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The category is 'Memory'

Memory (10)

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Access Time-Max
ECCN Code
HTS Code
I/O Type
Ihs Manufacturer
JESD-30 Code
Memory Density
Memory IC Type
Memory Width
Number of Terminals
Number of Words Code
Supply Current-Max

Supply Current-Max:
0.175 mA

Image	Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	RoHS	Mount	Surface Mount	Number of Pins	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Ihs Manufacturer	Manufacturer	Manufacturer Part Number	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Max Supply Voltage	Min Supply Voltage	Number of Ports	Nominal Supply Current	Operating Mode	Supply Current-Max	Access Time	Organization	Output Characteristics	Seated Height-Max	Memory Width	Address Bus Width	Density	Standby Current-Max	Memory Density	Parallel/Serial	I/O Type	Sync/Async	Word Size	Memory IC Type	Standby Voltage-Min	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Self Refresh	Length	Width	Radiation Hardening
	Mfr Part No W9425G6JH-5	Winbond	Datasheet	4652 In Stock	-	Min: 1 Mult: 1			YES		66	0.7 ns	200 MHz	WINBOND ELECTRONICS CORP	Winbond Electronics Corp	W9425G6JH-5		16777216 words	16000000	70 °C	PLASTIC/EPOXY	TSOP2	TSOP2, TSSOP66,.46	TSSOP66,.46	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2	NOT SPECIFIED	7.12		Yes	2.5 V			EAR99				AUTO/SELF REFRESH	8542.32.00.24	DRAMs	CMOS	DUAL	GULL WING	NOT SPECIFIED	1	0.65 mm	unknown		66	R-PDSO-G66	Not Qualified		2.7 V	2.5 V	COMMERCIAL	2.3 V			1		SYNCHRONOUS	0.175 mA		16MX16	3-STATE	1.2 mm	16			0.005 A	268435456 bit		COMMON			DDR DRAM		8192	2,4,8	2,4,8	FOUR BANK PAGE BURST	YES	22.22 mm	10.16 mm
	Mfr Part No CY7C028V-20ACT	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1			YES		100	20 ns		CYPRESS SEMICONDUCTOR CORP	Cypress Semiconductor	CY7C028V-20ACT	3	65536 words	64000	70 °C	PLASTIC/EPOXY	LFQFP	PLASTIC, MS-026, TQFP-100	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Obsolete	QFP	NOT SPECIFIED	5.9		No	3.3 V	e0	No	3A991.B.2.B	TIN LEAD			AUTOMATIC POWER-DOWN	8542.32.00.41	SRAMs	CMOS	QUAD	GULL WING	235	1	0.5 mm	not_compliant		100	S-PQFP-G100	Not Qualified		3.6 V	3.3 V	COMMERCIAL	3 V			2		ASYNCHRONOUS	0.175 mA		64KX16	3-STATE	1.6 mm	16			0.00005 A	1048576 bit	PARALLEL	COMMON			DUAL-PORT SRAM	2 V						14 mm	14 mm
	Mfr Part No CY7C024AV-20AC	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1		Surface Mount	YES	100	100	20 ns		CYPRESS SEMICONDUCTOR CORP	Cypress Semiconductor	CY7C024AV-20AC	3	4000	4000	70 °C	PLASTIC/EPOXY	LFQFP	PLASTIC, TQFP-100	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Obsolete	QFP	30	8.65	Compliant	No	3.3 V	e0		EAR99	Tin/Lead (Sn/Pb)	70 °C	0 °C		8542.32.00.41	SRAMs	CMOS	QUAD	GULL WING	240	1	0.5 mm	not_compliant		100	S-PQFP-G100	Not Qualified	3.3 V	3.6 V	3.3 V	COMMERCIAL	3 V	3.6 V	3 V	2	175 mA	ASYNCHRONOUS	0.175 mA	20 ns	4KX16	3-STATE	1.6 mm	16	24 b	64 kb	0.00005 A	65536 bit	PARALLEL	COMMON	Asynchronous	16 b	DUAL-PORT SRAM	2 V						14 mm	14 mm	No
	Mfr Part No H5TQ4G83AFR-TEL	SK Hynix Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		78	0.18 ns	1066 MHz	SK HYNIX INC				536870912 words	512000000	85 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA78,9X13,32	BGA78,9X13,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA				Yes	1.35 V			EAR99				AUTO/SELF REFRESH	8542.32.00.36			BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	unknown	NOT SPECIFIED	78	R-PBGA-B78	Not Qualified		1.45 V		OTHER	1.283 V			1		SYNCHRONOUS	0.175 mA		512MX8	3-STATE	1.2 mm	8			0.011 A	4294967296 bit		COMMON			DDR3L DRAM		8192	4,8	4,8	MULTI BANK PAGE BURST	YES	11 mm	9 mm
