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Memory (66)

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JESD-30 Code
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Supply Current-Max

Supply Current-Max:
0.15 mA

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Mounting Type	Package / Case	Surface Mount	Supplier Device Package	Material	Shape	Package Cooled	Material Finish	Number of Terminals	Access Time-Max	Base Product Number	Clock Frequency-Max (fCLK)	Ihs Manufacturer	Manufacturer	Manufacturer Part Number	Mfr	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supply Voltage-Nom (Vsup)	Usage Level	Operating Temperature	Packaging	Series	Size / Dimension	Tolerance	JESD-609 Code	Pbfree Code	Part Status	Number of Terminations	ECCN Code	Temperature Coefficient	Type	Resistance	Terminal Finish	Composition	Power (Watts)	Additional Feature	HTS Code	Capacitance	Subcategory	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Frequency	Frequency Stability	Pin Count	JESD-30 Code	Qualification Status	ESR (Equivalent Series Resistance)	Failure Rate	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Voltage	Attachment Method	Height Off Base (Height of Fin)	Thermal Resistance @ Forced Air Flow	Load Capacitance	Number of Ports	Operating Mode	Frequency Tolerance	Supply Current-Max	Organization	Output Characteristics	Seated Height-Max	Memory Width	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Programming Voltage	Endurance	Write Cycle Time-Max (tWC)	Data Retention Time-Min	Write Protection	Standby Voltage-Min	Data Polling	Toggle Bit	Command User Interface	Output Enable	Page Size	Cycle Time	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Thermal Resistance @ Natural	Access Mode	Power Dissipation @ Temperature Rise	Features	Reverse Pinout	Self Refresh	Diameter	Height Seated (Max)	Length	Width	Ratings
Mfr Part No K4S643232H-UC60	Samsung	Datasheet	2 In Stock	-	Min: 1 Mult: 1			YES						86	5.5 ns		166 MHz	SAMSUNG SEMICONDUCTOR INC	Samsung Semiconductor	K4S643232H-UC60		3	2097152 words	2000000	70 °C			PLASTIC/EPOXY	TSSOP		TSSOP86,.46,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete			40	5.52		Yes	3.3 V							e6								Tin/Bismuth (Sn97Bi3)						DRAMs	CMOS	DUAL	GULL WING	260		0.5 mm	unknown				R-PDSO-G86	Not Qualified				3.3 V	COMMERCIAL										0.15 mA	2MX32	3-STATE		32	0.002 A	67108864 bit			COMMON	SYNCHRONOUS DRAM													4096	1,2,4,8,FP	1,2,4,8
Mfr Part No W9412G6JH-5	Winbond	Datasheet	520 In Stock	-	Min: 1 Mult: 1			YES						66	0.7 ns		200 MHz	WINBOND ELECTRONICS CORP	Winbond Electronics Corp	W9412G6JH-5			8388608 words	8000000	70 °C			PLASTIC/EPOXY	TSOP2	TSOP2, TSSOP66,.46	TSSOP66,.46	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2		NOT SPECIFIED	7.66		Yes	2.5 V							e3				EAR99				Tin (Sn)			AUTO/SELF REFRESH	8542.32.00.02		DRAMs	CMOS	DUAL	GULL WING	NOT SPECIFIED	1	0.65 mm	unknown			66	R-PDSO-G66	Not Qualified			2.7 V	2.5 V	COMMERCIAL	2.3 V						1	SYNCHRONOUS		0.15 mA	8MX16	3-STATE	1.2 mm	16	0.005 A	134217728 bit			COMMON	DDR DRAM													4096	2,4,8	2,4,8		FOUR BANK PAGE BURST				YES			22.22 mm	10.16 mm
