The category is 'Memory'
Memory (7)
- All Manufacturers
- Access Time-Max
- ECCN Code
- HTS Code
- I/O Type
- Ihs Manufacturer
- JESD-30 Code
- Length
- Memory Density
- Memory IC Type
- Memory Width
- Number of Terminals
- Supply Current-Max
- Supply Current-Max:
0.235 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Data Rate Architecture | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Series | JESD-609 Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Number of Ports | Operating Mode | Supply Current-Max | Access Time | Architecture | Organization | Output Characteristics | Seated Height-Max | Memory Width | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Length | Width |
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![]() | Mfr Part No IS64NVP12836EC-200B3LA3 | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 165 | 3.1 ns | 200 MHz | INTEGRATED SILICON SOLUTION INC | 3 | 131072 words | 128000 | 125 °C | -40 °C | PLASTIC/EPOXY | TBGA | TBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Active | BGA | Yes | 2.5 V | e1 | 3A991.B.2.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.41 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 10 | 165 | R-PBGA-B165 | Not Qualified | 2.625 V | AUTOMOTIVE | 2.375 V | SYNCHRONOUS | 0.235 mA | 128KX36 | 3-STATE | 1.2 mm | 36 | 0.1 A | 4718592 bit | AEC-Q100 | PARALLEL | COMMON | ZBT SRAM | 2.37 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS64NVP12836EC-200B2LA3 | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 119 | 3.1 ns | 200 MHz | INTEGRATED SILICON SOLUTION INC | 3 | 131072 words | 128000 | 125 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA119,7X17,50 | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | Active | BGA | Yes | 2.5 V | e1 | 3A991.B.2.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.41 | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | 10 | 119 | R-PBGA-B119 | Not Qualified | 2.625 V | AUTOMOTIVE | 2.375 V | SYNCHRONOUS | 0.235 mA | 128KX36 | 3-STATE | 3.5 mm | 36 | 0.1 A | 4718592 bit | AEC-Q100 | PARALLEL | COMMON | ZBT SRAM | 2.37 V | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS64NVF12832EC-7.5B2LA3 | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 119 | 7.5 ns | INTEGRATED SILICON SOLUTION INC | 131072 words | 128000 | 125 °C | -40 °C | PLASTIC/EPOXY | HBGA | HBGA, BGA119,7X17,50 | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY, HEAT SINK/SLUG | Active | Yes | 2.5 V | 3A991.B.2.A | 8542.32.00.41 | BOTTOM | BALL | 1 | 1.27 mm | compliant | R-PBGA-B119 | Not Qualified | 2.625 V | AUTOMOTIVE | 2.375 V | SYNCHRONOUS | 0.235 mA | 128KX32 | 3-STATE | 3.5 mm | 32 | 0.06 A | 4194304 bit | AEC-Q100 | PARALLEL | COMMON | ZBT SRAM | 2.38 V | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS64NLP25618EC-200B2LA3 | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 119 | 3.1 ns | 200 MHz | INTEGRATED SILICON SOLUTION INC | 3 | 262144 words | 256000 | 125 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA119,7X17,50 | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | Active | BGA | Yes | 3.3 V | e1 | 3A991.B.2.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.32.00.41 | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | 10 | 119 | R-PBGA-B119 | Not Qualified | 3.465 V | AUTOMOTIVE | 3.135 V | SYNCHRONOUS | 0.235 mA | 256KX18 | 3-STATE | 3.5 mm | 18 | 0.1 A | 4718592 bit | AEC-Q100 | PARALLEL | COMMON | ZBT SRAM | 3.14 V | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS64NLP12832EC-200TQLA3 | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 3.1 ns | 200 MHz | INTEGRATED SILICON SOLUTION INC | 3 | 131072 words | 128000 | 125 °C | -40 °C | PLASTIC/EPOXY | LQFP | LQFP, QFP100,.63X.87 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Active | QFP | Yes | 3.3 V | e3 | 3A991.B.2.A | Matte Tin (Sn) | 8542.32.00.41 | QUAD | GULL WING | 260 | 1 | 0.65 mm | compliant | 10 | 100 | R-PQFP-G100 | Not Qualified | 3.465 V | AUTOMOTIVE | 3.135 V | SYNCHRONOUS | 0.235 mA | 128KX32 | 3-STATE | 1.6 mm | 32 | 0.1 A | 4194304 bit | AEC-Q100 | PARALLEL | COMMON | ZBT SRAM | 3.14 V | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS64NVF12832EC-7.5B3LA3 | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 165 | 7.5 ns | INTEGRATED SILICON SOLUTION INC | 131072 words | 128000 | 125 °C | -40 °C | PLASTIC/EPOXY | TBGA | TBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | Active | Yes | 2.5 V | 3A991.B.2.A | 8542.32.00.41 | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B165 | Not Qualified | 2.625 V | AUTOMOTIVE | 2.375 V | SYNCHRONOUS | 0.235 mA | 128KX32 | 3-STATE | 1.2 mm | 32 | 0.06 A | 4194304 bit | AEC-Q100 | PARALLEL | COMMON | ZBT SRAM | 2.38 V | 15 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS8320E36AGT-200I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | TQFP-100 | YES | 100 | 6.5 ns | 200 MHz | SDR | GSI TECHNOLOGY | Parallel | GSI Technology | GS8320E36AGT-200I | 200 MHz | 2, 2.7 V | + 85 C | 1.7, 2.3 V | - 40 C | Surface Mount | SMD/SMT | 36 Bit | 1 MWords | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LQFP | LQFP, QFP100,.63X.87 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Active | QFP | NOT SPECIFIED | 5.39 | Yes | TQFP | 3.6 V | 2.3 V | 1.8 V | Synchronous | 1.8, 2.5 V | Industrial grade | -40 to 100 °C | GS8320E36AGT | 3A991.B.2.B | ALSO OPERATED WITH 2.5V SUPPLY; PIPELINE/FLOW THROUGH ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | 2 V | 2.5/3.3 V | INDUSTRIAL | 1.7 V | 36 Mbit | 4 | SYNCHRONOUS | 0.235 mA | 6.5 ns | Flow-Through/Pipelined | 1MX36 | 3-STATE | 1.6 mm | 36 | 36 Mbit | 0.03 A | 37748736 bit | Industrial | PARALLEL | COMMON | CACHE SRAM | 2.3 V | 20 mm | 14 mm |
IS64NVP12836EC-200B3LA3
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
IS64NVP12836EC-200B2LA3
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
IS64NVF12832EC-7.5B2LA3
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
IS64NLP25618EC-200B2LA3
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
IS64NLP12832EC-200TQLA3
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
IS64NVF12832EC-7.5B3LA3
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
GS8320E36AGT-200I
GSI Technology
Package:Memory
Price: please inquire
