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The category is 'Memory'

Memory (16)

All Manufacturers
Access Time-Max
I/O Type
Ihs Manufacturer
JESD-30 Code
Memory Density
Memory IC Type
Memory Width
Number of Functions
Number of Terminals
Number of Words
Operating Mode
Supply Current-Max

Supply Current-Max:
0.225 mA

Image	Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	RoHS	Surface Mount	Number of Pins	Number of Terminals	Access Time-Max	Approvals	Clock Frequency-Max (fCLK)	Ihs Manufacturer	Manufacturer	Manufacturer Part Number	Moisture Sensitivity Levels	Mounting Styles	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shaft Type	Supply Voltage-Nom (Vsup)	Operating Temperature	JESD-609 Code	Pbfree Code	Termination	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Output Voltage	Output Type	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Number of Ports	Operating Mode	Supply Current-Max	Organization	Output Characteristics	Seated Height-Max	Memory Width	Address Bus Width	Density	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Standby Voltage-Min	Output Enable	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Self Refresh	Input Voltage	Bearings	IP Rating	Length	Width	Radiation Hardening
	Mfr Part No MT48LC2M32B2TG-7:G	Micron	Datasheet	-	-	Min: 1 Mult: 1		YES		86	5.5 ns		143 MHz	MICRON TECHNOLOGY INC	Micron Technology Inc	MT48LC2M32B2TG-7:G			2097152 words	2000000	70 °C		PLASTIC/EPOXY	TSSOP	0.400 INCH, PLASTIC, TSOP2-86	TSSOP86,.46,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete	TSOP2	30	7.81		No		3.3 V		e0	No		EAR99	Tin/Lead (Sn/Pb)			AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	DUAL	GULL WING	235	1	0.5 mm	unknown		86	R-PDSO-G86	Not Qualified				3.6 V	3.3 V	COMMERCIAL	3 V	1	SYNCHRONOUS	0.225 mA	2MX32	3-STATE	1.2 mm	32			0.002 A	67108864 bit			COMMON	SYNCHRONOUS DRAM			4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES				22.22 mm	10.16 mm
	Mfr Part No W971GG6JB-25	Winbond	Datasheet	-	-	Min: 1 Mult: 1		YES		84	0.4 ns		400 MHz	WINBOND ELECTRONICS CORP	Winbond Electronics Corp	W971GG6JB-25			67108864 words	64000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	NOT SPECIFIED	8.15		Yes		1.8 V			Yes		EAR99				AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	compliant		84	R-PBGA-B84	Not Qualified				1.9 V	1.8 V	OTHER	1.7 V	1	SYNCHRONOUS	0.225 mA	64MX16	3-STATE	1.2 mm	16			0.01 A	1073741824 bit			COMMON	DDR DRAM			8192	4,8	4,8	MULTI BANK PAGE BURST	YES				12.5 mm	8 mm