Mfr Part No NAND16GAH0HZA5E	Micron	Datasheet	-	-	Min: 1 Mult: 1			YES						169				MICRON TECHNOLOGY INC	Micron Technology Inc	NAND16GAH0HZA5E					85 °C	-25 °C		PLASTIC/EPOXY	FBGA	FBGA, BGA169,14X28,20	BGA169,14X28,20	RECTANGULAR	GRID ARRAY, FINE PITCH	Active				5.69		Yes																						Other Memory ICs	CMOS	BOTTOM	BALL			0.5 mm	compliant				R-PBGA-B169	Not Qualified				1.8/3.3,3.3 V	OTHER										0.15 mA						17179869184 bit
Mfr Part No MT5C2568C-20/XT	Micross	Datasheet	-	-	Min: 1 Mult: 1			NO						28	20 ns			MICROSS COMPONENTS	Micross Components	MT5C2568C-20/XT			32768 words	32000	125 °C	-55 °C		CERAMIC, METAL-SEALED COFIRED	DIP	DIP, DIP28,.3	DIP28,.3	RECTANGULAR	IN-LINE	Active	DIP		NOT SPECIFIED	5.02		No	5 V							e0	No			3A001.A.2.C				TIN LEAD				8542.32.00.41		SRAMs	CMOS	DUAL	THROUGH-HOLE	NOT SPECIFIED	1	2.54 mm	compliant			28	R-CDIP-T28	Not Qualified			5.5 V	5 V	MILITARY	4.5 V							ASYNCHRONOUS		0.15 mA	32KX8	3-STATE	5.715 mm	8	0.005 A	262144 bit		PARALLEL	COMMON	STANDARD SRAM						4.5 V																			7.62 mm
Mfr Part No CY7C197BN-15VCT	Cypress Semiconductor	Datasheet	768 In Stock	-	Min: 1 Mult: 1			YES						24	15 ns			CYPRESS SEMICONDUCTOR CORP	Cypress Semiconductor	CY7C197BN-15VCT		1	262144 words	256000	70 °C			PLASTIC/EPOXY	SOJ	8 X 15 MM, 3.50 MM HEIGHT, MO-088, SOJ-24	SOJ24,.34	RECTANGULAR	SMALL OUTLINE	Obsolete	SOJ		NOT SPECIFIED	5.76		No	5 V								No			EAR99								8542.32.00.41		SRAMs	CMOS	DUAL	J BEND	225	1	1.27 mm	not_compliant			24	R-PDSO-J24	Not Qualified			5.5 V	5 V	COMMERCIAL	4.5 V							ASYNCHRONOUS		0.15 mA	256KX1	3-STATE	3.55 mm	1	0.01 A	262144 bit		PARALLEL	SEPARATE	STANDARD SRAM						4.5 V																		15.365 mm	7.505 mm
Mfr Part No CY7C4251-10JC	Cypress	Datasheet	-	-	Min: 1 Mult: 1	Terminal: ¼in Combos: 2, 3 or 4, w/Resistor		YES						32	8 ns		100 MHz	CYPRESS SEMICONDUCTOR CORP	BARKER MICROFARADS INC	CY7C4251-10JC		3	8192 words	8000	70 °C			PLASTIC/EPOXY	QCCJ	PLASTIC, LCC-32	LDCC32,.5X.6	RECTANGULAR	CHIP CARRIER	Obsolete	QFJ		30	8.69	Y	No	5 V			2.00in Round Case			±10%	e0				EAR99				TIN LEAD				8542.32.00.71	506uF	FIFOs	CMOS	QUAD	J BEND	225	1	1.27 mm	not_compliant			32	R-PQCC-J32	Not Qualified			5.5 V	5 V	COMMERCIAL	4.5 V	440VAC						SYNCHRONOUS		0.15 mA	8KX9	3-STATE	3.55 mm	9	0.03 A	73728 bit		PARALLEL		OTHER FIFO										YES		10 ns												13.97 mm	11.43 mm
