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The category is 'Memory'

Memory (30)

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Access Time-Max
I/O Type
Ihs Manufacturer
JESD-30 Code
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Memory Width
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Number of Words Code
Output Characteristics
Supply Current-Max

Supply Current-Max:
0.31 mA

Image	Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	RoHS	Factory Lead Time	Mount	Surface Mount	Number of Pins	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Data Rate Architecture	Ihs Manufacturer	Manufacturer	Manufacturer Part Number	Maximum Clock Rate	Maximum Operating Supply Voltage	Minimum Operating Supply Voltage	Moisture Sensitivity Levels	Mounting	Number of I/O Lines	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supplier Package	Supply Voltage-Nom (Vsup)	Timing Type	Typical Operating Supply Voltage	Usage Level	Operating Temperature	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Pin Count	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Max Supply Voltage	Min Supply Voltage	Number of Ports	Nominal Supply Current	Operating Mode	Supply Current-Max	Architecture	Data Bus Width	Organization	Output Characteristics	Seated Height-Max	Memory Width	Address Bus Width	Density	Standby Current-Max	Memory Density	Max Frequency	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Standby Voltage-Min	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Self Refresh	Length	Width	Radiation Hardening
	Mfr Part No MT48LC32M4A2P-75:G	Micron	Datasheet	-	-	Min: 1 Mult: 1				YES		54	5.4 ns	133 MHz		MICRON TECHNOLOGY INC	Micron Technology Inc	MT48LC32M4A2P-75:G							33554432 words	32000000	70 °C		PLASTIC/EPOXY	TSOP2	TSOP2, TSOP54,.46,32	TSOP54,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2	30	5.58		Yes		3.3 V					e3	Yes	EAR99	Matte Tin (Sn)			AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	DUAL	GULL WING	260	1	0.8 mm	unknown	54	R-PDSO-G54	Not Qualified		3.6 V	3.3 V	COMMERCIAL	3 V			1		SYNCHRONOUS	0.31 mA			32MX4	3-STATE	1.2 mm	4			0.002 A	134217728 bit				COMMON	SYNCHRONOUS DRAM		4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES	22.22 mm	10.16 mm
	Mfr Part No MT48LC32M4A2TG-75:G	Micron	Datasheet	-	-	Min: 1 Mult: 1			Surface Mount	YES	54	54	5.4 ns	133 MHz		MICRON TECHNOLOGY INC	Micron Technology Inc	MT48LC32M4A2TG-75:G							33554432 words	32000000	70 °C		PLASTIC/EPOXY	TSOP2	0.400 INCH, PLASTIC, TSOP2-54	TSOP54,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2	30	8.56	Non-Compliant	No		3.3 V					e0	No	EAR99	Tin/Lead (Sn/Pb)	70 °C	0 °C	AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	DUAL	GULL WING	235	1	0.8 mm	unknown	54	R-PDSO-G54	Not Qualified	3.3 V	3.6 V	3.3 V	COMMERCIAL	3 V	3.6 V	3 V	1	150 mA	SYNCHRONOUS	0.31 mA		4 b	32MX4	3-STATE	1.2 mm	4	14 b	128 Mb	0.002 A	134217728 bit	133 MHz			COMMON	SYNCHRONOUS DRAM		4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES	22.22 mm	10.16 mm	No
	Mfr Part No MT41J2G4THE-125:D	Micron	Datasheet	-	-	Min: 1 Mult: 1				YES		78	0.225 ns	800 MHz		MICRON TECHNOLOGY INC	Micron Technology Inc	MT41J2G4THE-125:D							2147483648 words	2000000000	85 °C		PLASTIC/EPOXY	TFBGA	FBGA-78	BGA78,9X13,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Active			5.75		Yes		1.5 V											SELF REFRESH		DRAMs	CMOS	BOTTOM	BALL		1	0.8 mm	compliant		R-PBGA-B78	Not Qualified		1.575 V	1.5 V	OTHER	1.425 V			1		SYNCHRONOUS	0.31 mA			2GX4	3-STATE	1.2 mm	4			0.04 A	8589934592 bit				COMMON	DDR DRAM		8192	8	8	DUAL BANK PAGE BURST	YES	12 mm	10.5 mm