	Mfr Part No W971GG6JB-25I	Winbond	Datasheet	-	-	Min: 1 Mult: 1		YES		84	0.4 ns		400 MHz	WINBOND ELECTRONICS CORP	Winbond Electronics Corp	W971GG6JB-25I			67108864 words	64000000	85 °C	-40 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	NOT SPECIFIED	5.62		Yes		1.8 V					EAR99				AUTO/SELF REFRESH	8542.32.00.32	DRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	compliant		84	R-PBGA-B84	Not Qualified				1.9 V	1.8 V	INDUSTRIAL	1.7 V	1	SYNCHRONOUS	0.225 mA	64MX16	3-STATE	1.2 mm	16			0.01 A	1073741824 bit			COMMON	DDR DRAM			8192	4,8	4,8	MULTI BANK PAGE BURST	YES				12.5 mm	8 mm
	Mfr Part No MT48LC2M32B2TG-6:G	Micron	Datasheet	-	-	Min: 1 Mult: 1		YES		86	5.5 ns		166 MHz	MICRON TECHNOLOGY INC	Micron Technology Inc	MT48LC2M32B2TG-6:G			2097152 words	2000000	70 °C		PLASTIC/EPOXY	TSSOP	0.400 INCH, PLASTIC, TSOP2-86	TSSOP86,.46,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete	TSOP2	30	7.73		No		3.3 V		e0	No		EAR99	Tin/Lead (Sn/Pb)			AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	DUAL	GULL WING	235	1	0.5 mm	unknown		86	R-PDSO-G86	Not Qualified				3.6 V	3.3 V	COMMERCIAL	3 V	1	SYNCHRONOUS	0.225 mA	2MX32	3-STATE	1.2 mm	32			0.002 A	67108864 bit			COMMON	SYNCHRONOUS DRAM			4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES				22.22 mm	10.16 mm
	Mfr Part No EDI88512CA20MI	Microchip	Datasheet	-	-	Min: 1 Mult: 1		YES	36	36	20 ns	CE		ELECTRONIC DESIGNS INC	Dynapar	HS35R4096D3P2		Hollowshaft	524288 words	512000	85 °C	-40 °C	PLASTIC/EPOXY	SOJ		SOJ36,.44	RECTANGULAR	SMALL OUTLINE	Obsolete		NOT SPECIFIED	5.02	Yes	No	Hollow	5 V	-40 to 85 Degrees C	e0		10 Pin Connector		Tin/Lead (Sn/Pb)	85 °C	-40 °C			SRAMs	CMOS	DUAL	J BEND	NOT SPECIFIED	1	1.27 mm	unknown			R-PDSO-J36	Not Qualified	5~26 VDC	Differential	5 V	5.5 V	5 V	INDUSTRIAL	4.5 V	1	ASYNCHRONOUS	0.225 mA	512KX8	3-STATE		8	19 b	4 Mb	0.025 A	4194304 bit		PARALLEL	COMMON	STANDARD SRAM	4.5 V	YES						5~26 VDC	Yes	IP67			No
	Mfr Part No AS5C4008EC-35	Micross Components	Datasheet	-	-	Min: 1 Mult: 1		YES		32	35 ns			MICROSS COMPONENTS					524288 words	512000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	SON	SON, SOLCC32,.45	SOLCC32,.45	RECTANGULAR	SMALL OUTLINE	Active	DLCC				No		5 V		e0	No		3A001.A.2.C	TIN LEAD				8542.32.00.41			DUAL	NO LEAD		1	1.27 mm	compliant		32	R-CDSO-N32	Not Qualified				5.5 V		MILITARY	4.5 V		ASYNCHRONOUS	0.225 mA	512KX8	3-STATE	2.54 mm	8			0.025 A	4194304 bit	38535Q/M;38534H;883B	PARALLEL	COMMON	STANDARD SRAM	4.5 V										20.955 mm	11.43 mm
	Mfr Part No MT55L64L32P1T-10	Micron Technology Inc	Datasheet	-	-	Min: 1 Mult: 1		YES		100	5 ns			MICRON TECHNOLOGY INC					65536 words	64000	70 °C		PLASTIC/EPOXY	LQFP	TQFP-100	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Transferred	QFP				No		3.3 V		e0			3A991.B.2.A	Tin/Lead (Sn/Pb)				8542.32.00.41			QUAD	GULL WING		1	0.65 mm	not_compliant		100	R-PQFP-G100	Not Qualified				3.465 V		COMMERCIAL	3.135 V		SYNCHRONOUS	0.225 mA	64KX32	3-STATE	1.6 mm	32			0.01 A	2097152 bit		PARALLEL	COMMON	ZBT SRAM	3.14 V										20 mm	14 mm
