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Memory (24)

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Supply Current-Max:
0.23 mA

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Lifecycle Status	Mount	Surface Mount	Number of Pins	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Ihs Manufacturer	Manufacturer	Manufacturer Package Code	Manufacturer Part Number	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supply Voltage-Nom (Vsup)	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Brand Name	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Max Supply Voltage	Min Supply Voltage	Number of Ports	Nominal Supply Current	Operating Mode	Supply Current-Max	Access Time	Data Bus Width	Organization	Output Characteristics	Seated Height-Max	Memory Width	Address Bus Width	Density	Standby Current-Max	Memory Density	Max Frequency	Parallel/Serial	I/O Type	Sync/Async	Word Size	Memory IC Type	Standby Voltage-Min	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Self Refresh	Length	Width	Thickness	Radiation Hardening	Lead Free
Mfr Part No MT47H64M4BP-5E:B	Micron	Datasheet	-	-	Min: 1 Mult: 1			YES		60	0.6 ns	200 MHz	MICRON TECHNOLOGY INC	Micron Technology Inc		MT47H64M4BP-5E:B		67108864 words	64000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA60,9X11,32	BGA60,9X11,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	30	5.82		Yes	1.8 V	e1		EAR99	Tin/Silver/Copper (Sn/Ag/Cu)			AUTO/SELF REFRESH	8542.32.00.24	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	not_compliant			60	R-PBGA-B60	Not Qualified			1.9 V	1.8 V	OTHER	1.7 V			1		SYNCHRONOUS	0.23 mA			64MX4	3-STATE	1.2 mm	4			0.005 A	268435456 bit			COMMON			DDR DRAM		8192	4,8	4,8	FOUR BANK PAGE BURST	YES	12 mm	8 mm
Mfr Part No HYB18T512160BF-3.7	Qimonda	Datasheet	-	-	Min: 1 Mult: 1			YES		84	0.5 ns	266 MHz	QIMONDA AG	Qimonda AG		HYB18T512160BF-3.7	3	33554432 words	32000000	95 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	40	5.68		Yes	1.8 V			EAR99				AUTO/SELF REFRESH	8542.32.00.28	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	unknown			84	R-PBGA-B84	Not Qualified			1.9 V	1.8 V	OTHER	1.7 V			1		SYNCHRONOUS	0.23 mA			32MX16	3-STATE	1.2 mm	16			0.007 A	536870912 bit			COMMON			DDR DRAM		8192	4,8	4,8	FOUR BANK PAGE BURST	YES	12.5 mm	10 mm
Mfr Part No MT47H64M16HR-3L:H	Micron	Datasheet	-	-	Min: 1 Mult: 1	Obsolete (Last Updated: 2 years ago)	Surface Mount	YES	84	84	0.45 ns	333 MHz	MICRON TECHNOLOGY INC	Micron Technology Inc		MT47H64M16HR-3L:H		67108864 words	64000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	30	5.15	Compliant	Yes	1.8 V	e1	Yes	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	0 °C	AUTO/SELF REFRESH	8542.32.00.32	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	compliant			84	R-PBGA-B84	Not Qualified		1.8 V	1.9 V	1.8 V	OTHER	1.7 V	1.9 V	1.7 V	1	135 mA	SYNCHRONOUS	0.23 mA	450 ps	16 b	64MX16	3-STATE	1.2 mm	16	16 b	1 Gb	0.007 A	1073741824 bit	667 MHz		COMMON			DDR DRAM		8192	4,8	4,8	MULTI BANK PAGE BURST	YES	12.5 mm	8 mm		No	Lead Free
