The category is 'Memory'
Memory (2)
- All Manufacturers
- Access Time-Max
- ECCN Code
- HTS Code
- I/O Type
- Ihs Manufacturer
- JESD-30 Code
- JESD-609 Code
- Length
- Memory Density
- Memory IC Type
- Moisture Sensitivity Levels
- Supply Current-Max
- Supply Current-Max:
0.295 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Data Rate Architecture | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Clock Rate | Maximum Operating Supply Voltage | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supplier Package | Supply Voltage-Nom (Vsup) | Timing Type | Typical Operating Supply Voltage | Usage Level | Operating Temperature | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Architecture | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Length | Width |
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![]() | Mfr Part No IDT7133LA35JI | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | 35 ns | INTEGRATED DEVICE TECHNOLOGY INC | 1 | 2048 words | 2000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-68 | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.41 | QUAD | J BEND | 225 | 1 | 1.27 mm | not_compliant | 20 | 68 | S-PQCC-J68 | Not Qualified | 5.5 V | INDUSTRIAL | 4.5 V | 2 | ASYNCHRONOUS | 0.295 mA | 2KX16 | 3-STATE | 4.57 mm | 16 | 0.004 A | 32768 bit | PARALLEL | COMMON | MULTI-PORT SRAM | 2 V | 24.2062 mm | 24.2062 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No GS832236AGB-333IV | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | YES | 119 | 5 ns | 333 MHz | SDR | GSI TECHNOLOGY | GSI Technology | GS832236AGB-333IV | 200@Flow-Through/333@Pipelined MHz | 2, 2.7 V | 1.7, 2.3 V | 3 | Surface Mount | 36 Bit | 1 MWords | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA119,7X17,50 | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.12 | Yes | FBGA | 1.8 V | Synchronous | 1.8, 2.5 V | Industrial grade | -40 to 100 °C | e1 | Yes | 3A991.B.2.B | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 2.5V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | 2 V | 1.8/2.5 V | INDUSTRIAL | 1.7 V | 4 | SYNCHRONOUS | 0.295 mA | Flow-Through/Pipelined | 1MX36 | 3-STATE | 1.99 mm | 36 | 20 Bit | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | CACHE SRAM | 1.7 V | 22 mm | 14 mm |


