The category is 'Memory'

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  • Access Time-Max
  • Ihs Manufacturer
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  • Number of Words Code
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  • Package Body Material
  • Supply Current-Max
  • Supply Current-Max:

    0.195 mA

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Mounting Type

Surface Mount

Number of Terminals

Access Time-Max

Clock Frequency-Max (fCLK)

EEPROM

Ihs Manufacturer

Manufacturer

Manufacturer Part Number

Moisture Sensitivity Levels

MSL

Number of Words

Number of Words Code

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

RAM

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Samacsys Description

Supply Voltage-Nom (Vsup)

Series

JESD-609 Code

Pbfree Code

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Pin Count

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Note

Number of Ports

Operating Mode

Supply Current-Max

Organization

Output Characteristics

Seated Height-Max

Memory Width

Standby Current-Max

Memory Density

Parallel/Serial

I/O Type

Memory IC Type

Standby Voltage-Min

Refresh Cycles

Sequential Burst Length

Interleaved Burst Length

Access Mode

Self Refresh

Length

Width

W971GG6JB-3

Mfr Part No

W971GG6JB-3

Winbond Datasheet

-

-

Min: 1

Mult: 1

YES

84

0.45 ns

333 MHz

WINBOND ELECTRONICS CORP

Winbond Electronics Corp

W971GG6JB-3

67108864 words

64000000

85 °C

PLASTIC/EPOXY

TFBGA

TFBGA, BGA84,9X15,32

BGA84,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Obsolete

BGA

NOT SPECIFIED

5.45

Yes

1.8 V

EAR99

AUTO/SELF REFRESH

8542.32.00.02

DRAMs

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

0.8 mm

compliant

84

R-PBGA-B84

Not Qualified

1.9 V

1.8 V

OTHER

1.7 V

1

SYNCHRONOUS

0.195 mA

64MX16

3-STATE

1.2 mm

16

0.01 A

1073741824 bit

COMMON

DDR DRAM

8192

4,8

4,8

MULTI BANK PAGE BURST

YES

12.5 mm

8 mm

IDT70V25L20PFGI

Mfr Part No

IDT70V25L20PFGI

Renesas Datasheet

-

-

Min: 1

Mult: 1

SMD

YES

100

20 ns

256 x 8

INTEGRATED DEVICE TECHNOLOGY INC

Integrated Device Technology Inc

IDT70V25L20PFGI

3

n/a

8192 words

8000

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

LFQFP, QFP100,.63SQ,20

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Active

QFP

512 x 8

30

5.15

Yes

Yes

IDT IDT70V25L20PFGI SRAM Memory, 128kbit, 3 u2192 3.6 V, 20ns 100-Pin TQFP

3.3 V

PIC18

e3

Yes

EAR99

Matte Tin (Sn) - annealed

8542.32.00.41

SRAMs

CMOS

QUAD

GULL WING

260

1

0.5 mm

compliant

100

S-PQFP-G100

Not Qualified

3.6 V

3.3 V

INDUSTRIAL

3 V

-

2

ASYNCHRONOUS

0.195 mA

8KX16

3-STATE

1.6 mm

16

0.005 A

131072 bit

PARALLEL

COMMON

DUAL-PORT SRAM

3 V

14 mm

14 mm

MCM6706BRJ8

Mfr Part No

MCM6706BRJ8

Freescale Semiconductor Datasheet

-

-

Min: 1

Mult: 1

YES

32

8 ns

MOTOROLA SEMICONDUCTOR PRODUCTS

32768 words

32000

70 °C

PLASTIC/EPOXY

SOJ

SOJ, SOJ32,.34

SOJ32,.34

RECTANGULAR

SMALL OUTLINE

Obsolete

No

5 V

e0

Tin/Lead (Sn/Pb)

DUAL

J BEND

1.27 mm

unknown

R-PDSO-J32

Not Qualified

5 V

COMMERCIAL

ASYNCHRONOUS

0.195 mA

32KX8

3-STATE

8

262144 bit

PARALLEL

COMMON

STANDARD SRAM

MCM6946YJ8

Mfr Part No

MCM6946YJ8

Freescale Semiconductor Datasheet

-

-

Min: 1

Mult: 1

YES

36

8 ns

MOTOROLA SEMICONDUCTOR PRODUCTS

524288 words

512000

70 °C

PLASTIC/EPOXY

SOJ

SOJ, SOJ36,.44

SOJ36,.44

RECTANGULAR

SMALL OUTLINE

Obsolete

No

3.3 V

e0

Tin/Lead (Sn/Pb)

DUAL

J BEND

1.27 mm

unknown

R-PDSO-J36

Not Qualified

3.3 V

COMMERCIAL

ASYNCHRONOUS

0.195 mA

512KX8

3-STATE

8

0.005 A

4194304 bit

PARALLEL

COMMON

STANDARD SRAM

3 V

HM5316123F-7

Mfr Part No

HM5316123F-7

Hitachi Ltd Datasheet

-

-

Min: 1

Mult: 1

YES

64

70 ns

HITACHI LTD

131072 words

128000

70 °C

PLASTIC/EPOXY

SOP

SOP, SOP64,.54,32

SOP64,.54,32

RECTANGULAR

SMALL OUTLINE

Obsolete

SSOP

5 V

EAR99

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT

8542.32.00.02

DUAL

GULL WING

1

0.8 mm

unknown

64

R-PDSO-G64

Not Qualified

5.5 V

COMMERCIAL

4.5 V

2

ASYNCHRONOUS

0.195 mA

128KX16

3-STATE

16

0.085 A

2097152 bit

VIDEO DRAM

512

FAST PAGE

K4B1G1646G-BCK0

Mfr Part No

K4B1G1646G-BCK0

Samsung Datasheet

23
In Stock

-

Min: 1

Mult: 1

YES

96

0.225 ns

800 MHz

SAMSUNG SEMICONDUCTOR INC

Samsung Semiconductor

K4B1G1646G-BCK0

1

67108864 words

64000000

PLASTIC/EPOXY

FBGA

FBGA, BGA96,9X16,32

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, FINE PITCH

Obsolete

NOT SPECIFIED

5.8

Yes

1.5 V

e3

Yes

MATTE TIN

DRAMs

CMOS

BOTTOM

BALL

225

0.8 mm

compliant

R-PBGA-B96

Not Qualified

1.5 V

0.195 mA

64MX16

3-STATE

16

0.01 A

1073741824 bit

COMMON

DDR DRAM

8192

4,8

4,8

CY7C009V-20AI

Mfr Part No

CY7C009V-20AI

Cypress Semiconductor Datasheet

-

-

Min: 1

Mult: 1

YES

100

20 ns

CYPRESS SEMICONDUCTOR CORP

Cypress Semiconductor

CY7C009V-20AI

3

131072 words

128000

85 °C

-40 °C

PLASTIC/EPOXY

LFQFP

PLASTIC, TQFP-100

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

Obsolete

QFP

30

5.84

No

3.3 V

e0

3A991.B.2.B

TIN LEAD

AUTOMATIC POWER-DOWN

8542.32.00.41

SRAMs

CMOS

QUAD

GULL WING

240

1

0.5 mm

not_compliant

100

S-PQFP-G100

Not Qualified

3.6 V

3.3 V

INDUSTRIAL

3 V

2

ASYNCHRONOUS

0.195 mA

128KX8

3-STATE

1.6 mm

8

0.00005 A

1048576 bit

PARALLEL

COMMON

DUAL-PORT SRAM

3 V

14 mm

14 mm