Mfr Part No W9812G2GH-6	Winbond	Datasheet	-	-	Min: 1 Mult: 1		Surface Mount	YES	86	86	5 ns	166 MHz	WINBOND ELECTRONICS CORP	Winbond Electronics Corp		W9812G2GH-6		4194304 words	4000000	70 °C		PLASTIC/EPOXY	TSOP2	TSOP2, TSSOP86,.46,20	TSSOP86,.46,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2	NOT SPECIFIED	5.7	Compliant	Yes	3.3 V			EAR99		70 °C	0 °C	AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	DUAL	GULL WING	NOT SPECIFIED	1	0.5 mm	compliant			86	R-PDSO-G86	Not Qualified		3.3 V	3.6 V	3.3 V	COMMERCIAL	3 V			1		SYNCHRONOUS	0.23 mA		32 b	4MX32	3-STATE	1.2 mm	32	14 b	128 Mb	0.002 A	134217728 bit	166 MHz		COMMON			SYNCHRONOUS DRAM		4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES	22.22 mm	10.16 mm		No
Mfr Part No MT48LC4M16A2TG-7E:G	Micron	Datasheet	-	-	Min: 1 Mult: 1			YES		54	5.4 ns	143 MHz	MICRON TECHNOLOGY INC	Micron Technology Inc		MT48LC4M16A2TG-7E:G		4194304 words	4000000	70 °C		PLASTIC/EPOXY	TSOP2	0.400 INCH, PLASTIC, TSOP2-54	TSOP54,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2	30	8.47		No	3.3 V	e0	No	EAR99	Tin/Lead (Sn/Pb)			AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	DUAL	GULL WING	235	1	0.8 mm	unknown			54	R-PDSO-G54	Not Qualified			3.6 V	3.3 V	COMMERCIAL	3 V			1		SYNCHRONOUS	0.23 mA			4MX16	3-STATE	1.2 mm	16			0.002 A	67108864 bit			COMMON			SYNCHRONOUS DRAM		4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES	22.22 mm	10.16 mm
Mfr Part No IC41C16256-35KG	Integrated Silicon Solution Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		40	35 ns		INTEGRATED SILICON SOLUTION INC					262144 words	256000	70 °C		PLASTIC/EPOXY	SOJ	SOJ, SOJ40,.44	SOJ40,.44	RECTANGULAR	SMALL OUTLINE	Obsolete					Yes	5 V	e3		EAR99	MATTE TIN			RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	8542.32.00.02			DUAL	J BEND	260	1	1.27 mm	compliant		10		R-PDSO-J40	Not Qualified			5.5 V		COMMERCIAL	4.5 V			1		ASYNCHRONOUS	0.23 mA			256KX16	3-STATE		16			0.001 A	4194304 bit			COMMON			EDO DRAM		512			EDO PAGE	NO
Mfr Part No IS42R32160F-7BL	Integrated Silicon Solution Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		90	5.4 ns	143 MHz	INTEGRATED SILICON SOLUTION INC					16777216 words	16000000	70 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA90,9X15,32	BGA90,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Active					Yes	2.5 V			EAR99				PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH	8542.32.00.28			BOTTOM	BALL		1	0.8 mm	compliant				R-PBGA-B90	Not Qualified			3.6 V		COMMERCIAL	2.3 V			1		SYNCHRONOUS	0.23 mA			16MX32	3-STATE	1.2 mm	32			0.004 A	536870912 bit			COMMON			SYNCHRONOUS DRAM		8192	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES	13 mm	8 mm
Mfr Part No IS61LPS25636T-133TQ	Integrated Silicon Solution Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		100	4 ns	133 MHz	INTEGRATED SILICON SOLUTION INC					262144 words	256000	70 °C		PLASTIC/EPOXY	LQFP	TQFP-100	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Obsolete	QFP				No	3.3 V	e0	No	3A991.B.2.A	TIN LEAD				8542.32.00.41			QUAD	GULL WING		1	0.65 mm	compliant			100	R-PQFP-G100	Not Qualified			3.63 V		COMMERCIAL	3.135 V					SYNCHRONOUS	0.23 mA			256KX36	3-STATE	1.6 mm	36			0.04 A	9437184 bit		PARALLEL	COMMON			CACHE SRAM	3.14 V						20 mm	14 mm
Mfr Part No K4H1G0838A-UCB0	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1			YES		66	0.75 ns	133 MHz	SAMSUNG SEMICONDUCTOR INC				3	134217728 words	128000000	70 °C		PLASTIC/EPOXY	TSSOP	TSSOP, TSSOP66,.46	TSSOP66,.46	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete					Yes	2.5 V	e6	Yes	EAR99	TIN BISMUTH				8542.32.00.32			DUAL	GULL WING	260		0.635 mm	compliant				R-PDSO-G66	Not Qualified					COMMERCIAL							0.23 mA			128MX8	3-STATE		8			0.015 A	1073741824 bit			COMMON			DDR1 DRAM		8192	2,4,8	2,4,8
