown | 32 | R-PDSO-J32 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.14 mA | 128KX8 | 3-STATE | 3.683 mm | 8 | 0.01 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | 20.955 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MD51V65805E-50TA | LAPIS Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 50 ns | LAPIS SEMICONDUCTOR CO LTD | 8388608 words | 8000000 | 70 °C | PLASTIC/EPOXY | TSOP | TSOP, TSOP32,.46 | TSOP32,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | 3.3 V | EAR99 | 8542.32.00.02 | DUAL | GULL WING | 1.27 mm | unknown | R-PDSO-G32 | Not Qualified | COMMERCIAL | 0.14 mA | 8MX8 | 3-STATE | 8 | 0.0005 A | 67108864 bit | COMMON | FAST PAGE DRAM | 4096 | NO | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No NN511664J-50 | United Microelectronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 50 ns | NIPPON STEEL SEMICONDUCTOR CORP | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | SOJ | SOJ, SOJ40,.44 | SOJ40,.44 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | 5 V | e0 | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | J BEND | 1 | 1.27 mm | unknown | R-PDSO-J40 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.14 mA | 64KX16 | 3-STATE | 16 | 0.001 A | 1048576 bit | COMMON | FAST PAGE DRAM | 256 | FAST PAGE | NO | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TC55328J-25 | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 25 ns | TOSHIBA CORP | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | SOJ | SOJ, SOJ28,.34 | SOJ28,.34 | RECTANGULAR | SMALL OUTLINE | Active | SOJ | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.41 | DUAL | J BEND | 1 | 1.27 mm | unknown | 28 | R-PDSO-J28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.14 mA | 32KX8 | 3-STATE | 3.7 mm | 8 | 0.001 A | 262144 bit | PARALLEL | COMMON | CACHE SRAM | 4.5 V | YES | 18.42 mm | 7.7 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No X2816BDI-45 | Xicor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 450 ns | XICOR INC | 2048 words | 2000 | 85 °C | -40 °C | CERAMIC | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T24 | Not Qualified | INDUSTRIAL | 0.14 mA | 2KX8 | 8 | 0.07 A | 16384 bit | PARALLEL | EEPROM | YES | NO | NO | 16 words |
MT46H32M32LFCM-6:A
Micron
Package:Memory
Price: please inquire
MT46H32M32LFCM-75IT:A
Micron
Package:Memory
Price: please inquire
W9864G2GH-6
Winbond
Package:Memory
Price: please inquire
MT5C2568DCJ-25/IT
Micross
Package:Memory
Price: please inquire
W9864G2IH-6
Winbond
Package:Memory
Price: please inquire
AS7C32096A-15TI
Alliance Memory
Package:Memory
Price: please inquire
IDT70V07L25PF
Renesas
Package:Memory
Price: please inquire
MSM548262-60JS
LAPIS Semiconductor Co Ltd
Package:Memory
Price: please inquire
5962-87515123A
Teledyne e2v
Package:Memory
Price: please inquire
IS42S16800A-10TL
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
W9812G6IH-5
Winbond Electronics Corp
Package:Memory
Price: please inquire
KM44V16104AS-6
Samsung Semiconductor
Package:Memory
Price: please inquire
CMRD-67130L-55
Temic Semiconductors
Package:Memory
Price: please inquire
TC55V1403J-15
Toshiba America Electronic Components
Package:Memory
Price: please inquire
MSM5416125A-40JS
LAPIS Semiconductor Co Ltd
Package:Memory
Price: please inquire
AS7C1024A-20JI
Alliance Semiconductor Corporation
Package:Memory
Price: please inquire
MD51V65805E-50TA
LAPIS Semiconductor Co Ltd
Package:Memory
Price: please inquire
NN511664J-50
United Microelectronics Corporation
Package:Memory
Price: please inquire
TC55328J-25
Toshiba America Electronic Components
Package:Memory
Price: please inquire
X2816BDI-45
Xicor Inc
Package:Memory
Price: please inquire
