The category is 'Memory'
Memory (24)
- All Manufacturers
- Access Time-Max
- I/O Type
- Ihs Manufacturer
- JESD-30 Code
- Memory Density
- Memory IC Type
- Memory Width
- Number of Terminals
- Number of Words
- Number of Words Code
- Organization
- Supply Current-Max
- Supply Current-Max:
0.23 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Access Time-Max | Base Product Number | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Memory Types | Mfr | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Operating Temperature | Series | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Clock Frequency | Supply Current-Max | Access Time | Memory Format | Memory Interface | Organization | Output Characteristics | Seated Height-Max | Memory Width | Write Cycle Time - Word, Page | Address Bus Width | Density | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Standby Voltage-Min | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Memory Organization | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No CY7C09269V-9AC | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 100 | 100 | 9 ns | 67 MHz | CYPRESS SEMICONDUCTOR CORP | Cypress Semiconductor | CY7C09269V-9AC | 3 | 16000 | 16000 | 70 °C | PLASTIC/EPOXY | LFQFP | PLASTIC, MS-026, TQFP-100 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | 30 | 5.84 | Compliant | No | 3.3 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | QUAD | GULL WING | 240 | 1 | 0.5 mm | not_compliant | 40 MHz | 100 | S-PQFP-G100 | Not Qualified | 3.3 V | 3.6 V | 3.3 V | COMMERCIAL | 3 V | 3.6 V | 3 V | 2 | 230 mA | SYNCHRONOUS | 0.23 mA | 20 ns | 16KX16 | 3-STATE | 1.6 mm | 16 | 28 b | 256 kb | 0.00025 A | 262144 bit | PARALLEL | COMMON | Synchronous | 16 b | DUAL-PORT SRAM | 3 V | 14 mm | 14 mm | |||||||||||||||||||||||||
| Mfr Part No K4H1G0438A-UCB0 | Samsung | Datasheet | - | - | Min: 1 Mult: 1 | YES | 66 | 0.75 ns | 133 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4H1G0438A-UCB0 | 3 | 268435456 words | 256000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | NOT SPECIFIED | 5.84 | Non-Compliant | Yes | 2.5 V | e6 | Yes | Tin/Bismuth (Sn97Bi3) | DRAMs | CMOS | DUAL | GULL WING | 260 | 0.635 mm | compliant | 133 MHz | R-PDSO-G66 | Not Qualified | 2.5 V | COMMERCIAL | 0.23 mA | 256MX4 | 3-STATE | 4 | 0.015 A | 1073741824 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No GS816018BGT-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 6.5 ns | 200 MHz | GSI TECHNOLOGY | GSI Technology | GS816018BGT-200 | 3 | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | LQFP | LQFP, QFP100,.63X.87 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | NOT SPECIFIED | 5.28 | Compliant | Yes | 2.5 V | e3 | Yes | 3A991.B.2.B | PURE MATTE TIN | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | QUAD | GULL WING | 260 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | 2.7 V | 2.5/3.3 V | COMMERCIAL | 2.3 V | 2 | SYNCHRONOUS | 0.23 mA | 1MX18 | 3-STATE | 1.6 mm | 18 | 20 b | 18 Mb | 0.04 A | 18874368 bit | PARALLEL | COMMON | CACHE SRAM | 2.3 V | 20 mm | 14 mm | No | |||||||||||||||||||||||||||||||||
| Mfr Part No CY7C09359AV-9AC | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | 1 Week | Surface Mount | 100-LQFP | YES | 100-TQFP (14x14) | 100 | 9 ns | CY7C09359 | CYPRESS SEMICONDUCTOR CORP | Cypress Semiconductor | CY7C09359AV-9AC | Volatile | Cypress Semiconductor Corp | 3 | 8192 words | 8000 | 70 °C | Bulk | PLASTIC/EPOXY | LFQFP | PLASTIC, TQFP-100 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | Active | 30 | 8.76 | No | 3.3 V | 0°C ~ 70°C (TA) | - | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.41 | SRAMs | SRAM - Dual Port, Synchronous | 3V ~ 3.6V | QUAD | GULL WING | 240 | 1 | 0.5 mm | not_compliant | 100 | S-PQFP-G100 | Not Qualified | 3.6 V | 3.3 V | COMMERCIAL | 3 V | 72Kbit | 2 | SYNCHRONOUS | 67 MHz | 0.23 mA | 9 ns | SRAM | Parallel | 8KX18 | 3-STATE | 1.6 mm | 18 | - | 0.0005 A | 147456 bit | PARALLEL | COMMON | DUAL-PORT SRAM | 3 V | 4K x 18 | 14 mm | 14 mm |