Mfr Part No CY7C199-35LMB	Cypress	Datasheet	112 In Stock	-	Min: 1 Mult: 1	Panel mounting hole		YES						28	35 ns			CYPRESS SEMICONDUCTOR CORP	ECE/EXCEL CELL ELECTRONIC CORP	CY7C199-35LMB			32768 words	32000	125 °C	-55 °C		CERAMIC, METAL-SEALED COFIRED	QCCN	LCC-28	LCC28,.35X.55	RECTANGULAR	CHIP CARRIER	Obsolete	QLCC		30	8.35		No	5 V	Military grade		Packed by set, 10 sets per box		Compact Size, NO - 1, NC - 0		e0				3A001.A.2.C				Tin/Lead (Sn/Pb)			AUTOMATIC POWER-DOWN	8542.32.00.41		SRAMs	CMOS	QUAD	NO LEAD	240	1	1.27 mm	not_compliant			28	R-CQCC-N28	Not Qualified			5.5 V	5 V	MILITARY	4.5 V	6V AC/DC					1	ASYNCHRONOUS		0.15 mA	32KX8	3-STATE	1.905 mm	8	0.015 A	262144 bit	38535Q/M;38534H;883B	PARALLEL	COMMON	STANDARD SRAM						4.5 V				YES														13.97 mm	8.89 mm
Mfr Part No 5962-8866205UA	Analog Devices	Datasheet	-	-	Min: 1 Mult: 1		Axial	YES	Axial					28	35 ns	RLR05		TELEDYNE E2V (UK) LTD	e2v technologies	5962-8866205UA	Vishay Dale		32768 words	32000	125 °C	-55 °C	Tape & Reel (TR)	CERAMIC, METAL-SEALED COFIRED	QCCN	QCCN, LCC28,.35X.55	LCC28,.35X.55	RECTANGULAR	CHIP CARRIER	Active		Active		5.55			5 V	Military grade	-65°C ~ 150°C		Military, MIL-PRF-39017/05, RLR05	0.066 Dia x 0.150 L (1.68mm x 3.81mm)	±1%	e0			2	3A001.A.2.C	±100ppm/°C		80.6 kOhms	TIN LEAD	Metal Film	0.125W, 1/8W		8542.32.00.41		SRAMs	CMOS	QUAD	NO LEAD		1	1.27 mm	compliant				R-CQCC-N28	Qualified		M (1%)	5.5 V	5 V	MILITARY	4.5 V							ASYNCHRONOUS		0.15 mA	32KX8	3-STATE	3.048 mm	8	0.02 A	262144 bit	38535Q/M;38534H;883B	PARALLEL	COMMON	STANDARD SRAM						4.5 V													Military, Moisture Resistant, Weldable				-	13.97 mm	8.89 mm
Mfr Part No AS7C34098A-12JC	Alliance Memory	Datasheet	-	-	Min: 1 Mult: 1			YES		Aluminum	Square, Fins	Assorted (BGA, LGA, CPU, ASIC...)	Blue Anodized	44	12 ns			ALLIANCE MEMORY INC	Alliance Memory Inc	AS7C34098A-12JC			262144 words	256000	70 °C			PLASTIC/EPOXY	SOJ	SOJ, SOJ44,.44	SOJ44,.44	RECTANGULAR	SMALL OUTLINE	Obsolete	SOJ		30	5.1		No	3.3 V				pushPIN™				No	Active		3A991.B.2.A		Top Mount						8542.32.00.41		SRAMs	CMOS	DUAL	J BEND	225	1	1.27 mm	compliant			44	R-PDSO-J44	Not Qualified			3.6 V	3.3 V	COMMERCIAL	3 V		Push Pin	1.181 (30.00mm)	4.91°C/W @ 100 LFM			ASYNCHRONOUS		0.15 mA	256KX16	3-STATE	3.7592 mm	16	0.008 A	4194304 bit		PARALLEL	COMMON	STANDARD SRAM						3 V										--		--				--		1.181 (30.00mm)	1.181 (30.00mm)
Mfr Part No 5962-8866203YA	Renesas	Datasheet	177 In Stock	-	Min: 1 Mult: 1	Surface Mount	4-SOJ, 5.5mm pitch	YES						32	55 ns			INTEGRATED DEVICE TECHNOLOGY INC	Integrated Device Technology Inc	5962-8866203YA	Suntsu Electronics, Inc.		32768 words	32000	125 °C	-55 °C	Bulk	CERAMIC, METAL-SEALED COFIRED	QCCN	QCCN, LCC32,.45X.55	LCC32,.45X.55	RECTANGULAR	CHIP CARRIER	Obsolete	QFJ	Active	30	8.05	Non-Compliant	No	5 V	Military grade	-40°C ~ 85°C		SXT834	0.315 L x 0.150 W (8.00mm x 3.80mm)		e0	No			3A001.A.2.C		MHz Crystal		TIN LEAD				8542.32.00.41		SRAMs	CMOS	QUAD	NO LEAD	225	1	1.27 mm	compliant	32 MHz	±25ppm	32	R-CQCC-N32	Not Qualified	40 Ohms		5.5 V	5 V	MILITARY	4.5 V					18pF	1	Fundamental	±25ppm	0.15 mA	32KX8	3-STATE	3.048 mm	8	0.02 A	262144 bit	38535Q/M;38534H;883B	PARALLEL	COMMON	STANDARD SRAM						4.5 V				YES													0.098 (2.50mm)	13.97 mm	11.43 mm	-