	Mfr Part No IS61LF12832A-6.5B3	Integrated Silicon Solution Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		165	6.5 ns	133 MHz	INTEGRATED SILICON SOLUTION INC				131072 words	128000	70 °C	PLASTIC/EPOXY	TBGA	TBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, THIN PROFILE	Active	BGA				No	3.3 V	e0	No	3A991.B.2.A	TIN LEAD			FLOW-THROUGH ARCHITECTURE	8542.32.00.41			BOTTOM	BALL		1	1 mm	compliant		165	R-PBGA-B165	Not Qualified		3.465 V		COMMERCIAL	3.135 V					SYNCHRONOUS	0.175 mA		128KX32	3-STATE	1.2 mm	32			0.03 A	4194304 bit	PARALLEL	COMMON			CACHE SRAM	3.14 V						15 mm	13 mm
	Mfr Part No MCM62486AFN11-5	Freescale Semiconductor	Datasheet	-	-	Min: 1 Mult: 1			YES		44	11.5 ns		MOTOROLA SEMICONDUCTOR PRODUCTS				32768 words	32000	70 °C	PLASTIC/EPOXY	QCCJ	QCCJ, LDCC44,.7SQ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	Obsolete					No	5 V	e0		3A991.B.2.B	Tin/Lead (Sn/Pb)				8542.32.00.41			QUAD	J BEND			1.27 mm	unknown			S-PQCC-J44	Not Qualified				COMMERCIAL						SYNCHRONOUS	0.175 mA		32KX9	3-STATE		9			0.03 A	294912 bit	PARALLEL	COMMON			STANDARD SRAM	4.5 V
	Mfr Part No IS61LF12832A-6.5TQ	Integrated Silicon Solution Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		100	6.5 ns	133 MHz	INTEGRATED SILICON SOLUTION INC			3	131072 words	128000	70 °C	PLASTIC/EPOXY	LQFP	TQFP-100	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Obsolete	QFP				No	3.3 V	e0	No	3A991.B.2.A	TIN LEAD			FLOW-THROUGH ARCHITECTURE	8542.32.00.41			QUAD	GULL WING		1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified		3.465 V		COMMERCIAL	3.135 V					SYNCHRONOUS	0.175 mA		128KX32	3-STATE	1.6 mm	32			0.03 A	4194304 bit	PARALLEL	COMMON			CACHE SRAM	3.14 V						20 mm	14 mm
	Mfr Part No CY7C1373CV25-100BGC	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1			YES		119	8.5 ns	100 MHz	CYPRESS SEMICONDUCTOR CORP			3	1048576 words	1000000	70 °C	PLASTIC/EPOXY	BGA	14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Obsolete	BGA				No	2.5 V	e0		3A991.B.2.A	Tin/Lead (Sn/Pb)			FLOW-THROUGH ARCHITECTURE	8542.32.00.41			BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	not_compliant	NOT SPECIFIED	119	R-PBGA-B119	Not Qualified		2.625 V		COMMERCIAL	2.375 V					SYNCHRONOUS	0.175 mA		1MX18	3-STATE	2.4 mm	18			0.07 A	18874368 bit	PARALLEL	COMMON			ZBT SRAM	2.38 V						22 mm	14 mm
	Mfr Part No IS61LF12832A-6.5B2	Integrated Silicon Solution Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		119	6.5 ns	133 MHz	INTEGRATED SILICON SOLUTION INC			3	131072 words	128000	70 °C	PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Active	BGA				No	3.3 V	e0	No	3A991.B.2.A	TIN LEAD			FLOW-THROUGH ARCHITECTURE	8542.32.00.41			BOTTOM	BALL		1	1.27 mm	compliant		119	R-PBGA-B119	Not Qualified		3.465 V		COMMERCIAL	3.135 V					SYNCHRONOUS	0.175 mA		128KX32	3-STATE	2.41 mm	32			0.03 A	4194304 bit	PARALLEL	COMMON			CACHE SRAM	3.14 V						22 mm	14 mm
	Mfr Part No MCM62486AFN11-5	Motorola Semiconductor Products	Datasheet	-	-	Min: 1 Mult: 1			YES		44	11.5 ns		MOTOROLA INC				32768 words	32000	70 °C	PLASTIC/EPOXY	QCCJ		LDCC44,.7SQ	SQUARE	CHIP CARRIER	Obsolete					No	5 V	e0		3A991.B.2.B	Tin/Lead (Sn/Pb)				8542.32.00.41			QUAD	J BEND			1.27 mm	unknown			S-PQCC-J44	Not Qualified				COMMERCIAL						SYNCHRONOUS	0.175 mA		32KX9	3-STATE		9			0.03 A	294912 bit	PARALLEL	COMMON			STANDARD SRAM	4.5 V