The category is 'Memory'
Memory (9)
- All Manufacturers
- Access Time-Max
- Additional Feature
- ECCN Code
- HTS Code
- I/O Type
- Ihs Manufacturer
- JESD-30 Code
- Length
- Memory Density
- Memory IC Type
- Number of Functions
- Supply Current-Max
- Supply Current-Max:
0.255 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Data Rate Architecture | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Series | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Gender | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Contact Style | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Memory Size | Number of Ports | Operating Mode | Supply Current-Max | Access Time | Architecture | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Output Enable | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Access Mode | Self Refresh | Length | Width | Radiation Hardening |
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![]() | Mfr Part No GS816036BGT-200 | GSI Technology | Datasheet | 14 | - | Min: 1 Mult: 1 | YES | 100 | 6.5 ns | 200 MHz | GSI TECHNOLOGY | GSI Technology | GS816036BGT-200 | 3 | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | LQFP | LQFP, QFP100,.63X.87 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | NOT SPECIFIED | 8.45 | Compliant | Yes | 2.5 V | e3 | Yes | 3A991.B.2.B | PURE MATTE TIN | 70 °C | 0 °C | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | QUAD | GULL WING | 260 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | 2.7 V | 2.5/3.3 V | COMMERCIAL | 2.3 V | 4 | SYNCHRONOUS | 0.255 mA | 512KX36 | 3-STATE | 1.6 mm | 36 | 19 b | 18 Mb | 0.04 A | 18874368 bit | PARALLEL | COMMON | CACHE SRAM | 2.3 V | 20 mm | 14 mm | No | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT48LC64M8A2TG-75:C | Micron | Datasheet | 12 | - | Min: 1 Mult: 1 | YES | 54 | 5.4 ns | 133 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT48LC64M8A2TG-75:C | 67108864 words | 64000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | 0.400 INCH, PLASTIC, TSOP2-54 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | 30 | 5.5 | No | 3.3 V | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | AUTO/SELF REFRESH | 8542.32.00.28 | DRAMs | CMOS | DUAL | GULL WING | 245 | 1 | 0.8 mm | unknown | 54 | R-PDSO-G54 | Not Qualified | 3.6 V | 3.3 V | COMMERCIAL | 3 V | 1 | SYNCHRONOUS | 0.255 mA | 64MX8 | 3-STATE | 1.2 mm | 8 | 0.0035 A | 536870912 bit | COMMON | SYNCHRONOUS DRAM | 8192 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IDT7007L35PF | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | 35 ns | INTEGRATED DEVICE TECHNOLOGY INC | Integrated Device Technology Inc | IDT7007L35PF | RAM, SRAM | 3 | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | LQFP | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-80 | QFP80,.64SQ | SQUARE | FLATPACK, LOW PROFILE | Obsolete | QFP | 20 | 5.1 | Non-Compliant | No | 5 V | e0 | No | EAR99 | Tin/Lead (Sn85Pb15) | 70 °C | 0 °C | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | 8542.32.00.41 | SRAMs | CMOS | QUAD | GULL WING | 240 | 1 | 0.65 mm | not_compliant | 80 | S-PQFP-G80 | Not Qualified | 5.5 V | 5 V | COMMERCIAL | 4.5 V | Parallel | 2 | ASYNCHRONOUS | 0.255 mA | 32KX8 | 3-STATE | 1.6 mm | 8 | 0.005 A | 262144 bit | PARALLEL | COMMON | DUAL-PORT SRAM | 4.5 V | YES | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IDT7027L35PF | Renesas | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 35 ns | INTEGRATED DEVICE TECHNOLOGY INC | Integrated Device Technology Inc | IDT7027L35PF | RAM, SRAM | 3 | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | LFQFP | TQFP-100 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | 20 | 5.14 | Non-Compliant | No | 5 V | e0 | No | EAR99 | Tin/Lead (Sn85Pb15) | 70 °C | 0 °C | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | 8542.32.00.41 | SRAMs | CMOS | QUAD | GULL WING | 240 | 1 | 0.5 mm | not_compliant | 100 | S-PQFP-G100 | Not Qualified | 5.5 V | 5 V | COMMERCIAL | 4.5 V | Parallel | 2 | ASYNCHRONOUS | 0.255 mA | 32KX16 | 3-STATE | 1.6 mm | 16 | 0.015 A | 524288 bit | PARALLEL | COMMON | DUAL-PORT SRAM | 4.5 V | YES | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MT48V8M32LFB5-75 | Micron Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 90 | 6 ns | 133 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT48V8M32LFB5-75 | 8388608 words | 8000000 | 70 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA90,9X15,32 | BGA90,9X15,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 30 | 5.82 | Yes | 2.5 V | e1 | Yes | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | Female | AUTO/SELF REFRESH | 8542.32.00.24 | DRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 90 | R-PBGA-B90 | Not Qualified | 2.7 V | 2.5 V | Socket | COMMERCIAL | 2.3 V | 1 | SYNCHRONOUS | 0.255 mA | 8MX32 | 1 mm | 32 | 0.00001 A | 268435456 bit | COMMON | SYNCHRONOUS DRAM | 4096 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 13 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No HYB18TC256800BF-2.5 | Qimonda AG | Datasheet | - | - | Min: 1 Mult: 1 | YES | 60 | 0.4 ns | 400 MHz | QIMONDA AG | 3 | 33554432 words | 32000000 | 85 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA60,9X11,32 | BGA60,9X11,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.8 V | Yes | EAR99 | AUTO/SELF REFRESH | 8542.32.00.24 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 60 | R-PBGA-B60 | Not Qualified | 1.9 V | OTHER | 1.7 V | 1 | SYNCHRONOUS | 0.255 mA | 32MX8 | 3-STATE | 1.2 mm | 8 | 0.007 A | 268435456 bit | COMMON | DDR1 DRAM | 8192 | 4,8 | 4,8 | FOUR BANK PAGE BURST | YES | 10.5 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS816032BGT-200 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 6.5 ns | 200 MHz | GSI TECHNOLOGY | GSI Technology | GS816032BGT-200 | 3 | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | LQFP | LQFP, QFP100,.63X.87 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | NOT SPECIFIED | 5.67 | Yes | 2.5 V | e3 | Yes | 3A991.B.2.B | PURE MATTE TIN | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | QUAD | GULL WING | 260 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | 2.7 V | 2.5/3.3 V | COMMERCIAL | 2.3 V | SYNCHRONOUS | 0.255 mA | 512KX32 | 3-STATE | 1.6 mm | 32 | 16777216 bit | PARALLEL | COMMON | CACHE SRAM | 2.3 V | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No GS832272C-133I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | BGA-209 | YES | 209 | 8.5 ns | 133 MHz | SDR | GSI TECHNOLOGY | Parallel | GSI Technology | GS832272C-133I | 133 MHz | 117.6@Flow-Through/133@Pipelined MHz | 2.7, 3.6 V | + 85 C | 2.3, 3 V | - 40 C | 3 | Surface Mount | SMD/SMT | 72 Bit | 512 kWords | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA209,11X19,40 | BGA209,11X19,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.13 | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | 2.5, 3.3 V | Industrial grade | -40 to 85 °C | GS832272C | No | 3A991.B.2.B | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | 2.5/3.3 V | INDUSTRIAL | 2.3 V | 36 Mbit | 8 | SYNCHRONOUS | 0.255 mA | 8.5 ns | Flow-Through/Pipelined | 512KX72 | 3-STATE | 1.7 mm | 72 | 19 Bit | 36 Mbit | 0.08 A | 37748736 bit | Industrial | PARALLEL | COMMON | CACHE SRAM | 2.38 V | 22 mm | 14 mm | |||||||||||||||||
![]() | Mfr Part No MT48LC32M16A2TG-75IT | Micron | Datasheet | 5 | - | Min: 1 Mult: 1 | YES | 54 | 5.4 ns | 133 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT48LC32M16A2TG-75IT | 3 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP2 | 0.400 INCH, PLASTIC, TSOP2-54 | TSOP54,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP2 | 30 | 5.84 | No | 3.3 V | e0 | No | EAR99 | Tin/Lead (Sn/Pb) | AUTO/SELF REFRESH | 8542.32.00.28 | DRAMs | CMOS | DUAL | GULL WING | 235 | 1 | 0.8 mm | unknown | 54 | R-PDSO-G54 | Not Qualified | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | 1 | SYNCHRONOUS | 0.255 mA | 32MX16 | 3-STATE | 1.2 mm | 16 | 0.0035 A | 536870912 bit | COMMON | SYNCHRONOUS DRAM | 8192 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm |
GS816036BGT-200
GSI Technology
Package:Memory
Price: please inquire
MT48LC64M8A2TG-75:C
Micron
Package:Memory
Price: please inquire
IDT7007L35PF
Renesas
Package:Memory
Price: please inquire
IDT7027L35PF
Renesas
Package:Memory
Price: please inquire
MT48V8M32LFB5-75
Micron Technology
Package:Memory
Price: please inquire
HYB18TC256800BF-2.5
Qimonda AG
Package:Memory
Price: please inquire
GS816032BGT-200
GSI Technology
Package:Memory
Price: please inquire
GS832272C-133I
GSI Technology
Package:Memory
Price: please inquire
MT48LC32M16A2TG-75IT
Micron
Package:Memory
Price: please inquire