Mfr Part No NAND08GAH0JZC5F	Micron Technology	Datasheet	-	-	Min: 1 Mult: 1			YES						153				MICRON TECHNOLOGY INC	Micron Technology Inc	NAND08GAH0JZC5F					85 °C	-25 °C		PLASTIC/EPOXY	FBGA	FBGA, BGA153,14X14,20	BGA153,14X14,20	SQUARE	GRID ARRAY, FINE PITCH	Obsolete				5.83		Yes																						Other Memory ICs	CMOS	BOTTOM	BALL			0.5 mm	unknown				S-PBGA-B153	Not Qualified				1.8/3.3,3.3 V	OTHER										0.15 mA						8589934592 bit
Mfr Part No KM416V1200BJ-6	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1			YES						42	60 ns			SAMSUNG SEMICONDUCTOR INC					1048576 words	1000000	70 °C			PLASTIC/EPOXY	SOJ	SOJ, SOJ42,.44	SOJ42,.44	RECTANGULAR	SMALL OUTLINE	Obsolete	SOJ					No	3.3 V							e0	No			EAR99				TIN LEAD			RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	8542.32.00.02				DUAL	J BEND		1	1.27 mm	unknown			42	R-PDSO-J42	Not Qualified			3.6 V		COMMERCIAL	3 V						1	ASYNCHRONOUS		0.15 mA	1MX16	3-STATE	3.76 mm	16	0.001 A	16777216 bit			COMMON	FAST PAGE DRAM													1024				FAST PAGE				NO			27.31 mm	10.16 mm
Mfr Part No TC55VZM216AJJN12	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1			YES						44	12 ns			TOSHIBA CORP					262144 words	256000	70 °C			PLASTIC/EPOXY	SOJ	0.400 INCH, 1.27 MM PITCH, PLASTIC, SOJ-44	SOJ44,.44	RECTANGULAR	SMALL OUTLINE	Obsolete	SOJ					No	3.3 V							e0				3A991.B.2.A				Tin/Lead (Sn/Pb)				8542.32.00.41				DUAL	J BEND		1	1.27 mm	unknown			44	R-PDSO-J44	Not Qualified			3.6 V		COMMERCIAL	3 V							ASYNCHRONOUS		0.15 mA	256KX16	3-STATE	3.7 mm	16	0.004 A	4194304 bit		PARALLEL	COMMON	CACHE SRAM						3 V																		28.58 mm	10.16 mm
Mfr Part No K4S56323LF-FL1L	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1			YES						90	7 ns		111 MHz	SAMSUNG SEMICONDUCTOR INC					8388608 words	8000000	70 °C	-25 °C		PLASTIC/EPOXY	FBGA		BGA90,9X15,32	RECTANGULAR	GRID ARRAY, FINE PITCH	Active						No	2.5 V							e0				EAR99				Tin/Lead (Sn/Pb)				8542.32.00.24				BOTTOM	BALL			0.8 mm	compliant				R-PBGA-B90	Not Qualified					OTHER										0.15 mA	8MX32			32	0.0005 A	268435456 bit			COMMON	SYNCHRONOUS DRAM													4096	1,2,4,8,FP	1,2,4,8
Mfr Part No KM68257BJ-15	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1			YES						28	15 ns			SAMSUNG SEMICONDUCTOR INC					32768 words	32000	70 °C			PLASTIC/EPOXY	SOJ	SOJ, SOJ28,.34	SOJ28,.34	RECTANGULAR	SMALL OUTLINE	Obsolete	SOJ					No	5 V							e0	No			EAR99				TIN LEAD				8542.32.00.41				DUAL	J BEND		1	1.27 mm	unknown			28	R-PDSO-J28	Not Qualified			5.5 V		COMMERCIAL	4.5 V						1	ASYNCHRONOUS		0.15 mA	32KX8	3-STATE	3.76 mm	8	0.002 A	262144 bit		PARALLEL	COMMON	STANDARD SRAM						4.5 V				YES														18.42 mm	7.62 mm