	Mfr Part No IS61NVP25618A-250TQ	Integrated Silicon Solution Inc	Datasheet	-	-	Min: 1 Mult: 1		YES		100	2.6 ns		250 MHz	INTEGRATED SILICON SOLUTION INC					262144 words	256000	70 °C		PLASTIC/EPOXY	LQFP	TQFP-100	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Obsolete	QFP				No		2.5 V		e0	No		3A991.B.2.A	TIN LEAD			PIPELINED ARCHITECTURE	8542.32.00.41			QUAD	GULL WING		1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified				2.625 V		COMMERCIAL	2.375 V		SYNCHRONOUS	0.225 mA	256KX18	3-STATE	1.6 mm	18			0.03 A	4718592 bit		PARALLEL	COMMON	ZBT SRAM	2.38 V										20 mm	14 mm
	Mfr Part No IS61NLP25618A-250TQ	Integrated Silicon Solution Inc	Datasheet	-	-	Min: 1 Mult: 1		YES		100	2.6 ns		250 MHz	INTEGRATED SILICON SOLUTION INC					262144 words	256000	70 °C		PLASTIC/EPOXY	LQFP	TQFP-100	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Obsolete	QFP				No		3.3 V		e0	No		3A991.B.2.A	TIN LEAD			PIPELINED ARCHITECTURE	8542.32.00.41			QUAD	GULL WING		1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified				3.465 V		COMMERCIAL	3.135 V		SYNCHRONOUS	0.225 mA	256KX18	3-STATE	1.6 mm	18			0.03 A	4718592 bit		PARALLEL	COMMON	ZBT SRAM	3.14 V										20 mm	14 mm
	Mfr Part No AS5C4008CW-25/883C	Micross Components	Datasheet	-	-	Min: 1 Mult: 1		NO		32	25 ns			MICROSS COMPONENTS					524288 words	512000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP, DIP32,.6	DIP32,.6	RECTANGULAR	IN-LINE	Active	DIP				No		5 V		e0	No		3A001.A.2.C	TIN LEAD				8542.32.00.41			DUAL	THROUGH-HOLE		1	2.54 mm	compliant		32	R-CDIP-T32	Not Qualified				5.5 V		MILITARY	4.5 V		ASYNCHRONOUS	0.225 mA	512KX8	3-STATE	7.493 mm	8			0.025 A	4194304 bit	MIL-STD-883 Class C	PARALLEL	COMMON	STANDARD SRAM	4.5 V										40.64 mm	15.24 mm
	Mfr Part No MT58LC64K18C4EJ-7	Micron Technology Inc	Datasheet	-	-	Min: 1 Mult: 1		YES		52	7 ns			MICRON TECHNOLOGY INC					65536 words	64000	70 °C		PLASTIC/EPOXY	QCCJ	PLASTIC, LCC-52	LDCC52,.8SQ	SQUARE	CHIP CARRIER	Obsolete	LCC				No		3.3 V		e0	No		3A991.B.2.A	TIN LEAD			BURST COUNTER; BYTE WRITE CONTROL; SELF TIMED REGISTER	8542.32.00.41			QUAD	J BEND		1	1.27 mm	not_compliant		52	S-PQCC-J52	Not Qualified				3.465 V		COMMERCIAL	3.135 V	1	SYNCHRONOUS	0.225 mA	64KX18	3-STATE	4.57 mm	18			0.005 A	1179648 bit		PARALLEL	COMMON	STANDARD SRAM	3.14 V	YES									19.125 mm	19.125 mm
	Mfr Part No AS5C4008ECJ-20	Micross Components	Datasheet	-	-	Min: 1 Mult: 1		YES		32	20 ns			MICROSS COMPONENTS					524288 words	512000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	SOJ	SOJ, SOJ32,.44	SOJ32,.44	RECTANGULAR	SMALL OUTLINE	Active	SOJ				No		5 V		e0	No		3A001.A.2.C	TIN LEAD				8542.32.00.41			DUAL	J BEND		1	1.27 mm	compliant		32	R-CDSO-J32	Not Qualified				5.5 V		MILITARY	4.5 V		ASYNCHRONOUS	0.225 mA	512KX8	3-STATE	4.064 mm	8			0.025 A	4194304 bit	38535Q/M;38534H;883B	PARALLEL	COMMON	STANDARD SRAM	4.5 V										20.955 mm	11.1506 mm