Mfr Part No HYB18TC256800BF-3.7	Qimonda AG	Datasheet	-	-	Min: 1 Mult: 1			YES		60	0.5 ns	266 MHz	QIMONDA AG				3	33554432 words	32000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA60,9X11,32	BGA60,9X11,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA				Yes	1.8 V		Yes	EAR99				AUTO/SELF REFRESH	8542.32.00.24			BOTTOM	BALL		1	0.8 mm	unknown			60	R-PBGA-B60	Not Qualified			1.9 V		OTHER	1.7 V			1		SYNCHRONOUS	0.23 mA			32MX8	3-STATE	1.2 mm	8			0.007 A	268435456 bit			COMMON			DDR1 DRAM		8192	4,8	4,8	FOUR BANK PAGE BURST	YES	10.5 mm	10 mm
Mfr Part No H5PS1G83EFR-S5	SK Hynix Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		60	0.4 ns	400 MHz	SK HYNIX INC					134217728 words	128000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA60,9X11,32	BGA60,9X11,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA				Yes	1.8 V	e1		EAR99	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			AUTO/SELF REFRESH	8542.32.00.32			BOTTOM	BALL	260	1	0.8 mm	unknown		20	60	R-PBGA-B60	Not Qualified			1.9 V		OTHER	1.7 V			1		SYNCHRONOUS	0.23 mA			128MX8	3-STATE	1.2 mm	8				1073741824 bit			COMMON			DDR2 DRAM		8192	4,8	4,8	MULTI BANK PAGE BURST	YES	11.4 mm	8 mm
Mfr Part No 70V9159L9BF	Renesas	Datasheet	-	-	Min: 1 Mult: 1		Surface Mount	YES	100	100	9 ns	66.7 MHz	INTEGRATED DEVICE TECHNOLOGY INC	Integrated Device Technology Inc	BF100	70V9159L9BF	3	8000	8000	70 °C		PLASTIC/EPOXY	LFBGA	10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FBGA-100	BGA100,10X10,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	CABGA	NOT SPECIFIED	5.9	Compliant	No	3.3 V	e0	No	EAR99	Tin/Lead (Sn63Pb37)	70 °C	0 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS	BOTTOM	BALL	225	1	0.8 mm	not_compliant	40 MHz		100	S-PBGA-B100	Not Qualified	Integrated Device Technology	3.3 V	3.6 V	3.3 V	COMMERCIAL	3 V	3.6 V	3 V	2	230 mA	SYNCHRONOUS	0.23 mA	20 ns		8KX9	3-STATE	1.4 mm	9	13 b	72 kb	0.003 A	73728 bit		PARALLEL	COMMON	Synchronous	9 b	DUAL-PORT SRAM	3 V						10 mm	10 mm	1.4 mm	No	Contains Lead
Mfr Part No IS42R32160F-7BLI	Integrated Silicon Solution Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		90	5.4 ns	143 MHz	INTEGRATED SILICON SOLUTION INC					16777216 words	16000000	85 °C	-40 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA90,9X15,32	BGA90,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Active					Yes	2.5 V			EAR99				PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH	8542.32.00.28			BOTTOM	BALL		1	0.8 mm	compliant				R-PBGA-B90	Not Qualified			3.6 V		INDUSTRIAL	2.3 V			1		SYNCHRONOUS	0.23 mA			16MX32	3-STATE	1.2 mm	32			0.004 A	536870912 bit			COMMON			SYNCHRONOUS DRAM		8192	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES	13 mm	8 mm
Mfr Part No K4H511638G-LCB3T	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1			YES		66	0.7 ns	166 MHz	SAMSUNG SEMICONDUCTOR INC				3	33554432 words	32000000	70 °C		PLASTIC/EPOXY	TSSOP		TSSOP66,.46	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete					Yes	2.5 V	e6	Yes	EAR99	TIN BISMUTH				8542.32.00.28			DUAL	GULL WING	260		0.635 mm	unknown				R-PDSO-G66	Not Qualified					COMMERCIAL							0.23 mA			32MX16	3-STATE		16			0.005 A	536870912 bit			COMMON			DDR1 DRAM		8192	2,4,8	2,4,8
