The category is 'Memory'

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  • Access Time-Max
  • Additional Feature
  • Clock Frequency-Max (fCLK)
  • ECCN Code
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  • Ihs Manufacturer
  • JESD-30 Code
  • Memory Density
  • Memory IC Type
  • Number of Functions
  • Supply Current-Max
  • Supply Current-Max:

    0.245 mA

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Surface Mount

Number of Terminals

Access Time-Max

Clock Frequency-Max (fCLK)

Ihs Manufacturer

Manufacturer

Manufacturer Part Number

Moisture Sensitivity Levels

Number of Words

Number of Words Code

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Supply Voltage-Nom (Vsup)

JESD-609 Code

Pbfree Code

ECCN Code

Terminal Finish

Max Operating Temperature

Min Operating Temperature

Additional Feature

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Pin Count

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Number of Ports

Operating Mode

Supply Current-Max

Organization

Output Characteristics

Seated Height-Max

Memory Width

Address Bus Width

Density

Standby Current-Max

Memory Density

Parallel/Serial

I/O Type

Memory IC Type

Standby Voltage-Min

Refresh Cycles

Sequential Burst Length

Interleaved Burst Length

Access Mode

Self Refresh

Length

Width

Radiation Hardening

IS42R32160F-6BL

Mfr Part No

IS42R32160F-6BL

Integrated Silicon Solution Inc Datasheet

-

-

Min: 1

Mult: 1

YES

90

5.4 ns

166 MHz

INTEGRATED SILICON SOLUTION INC

16777216 words

16000000

70 °C

PLASTIC/EPOXY

TFBGA

TFBGA, BGA90,9X15,32

BGA90,9X15,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Yes

2.5 V

EAR99

PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH

8542.32.00.28

BOTTOM

BALL

1

0.8 mm

compliant

R-PBGA-B90

Not Qualified

3.6 V

COMMERCIAL

2.3 V

1

SYNCHRONOUS

0.245 mA

16MX32

3-STATE

1.2 mm

32

0.004 A

536870912 bit

COMMON

SYNCHRONOUS DRAM

8192

1,2,4,8,FP

1,2,4,8

FOUR BANK PAGE BURST

YES

13 mm

8 mm

GS82032AT-133I

Mfr Part No

GS82032AT-133I

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

YES

100

10 ns

133 MHz

GSI TECHNOLOGY

GSI Technology

GS82032AT-133I

3

65536 words

64000

85 °C

-40 °C

PLASTIC/EPOXY

LQFP

LQFP, QFP100,.63X.87

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

Obsolete

QFP

NOT SPECIFIED

5.89

Non-Compliant

No

3.3 V

e0

3A991.B.2.B

Tin/Lead (Sn/Pb)

FLOW-THROUGH OR PIPELINED ARCHITECTURE

8542.32.00.41

SRAMs

CMOS

QUAD

GULL WING

NOT SPECIFIED

1

0.65 mm

unknown

100

R-PQFP-G100

Not Qualified

3.6 V

2.5/3.3,3.3 V

INDUSTRIAL

3.135 V

SYNCHRONOUS

0.245 mA

64KX32

3-STATE

1.6 mm

32

0.015 A

2097152 bit

PARALLEL

COMMON

CACHE SRAM

3.14 V

20 mm

14 mm

GS8321Z36E-166I

Mfr Part No

GS8321Z36E-166I

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

YES

165

8 ns

166 MHz

GSI TECHNOLOGY

GSI Technology

GS8321Z36E-166I

3

1048576 words

1000000

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

15 X 17 MM, 1 MM PITCH, FPBGA-165

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

Obsolete

BGA

NOT SPECIFIED

5.71

Compliant

No

2.5 V

No

3A991.B.2.B

85 °C

-40 °C

FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY

8542.32.00.41

SRAMs

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

2.7 V

2.5/3.3 V

INDUSTRIAL

2.3 V

1

SYNCHRONOUS

0.245 mA

1MX36

3-STATE

1.5 mm

36

20 b

36 Mb

0.08 A

37748736 bit

PARALLEL

COMMON

ZBT SRAM

2.3 V

17 mm

15 mm

No

70V5388S100BGI

Mfr Part No

70V5388S100BGI

Integrated Device Technology Datasheet

-

-

Min: 1

Mult: 1

YES

272

3.6 ns

100 MHz

INTEGRATED DEVICE TECHNOLOGY INC

Integrated Device Technology Inc

70V5388S100BGI

3

65536 words

64000

85 °C

-40 °C

PLASTIC/EPOXY

BGA

27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, BGA-272

BGA272,20X20,50

SQUARE

GRID ARRAY

Obsolete

30

5.88

No

3.3 V

e0

No

3A991.B.2.A

Tin/Lead (Sn63Pb37)

PIPELINED ARCHITECTURE

8542.32.00.41

SRAMs

CMOS

BOTTOM

BALL

225

1

1.27 mm

not_compliant

S-PBGA-B272

Not Qualified

3.45 V

3.3 V

INDUSTRIAL

3.15 V

4

SYNCHRONOUS

0.245 mA

64KX18

3-STATE

18

0.015 A

1179648 bit

PARALLEL

COMMON

APPLICATION SPECIFIC SRAM

3.15 V