The category is 'Memory'
Memory (4)
- All Manufacturers
- Access Time-Max
- Additional Feature
- Clock Frequency-Max (fCLK)
- ECCN Code
- HTS Code
- I/O Type
- Ihs Manufacturer
- JESD-30 Code
- Memory Density
- Memory IC Type
- Number of Functions
- Supply Current-Max
- Supply Current-Max:
0.245 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Density | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Access Mode | Self Refresh | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No IS42R32160F-6BL | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 90 | 5.4 ns | 166 MHz | INTEGRATED SILICON SOLUTION INC | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA90,9X15,32 | BGA90,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Yes | 2.5 V | EAR99 | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 8542.32.00.28 | BOTTOM | BALL | 1 | 0.8 mm | compliant | R-PBGA-B90 | Not Qualified | 3.6 V | COMMERCIAL | 2.3 V | 1 | SYNCHRONOUS | 0.245 mA | 16MX32 | 3-STATE | 1.2 mm | 32 | 0.004 A | 536870912 bit | COMMON | SYNCHRONOUS DRAM | 8192 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 13 mm | 8 mm | ||||||||||||||||||||||||
![]() | Mfr Part No GS82032AT-133I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 10 ns | 133 MHz | GSI TECHNOLOGY | GSI Technology | GS82032AT-133I | 3 | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | LQFP | LQFP, QFP100,.63X.87 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | NOT SPECIFIED | 5.89 | Non-Compliant | No | 3.3 V | e0 | 3A991.B.2.B | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | QUAD | GULL WING | NOT SPECIFIED | 1 | 0.65 mm | unknown | 100 | R-PQFP-G100 | Not Qualified | 3.6 V | 2.5/3.3,3.3 V | INDUSTRIAL | 3.135 V | SYNCHRONOUS | 0.245 mA | 64KX32 | 3-STATE | 1.6 mm | 32 | 0.015 A | 2097152 bit | PARALLEL | COMMON | CACHE SRAM | 3.14 V | 20 mm | 14 mm | |||||||||||||
![]() | Mfr Part No GS8321Z36E-166I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 165 | 8 ns | 166 MHz | GSI TECHNOLOGY | GSI Technology | GS8321Z36E-166I | 3 | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | 15 X 17 MM, 1 MM PITCH, FPBGA-165 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | NOT SPECIFIED | 5.71 | Compliant | No | 2.5 V | No | 3A991.B.2.B | 85 °C | -40 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 2.7 V | 2.5/3.3 V | INDUSTRIAL | 2.3 V | 1 | SYNCHRONOUS | 0.245 mA | 1MX36 | 3-STATE | 1.5 mm | 36 | 20 b | 36 Mb | 0.08 A | 37748736 bit | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 17 mm | 15 mm | No | ||||||||
![]() | Mfr Part No 70V5388S100BGI | Integrated Device Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 272 | 3.6 ns | 100 MHz | INTEGRATED DEVICE TECHNOLOGY INC | Integrated Device Technology Inc | 70V5388S100BGI | 3 | 65536 words | 64000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, BGA-272 | BGA272,20X20,50 | SQUARE | GRID ARRAY | Obsolete | 30 | 5.88 | No | 3.3 V | e0 | No | 3A991.B.2.A | Tin/Lead (Sn63Pb37) | PIPELINED ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 225 | 1 | 1.27 mm | not_compliant | S-PBGA-B272 | Not Qualified | 3.45 V | 3.3 V | INDUSTRIAL | 3.15 V | 4 | SYNCHRONOUS | 0.245 mA | 64KX18 | 3-STATE | 18 | 0.015 A | 1179648 bit | PARALLEL | COMMON | APPLICATION SPECIFIC SRAM | 3.15 V |
IS42R32160F-6BL
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
GS82032AT-133I
GSI Technology
Package:Memory
Price: please inquire
GS8321Z36E-166I
GSI Technology
Package:Memory
Price: please inquire
70V5388S100BGI
Integrated Device Technology
Package:Memory
Price: please inquire