Mfr Part No T35L6432A-6Q	TM Technology Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		100	6 ns	83 MHz	TM TECHNOLOGY INC					65536 words	64000	70 °C		PLASTIC/EPOXY	QFP	QFP, QFP100,.7X.9	QFP100,.7X.9	RECTANGULAR	FLATPACK	Contact Manufacturer						3.3 V			3A991.B.2.A					8542.32.00.41			QUAD	GULL WING		1	0.65 mm	unknown				R-PQFP-G100	Not Qualified			3.6 V		COMMERCIAL	3.1 V					SYNCHRONOUS	0.23 mA			64KX32	3-STATE	3.302 mm	32			0.005 A	2097152 bit		PARALLEL	COMMON			STANDARD SRAM	3.14 V						20 mm	14 mm
Mfr Part No KM616V4002BTI-12	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1			YES		44	12 ns		SAMSUNG SEMICONDUCTOR INC					262144 words	256000	85 °C	-40 °C	PLASTIC/EPOXY	TSOP2	TSOP2, TSOP44,.46,32	TSOP44,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2				No	3.3 V	e0	No	3A991.B.2.A	TIN LEAD				8542.32.00.41			DUAL	GULL WING		1	0.8 mm	unknown			44	R-PDSO-G44	Not Qualified			3.6 V		INDUSTRIAL	3 V					ASYNCHRONOUS	0.23 mA			256KX16	3-STATE	1.2 mm	16			0.01 A	4194304 bit		PARALLEL	COMMON			STANDARD SRAM	3 V						18.41 mm	10.16 mm
Mfr Part No M5M54R08AJ-10	Mitsubishi Electric	Datasheet	-	-	Min: 1 Mult: 1			YES		36	10 ns		MITSUBISHI ELECTRIC CORP					524288 words	512000	70 °C		PLASTIC/EPOXY	SOJ	SOJ, SOJ36,.44	SOJ36,.44	RECTANGULAR	SMALL OUTLINE	Obsolete	SOJ				No	3.3 V	e0		3A991.B.2.A	TIN LEAD				8542.32.00.41			DUAL	J BEND		1	1.27 mm	unknown			36	R-PDSO-J36	Not Qualified			3.6 V		COMMERCIAL	3 V					ASYNCHRONOUS	0.23 mA			512KX8	3-STATE	3.55 mm	8			0.01 A	4194304 bit		PARALLEL	COMMON			STANDARD SRAM	3.14 V						23.49 mm	10.16 mm
Mfr Part No IC41C16256-35KG	Integrated Circuit Solution Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		40	35 ns		INTEGRATED CIRCUIT SOLUTION INC					262144 words	256000	70 °C		PLASTIC/EPOXY	SOJ	SOJ, SOJ40,.44	SOJ40,.44	RECTANGULAR	SMALL OUTLINE	Transferred					Yes	5 V			EAR99					8542.32.00.02			DUAL	J BEND			1.27 mm	unknown				R-PDSO-J40	Not Qualified					COMMERCIAL							0.23 mA			256KX16	3-STATE		16			0.001 A	4194304 bit			COMMON			EDO DRAM		512				NO
Mfr Part No MT48LC4M16A2B4-7E:G	Micron	Datasheet	-	-	Min: 1 Mult: 1			YES		54	5.4 ns	143 MHz	MICRON TECHNOLOGY INC	Micron Technology Inc		MT48LC4M16A2B4-7E:G		4194304 words	4000000	70 °C		PLASTIC/EPOXY	VFBGA	VFBGA, BGA54,9X9,32	BGA54,9X9,32	SQUARE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Obsolete	BGA	30	5.42		Yes	3.3 V	e1	Yes	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)			AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	compliant			54	S-PBGA-B54	Not Qualified			3.6 V	3.3 V	COMMERCIAL	3 V			1		SYNCHRONOUS	0.23 mA			4MX16	3-STATE	1 mm	16			0.002 A	67108864 bit			COMMON			SYNCHRONOUS DRAM		4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES	8 mm	8 mm
Mfr Part No W9812G2IH-6	Winbond	Datasheet	-	-	Min: 1 Mult: 1			YES		86	5 ns	166 MHz	WINBOND ELECTRONICS CORP	Winbond Electronics Corp		W9812G2IH-6		4194304 words	4000000	70 °C		PLASTIC/EPOXY	TSOP2	TSOP2, TSSOP86,.46,20	TSSOP86,.46,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2	NOT SPECIFIED	5.71		Yes	3.3 V			EAR99				AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	DUAL	GULL WING	NOT SPECIFIED	1	0.5 mm	unknown			86	R-PDSO-G86	Not Qualified			3.6 V	3/3.3 V	COMMERCIAL	2.7 V			1		SYNCHRONOUS	0.23 mA			4MX32	3-STATE	1.2 mm	32			0.002 A	134217728 bit			COMMON			SYNCHRONOUS DRAM		4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES	22.22 mm	10.16 mm

Memory (24)