Mfr Part No KM681002J-20	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1			YES						32	20 ns			SAMSUNG SEMICONDUCTOR INC					131072 words	128000	70 °C			PLASTIC/EPOXY	SOJ	0.400 INCH, PLASTIC, SOJ-32	SOJ32,.44	RECTANGULAR	SMALL OUTLINE	Obsolete	SOJ					No	5 V							e0	No			3A991.B.2.B				TIN LEAD				8542.32.00.41				DUAL	J BEND		1	1.27 mm	unknown			32	R-PDSO-J32	Not Qualified			5.5 V		COMMERCIAL	4.5 V						1	ASYNCHRONOUS		0.15 mA	128KX8	3-STATE	3.76 mm	8	0.01 A	1048576 bit		PARALLEL	COMMON	STANDARD SRAM						4.5 V				YES														20.96 mm	10.16 mm
Mfr Part No X2864BDM-12	Xicor Inc	Datasheet	-	-	Min: 1 Mult: 1			NO						28	120 ns			XICOR INC					8192 words	8000	125 °C	-55 °C		CERAMIC, GLASS-SEALED	DIP	DIP, DIP28,.6	DIP28,.6	RECTANGULAR	IN-LINE	Obsolete						No	5 V							e0								Tin/Lead (Sn/Pb)								DUAL	THROUGH-HOLE		1	2.54 mm	unknown				R-GDIP-T28	Not Qualified			5.5 V		MILITARY	4.5 V							ASYNCHRONOUS		0.15 mA	8KX8	3-STATE	7.24 mm	8		65536 bit		PARALLEL		EEPROM	5 V	10000 Write/Erase Cycles	5 ms	10	HARDWARE		YES	NO	NO		32 words									NO				37.15 mm	15.24 mm
Mfr Part No HM514280JP-8	Hitachi Ltd	Datasheet	-	-	Min: 1 Mult: 1			YES						40	80 ns			HITACHI LTD					262144 words	256000	70 °C			PLASTIC/EPOXY	SOJ	SOJ, SOJ40,.44	SOJ40,.44	RECTANGULAR	SMALL OUTLINE	Obsolete	SOJ					No	5 V							e0	No			EAR99				TIN LEAD			RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	8542.32.00.02				DUAL	J BEND		1	1.27 mm	unknown			40	R-PDSO-J40	Not Qualified			5.5 V		COMMERCIAL	4.5 V						1	ASYNCHRONOUS		0.15 mA	256KX18	3-STATE	3.76 mm	18	0.001 A	4718592 bit			COMMON	FAST PAGE DRAM													512				FAST PAGE				NO			25.8 mm	10.16 mm
Mfr Part No PDM41256SA25D	Paradigm Technology Inc	Datasheet	-	-	Min: 1 Mult: 1			NO						28	25 ns			PARADIGM TECHNOLOGY INC					32768 words	32000	70 °C			CERAMIC, GLASS-SEALED	DIP	DIP, DIP28,.3	DIP28,.3	RECTANGULAR	IN-LINE	Obsolete						No	5 V							e0	No			EAR99				TIN LEAD				8542.32.00.41				DUAL	THROUGH-HOLE		1	2.54 mm	unknown				R-GDIP-T28	Not Qualified			5.5 V		COMMERCIAL	4.5 V						1	ASYNCHRONOUS		0.15 mA	32KX8	3-STATE		8	0.01 A	262144 bit		PARALLEL	COMMON	STANDARD SRAM						4.5 V				YES
Mfr Part No M5M4V18160DJ-6	Mitsubishi Electric	Datasheet	-	-	Min: 1 Mult: 1			YES						42	60 ns			MITSUBISHI ELECTRIC CORP					1048576 words	1000000	70 °C			PLASTIC/EPOXY	SOJ	SOJ, SOJ42,.44	SOJ42,.44	RECTANGULAR	SMALL OUTLINE	Obsolete						No	3.3 V							e0				EAR99				Tin/Lead (Sn/Pb)				8542.32.00.02				DUAL	J BEND			1.27 mm	unknown				R-PDSO-J42	Not Qualified					COMMERCIAL										0.15 mA	1MX16	3-STATE		16	0.0005 A	16777216 bit			COMMON	FAST PAGE DRAM													1024								NO

Memory (66)