The category is 'Memory'
Memory (72)
- All Manufacturers
- Access Time-Max
- Ihs Manufacturer
- JESD-30 Code
- Memory IC Type
- Memory Width
- Number of Terminals
- Number of Words
- Number of Words Code
- Operating Temperature-Max
- Organization
- Package Code
- Supply Current-Max
- Supply Current-Max:
0.14 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Surface Mount | Number of Pins | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Density | Standby Current-Max | Memory Density | Max Frequency | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Data Retention Time-Min | Standby Voltage-Min | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Output Enable | Page Size | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Access Mode | Self Refresh | Length | Width | Radiation Hardening |
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![]() | Mfr Part No MCM6226AWJ45 | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 45 ns | MOTOROLA INC | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOJ | 0.400 INCH, SOJ-32 | SOJ32,.44 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.41 | DUAL | J BEND | 1 | 1.27 mm | unknown | R-PDSO-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.14 mA | 128KX8 | 3-STATE | 3.75 mm | 8 | 0.015 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | YES | 20.96 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No X2816BDM | Xicor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 300 ns | XICOR INC | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | TIN LEAD | 16 BYTE PAGE WRITE; OVER 100 YEARS DATA RETENTION | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T24 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.14 mA | 2KX8 | 5.72 mm | 8 | 0.07 A | 16384 bit | PARALLEL | EEPROM | 5 V | 100 | YES | NO | NO | 16 words | 32.07 mm | 15.24 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT5C1008EC-25/883C | Micron Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 25 ns | MICRON TECHNOLOGY INC | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC | SON | SOLCC32,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.32.00.41 | DUAL | NO LEAD | 1.27 mm | not_compliant | R-XDSO-N32 | Not Qualified | MILITARY | ASYNCHRONOUS | 0.14 mA | 128KX8 | 3-STATE | 8 | 0.01 A | 1048576 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT5C1008EC-25/883C | Micross Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 25 ns | MICROSS COMPONENTS | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | SON | SON, SOLCC32,.4 | SOLCC32,.4 | RECTANGULAR | SMALL OUTLINE | End Of Life | DLCC | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | TTL COMPATIBLE INPUTS/OUTPUTS, 2V DATA RETENTION, BATTERY BACKUP, LOW POWER STANDBY | 8542.32.00.41 | DUAL | NO LEAD | 1 | 1.27 mm | compliant | 32 | R-CDSO-N32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.14 mA | 128KX8 | 3-STATE | 2.54 mm | 8 | 0.01 A | 1048576 bit | MIL-STD-883 Class C | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | 20.828 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No KM416V1204AT-7 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 70 ns | SAMSUNG SEMICONDUCTOR INC | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP44/50,.46,32 | TSOP44/50,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | No | 3.3 V | e0 | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | GULL WING | 1 | 0.8 mm | unknown | 44 | R-PDSO-G44 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | 1 | ASYNCHRONOUS | 0.14 mA | 1MX16 | 3-STATE | 1.2 mm | 16 | 0.001 A | 16777216 bit | COMMON | EDO DRAM | 1024 | FAST PAGE WITH EDO | NO | 18.41 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M12L128168A-7TG | Elite Semiconductor Memory Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 54 | 5.4 ns | 143 MHz | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC | 8388608 words | 8000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP54,.46,32 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Contact Manufacturer | TSOP2 | Yes | 3.3 V | EAR99 | AUTO/SELF REFRESH | 8542.32.00.02 | DUAL | GULL WING | 1 | 0.8 mm | unknown | 54 | R-PDSO-G54 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | 1 | SYNCHRONOUS | 0.14 mA | 8MX16 | 3-STATE | 1.2 mm | 16 | 0.002 A | 134217728 bit | COMMON | SYNCHRONOUS DRAM | 4096 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS46LR32160C-5BLA1 | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 90 | 5 ns | 200 MHz | INTEGRATED SILICON SOLUTION INC | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA90,9X15,32 | BGA90,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Yes | 1.8 V | EAR99 | AUTO/SELF REFRESH | 8542.32.00.28 | BOTTOM | BALL | 1 | 0.8 mm | compliant | R-PBGA-B90 | Not Qualified | 1.95 V | INDUSTRIAL | 1.7 V | 1 | SYNCHRONOUS | 0.14 mA | 16MX32 | 3-STATE | 1.2 mm | 32 | 0.00001 A | 536870912 bit | AEC-Q100 | COMMON | DDR1 DRAM | 8192 | 2,4,8,16 | 2,4,8,16 | FOUR BANK PAGE BURST | YES | 13 mm | 8 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS45VM32400E-75BLA2 | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 90 | 5.4 ns | 133 MHz | INTEGRATED SILICON SOLUTION INC | 4194304 words | 4000000 | 105 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA90,9X15,32 | BGA90,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | DSBGA | Yes | 1.8 V | EAR99 | AUTO/SELF REFRESH | 8542.32.00.02 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 90 | R-PBGA-B90 | Not Qualified | 1.95 V | INDUSTRIAL | 1.7 V | 1 | SYNCHRONOUS | 0.14 mA | 4MX32 | 3-STATE | 1.2 mm | 32 | 0.000015 A | 134217728 bit | AEC-Q100 | COMMON | SYNCHRONOUS DRAM | 4096 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 13 mm | 8 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M5M465165ATP-5 | Mitsubishi Electric | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 50 ns | MITSUBISHI ELECTRIC CORP | 4194304 words | 4000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP50,.46,32 | TSOP50,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | No | 3.3 V | e0 | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | GULL WING | 1 | 0.8 mm | unknown | 50 | R-PDSO-G44 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | 1 | ASYNCHRONOUS | 0.14 mA | 4MX16 | 3-STATE | 1.2 mm | 16 | 0.0005 A | 67108864 bit | COMMON | EDO DRAM | 8 | 4096 | FAST PAGE WITH EDO | NO | 20.95 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCM6323TS15 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 15 ns | MOTOROLA SEMICONDUCTOR PRODUCTS | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | TSOP | TSOP, TSOP44,.46,32 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | No | 3.3 V | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | NOT SPECIFIED | 1 | 0.8 mm | unknown | NOT SPECIFIED | R-PDSO-G44 | Not Qualified | 3.6 V | 3.3 V | COMMERCIAL | 3 V | 1 | ASYNCHRONOUS | 0.14 mA | 64KX16 | 3-STATE | 1.2 mm | 16 | 0.005 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 3 V | YES | 18.41 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No NN511662TT-50 | United Microelectronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 40 | 50 ns | NIPPON STEEL SEMICONDUCTOR CORP | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | TSOP | TSOP, TSOP40/44,.46,32 | TSOP40/44,.46,32 | RECTANGULAR | SMALL OUTLINE | Obsolete | No | 5 V | e0 | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | GULL WING | 1 | 0.8 mm | unknown | R-PDSO-G40 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.14 mA | 64KX16 | 3-STATE | 16 | 0.001 A | 1048576 bit | COMMON | EDO DRAM | 256 | FAST PAGE WITH EDO | NO | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IDT7164L30L28 | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | 29 ns | INTEGRATED DEVICE TECHNOLOGY INC | 8192 words | 8000 | 70 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC-28 | LCC28,.45SQ | SQUARE | CHIP CARRIER | Obsolete | QLCC | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.41 | QUAD | NO LEAD | 1 | 1.27 mm | not_compliant | 28 | S-CQCC-N28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.14 mA | 8KX8 | 3-STATE | 2.54 mm | 8 | 0.00006 A | 65536 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | 11.43 mm | 11.43 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS42S16800J-6BL | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | YES | 54 | 5.4 ns | 166 MHz | INTEGRATED SILICON SOLUTION INC | 3 | 8388608 words | 8000000 | 70 °C | PLASTIC/EPOXY | TFBGA | TFBGA-54 | BGA54,9X9,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Yes | 3.3 V | e1 | EAR99 | TIN SILVER COPPER | AUTO/SELF REFRESH | 8542.32.00.02 | BOTTOM | BALL | 1 | 0.8 mm | compliant | S-PBGA-B54 | 3.6 V | COMMERCIAL | 3 V | 1 | SYNCHRONOUS | 0.14 mA | 8MX16 | 3-STATE | 1.2 mm | 16 | 0.03 A | 134217728 bit | COMMON | SYNCHRONOUS DRAM | 4096 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No HYB39L256160AC-8 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 54 | 6 ns | 125 MHz | INFINEON TECHNOLOGIES AG | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TFBGA | 12 X 8 MM, 0.80 MM PITCH, PLASTIC, TFBGA-54 | BGA54,9X9,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | No | 3.3 V | e0 | EAR99 | TIN LEAD | AUTO/SELF REFRESH | 8542.32.00.24 | BOTTOM | BALL | 1 | 0.8 mm | not_compliant | 54 | R-PBGA-B54 | Not Qualified | 3.6 V | COMMERCIAL | 2.7 V | 1 | SYNCHRONOUS | 0.14 mA | 16MX16 | 3-STATE | 1.2 mm | 16 | 0.000475 A | 268435456 bit | COMMON | SYNCHRONOUS DRAM | 8192 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 12 mm | 8 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M628032-12PS1 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 12 ns | STMICROELECTRONICS | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, SKINNY, PLASTIC, DIP-28 | DIP28,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 28 | R-PDIP-T28 