	Mfr Part No IDT70V25S20PFI	Integrated Device Technology Inc	Datasheet	-	-	Min: 1 Mult: 1		YES		100	20 ns			INTEGRATED DEVICE TECHNOLOGY INC			3		8192 words	8000	85 °C	-40 °C	PLASTIC/EPOXY	LFQFP	LFQFP, QFP100,.63SQ,20	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Obsolete	QFP				No		3.3 V		e0	No		EAR99	Tin/Lead (Sn85Pb15)				8542.32.00.41			QUAD	GULL WING	240	1	0.5 mm	not_compliant	20	100	S-PQFP-G100	Not Qualified				3.6 V		INDUSTRIAL	3 V	2	ASYNCHRONOUS	0.225 mA	8KX16	3-STATE	1.6 mm	16			0.015 A	131072 bit		PARALLEL	COMMON	MULTI-PORT SRAM	3 V										14 mm	14 mm
	Mfr Part No MT48LC2M32B2TG-7IT:G	Micron	Datasheet	-	-	Min: 1 Mult: 1		YES		86	5.5 ns		143 MHz	MICRON TECHNOLOGY INC	Micron Technology Inc	MT48LC2M32B2TG-7IT:G			2097152 words	2000000	85 °C	-40 °C	PLASTIC/EPOXY	TSSOP	0.400 INCH, PLASTIC, TSOP2-86	TSSOP86,.46,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete	TSOP2	30	7.81		No		3.3 V		e0	No		EAR99	Tin/Lead (Sn/Pb)			AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	DUAL	GULL WING	235	1	0.5 mm	unknown		86	R-PDSO-G86	Not Qualified				3.6 V	3.3 V	INDUSTRIAL	3 V	1	SYNCHRONOUS	0.225 mA	2MX32	3-STATE	1.2 mm	32			0.002 A	67108864 bit			COMMON	SYNCHRONOUS DRAM			4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES				22.22 mm	10.16 mm
	Mfr Part No GS8321Z36GE-166	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		YES		165	8 ns		166 MHz	GSI TECHNOLOGY	GSI Technology	GS8321Z36GE-166	3		1048576 words	1000000	70 °C		PLASTIC/EPOXY	LBGA	15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Obsolete	BGA	NOT SPECIFIED	8.43		Yes		2.5 V		e1	Yes		3A991.B.2.B	Tin/Silver/Copper (Sn/Ag/Cu)			FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY	8542.32.00.41	SRAMs	CMOS	BOTTOM	BALL	260	1	1 mm	compliant		165	R-PBGA-B165	Not Qualified				2.7 V	2.5/3.3 V	COMMERCIAL	2.3 V		SYNCHRONOUS	0.225 mA	1MX36	3-STATE	1.5 mm	36			0.06 A	37748736 bit		PARALLEL	COMMON	ZBT SRAM	2.3 V										17 mm	15 mm
	Mfr Part No MT48LC2M32B2B5-6:G	Micron	Datasheet	-	-	Min: 1 Mult: 1		YES		90	5.5 ns		166 MHz	MICRON TECHNOLOGY INC	Micron Technology Inc	MT48LC2M32B2B5-6:G			2097152 words	2000000	70 °C		PLASTIC/EPOXY	VFBGA	VFBGA, BGA90,9X15,32	BGA90,9X15,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Obsolete	BGA	30	5.05		Yes		3.3 V		e1	Yes		EAR99	Tin/Silver/Copper (Sn/Ag/Cu)			AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	compliant		90	R-PBGA-B90	Not Qualified				3.6 V	3.3 V	COMMERCIAL	3 V	1	SYNCHRONOUS	0.225 mA	2MX32	3-STATE	1 mm	32			0.002 A	67108864 bit			COMMON	SYNCHRONOUS DRAM			4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES				13 mm	8 mm