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.14 mA | 32KX8 | 3-STATE | 4.57 mm | 8 | 0.001 A | 262144 bit | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | 34.67 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No KM48V8100AK-6 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 60 ns | SAMSUNG SEMICONDUCTOR INC | 8388608 words | 8000000 | 70 °C | PLASTIC/EPOXY | SOJ | SOJ, SOJ32,.44 | SOJ32,.44 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOJ | No | 3.3 V | e0 | No | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | J BEND | 1 | 1.27 mm | unknown | 32 | R-PDSO-J32 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | 1 | ASYNCHRONOUS | 0.14 mA | 8MX8 | 3-STATE | 3.76 mm | 8 | 0.0005 A | 67108864 bit | COMMON | FAST PAGE DRAM | 4096 | FAST PAGE | NO | 20.96 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No KM44C16104AS-6 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 60 ns | SAMSUNG SEMICONDUCTOR INC | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP32,.46 | TSOP32,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | No | 5 V | e0 | EAR99 | TIN LEAD | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | 8542.32.00.02 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 32 | R-PDSO-G32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.14 mA | 16MX4 | 3-STATE | 1.2 mm | 4 | 0.001 A | 67108864 bit | COMMON | EDO DRAM | 4096 | FAST PAGE WITH EDO | NO | 20.95 mm | 10.16 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TD27128 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 250 ns | INTEL CORP | 16384 words | 16000 | 85 °C | -40 °C | CERAMIC, GLASS-SEALED | WDIP | HERMETIC SEALED, CERAMIC, DIP-28 | DIP28,.6 | RECTANGULAR | IN-LINE, WINDOW | Obsolete | DIP | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.61 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 28 | R-GDIP-T28 | Not Qualified | 5.25 V | INDUSTRIAL | 4.75 V | ASYNCHRONOUS | 0.14 mA | 16KX8 | 3-STATE | 5.08 mm | 8 | 131072 bit | PARALLEL | COMMON | UVPROM | 21 V | 37.084 mm | 15.24 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PDM31532LA12TI | Paradigm Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 12 ns | PARADIGM TECHNOLOGY INC | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE | Transferred | No | 3.3 V | e0 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | 8542.32.00.41 | DUAL | GULL WING | 1 | 0.8 mm | unknown | R-PDSO-G44 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | 1 | ASYNCHRONOUS | 0.14 mA | 128KX8 | 3-STATE | 8 | 0.005 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 3 V | YES | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No K4X51323PE-8GC6 | Samsung | Datasheet | 1227 | - | Min: 1 Mult: 1 | YES | 90 | 90 | 5.5 ns | 166 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4X51323PE-8GC6 | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA90,9X15,32 | BGA90,9X15,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | NOT SPECIFIED | 5.84 | Compliant | Yes | 1.8 V | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -25 °C | AUTO/SELF REFRESH | DRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | R-PBGA-B90 | Not Qualified | 1.8 V | 1.95 V | 1.8 V | OTHER | 1.7 V | 1 | SYNCHRONOUS | 0.14 mA | 32 b | 16MX32 | 3-STATE | 1 mm | 32 | 15 b | 512 Mb | 0.0003 A | 536870912 bit | 333 MHz | COMMON | DDR DRAM | 8192 | 2,4,8,16 | 2,4,8,16 | FOUR BANK PAGE BURST | YES | 13 mm | 9 mm | No |
MCM6226AWJ45
Motorola Semiconductor Products
Package:Memory
Price: please inquire
X2816BDM
Xicor Inc
Package:Memory
Price: please inquire
MT5C1008EC-25/883C
Micron Technology Inc
Package:Memory
Price: please inquire
MT5C1008EC-25/883C
Micross Components
Package:Memory
Price: please inquire
KM416V1204AT-7
Samsung Semiconductor
Package:Memory
Price: please inquire
M12L128168A-7TG
Elite Semiconductor Memory Technology Inc
Package:Memory
Price: please inquire
IS46LR32160C-5BLA1
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
IS45VM32400E-75BLA2
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
M5M465165ATP-5
Mitsubishi Electric
Package:Memory
Price: please inquire
MCM6323TS15
Freescale Semiconductor
Package:Memory
Price: please inquire
NN511662TT-50
United Microelectronics Corporation
Package:Memory
Price: please inquire
IDT7164L30L28
Integrated Device Technology Inc
Package:Memory
Price: please inquire
IS42S16800J-6BL
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
HYB39L256160AC-8
Infineon Technologies AG
Package:Memory
Price: please inquire
M628032-12PS1
STMicroelectronics
Package:Memory
Price: please inquire
KM48V8100AK-6
Samsung Semiconductor
Package:Memory
Price: please inquire
KM44C16104AS-6
Samsung Semiconductor
Package:Memory
Price: please inquire
TD27128
Intel Corporation
Package:Memory
Price: please inquire
PDM31532LA12TI
Paradigm Technology Inc
Package:Memory
Price: please inquire
K4X51323PE-8GC6
Samsung
Package:Memory
Price: please inquire