	Mfr Part No GS832118AD-375I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks		YES		165	4.5 ns	375 MHz	SDR	GSI TECHNOLOGY	GSI Technology	GS832118AD-375I	238@Flow-Through/375@Pipelined MHz	2.7, 3.6 V	2.3, 3 V		Surface Mount	18 Bit	2 MWords	1000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA		5.16		No	FBGA	2.5 V	Synchronous	2.5, 3.3 V	Industrial grade	-40 to 100 °C			3A991.B.2.B				PIPELINE OR FLOW THROUGH ARCHITECTUREL; ALSO OPERATES AT 3.3 V SUPPLY	8542.32.00.41	SRAMs	CMOS	BOTTOM	BALL		1	1 mm	compliant	165	R-PBGA-B165	Not Qualified		2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V			2		SYNCHRONOUS	0.31 mA	Flow-Through/Pipelined		1MX18	3-STATE	1.4 mm	18	21 Bit	36 Mbit	0.04 A	18874368 bit		Industrial	PARALLEL	COMMON	CACHE SRAM	2.3 V						15 mm	13 mm
	Mfr Part No GS840H36AGT-166	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks		YES		100	8.5 ns	166 MHz		GSI TECHNOLOGY	GSI Technology	GS840H36AGT-166				3			131072 words	128000	70 °C		PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Active	QFP	NOT SPECIFIED	5.34	Compliant	Yes		3.3 V					e3	Yes	3A991.B.2.B	PURE MATTE TIN	70 °C	0 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS	QUAD	GULL WING	260	1	0.65 mm	compliant	100	R-PQFP-G100	Not Qualified	3.3 V	3.6 V	2.5/3.3,3.3 V	COMMERCIAL	3 V			4		SYNCHRONOUS	0.31 mA			128KX36	3-STATE	1.6 mm	36	17 b	4.5 Mb	0.02 A	4718592 bit			PARALLEL	COMMON	CACHE SRAM	3.14 V						20 mm	14 mm	No
	Mfr Part No GS840H18AB-166	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1				YES		119	8.5 ns	166 MHz		GSI TECHNOLOGY	GSI Technology	GS840H18AB-166				3			262144 words	256000	70 °C		PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.21	Compliant	No		3.3 V					e0	No	3A991.B.2.B	Tin/Lead (Sn/Pb)	70 °C	0 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified	3.3 V	3.6 V	2.5/3.3,3.3 V	COMMERCIAL	3 V			2		SYNCHRONOUS	0.31 mA			256KX18	3-STATE	2.19 mm	18	18 b	4.5 Mb	0.02 A	4718592 bit			PARALLEL	COMMON	CACHE SRAM	3.14 V						22 mm	14 mm	No
	Mfr Part No GS840H32AGT-166	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks		YES		100	8.5 ns	166 MHz		GSI TECHNOLOGY	GSI Technology	GS840H32AGT-166				3			131072 words	128000	70 °C		PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Active	QFP	NOT SPECIFIED	5.35	Compliant	Yes		3.3 V					e3	Yes	3A991.B.2.B	PURE MATTE TIN	70 °C	0 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS	QUAD	GULL WING	260	1	0.65 mm	compliant	100	R-PQFP-G100	Not Qualified	3.3 V	3.6 V	2.5/3.3,3.3 V	COMMERCIAL	3 V			4		SYNCHRONOUS	0.31 mA			128KX32	3-STATE	1.6 mm	32	17 b	4 Mb	0.02 A	4194304 bit			PARALLEL	COMMON	CACHE SRAM	3.14 V						20 mm	14 mm	No
	Mfr Part No GS840H36AB-166	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks		YES		119	8.5 ns	166 MHz		GSI TECHNOLOGY	GSI Technology	GS840H36AB-166				3			131072 words	128000	70 °C		PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.28		No		3.3 V					e0	No	3A991.B.2.B	Tin/Lead (Sn/Pb)			FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified		3.6 V	2.5/3.3,3.3 V	COMMERCIAL	3 V					SYNCHRONOUS	0.31 mA			128KX36	3-STATE	2.19 mm	36			0.02 A	4718592 bit			PARALLEL	COMMON	CACHE SRAM	3.14 V						22 mm	14 mm
	Mfr Part No GS840H18AGT-166	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks		YES		100	8.5 ns	166 MHz		GSI TECHNOLOGY	GSI Technology	GS840H18AGT-166				3			262144 words	256000	70 °C		PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Active	QFP	NOT SPECIFIED	5.35		Yes		3.3 V					e3	Yes	3A991.B.2.B	PURE MATTE TIN			FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS	QUAD	GULL WING	260	1	0.65 mm	compliant	100	R-PQFP-G100	Not Qualified		3.6 V	2.5/3.3,3.3 V	COMMERCIAL	3 V					SYNCHRONOUS	0.31 mA			256KX18	3-STATE	1.6 mm	18			0.02 A	4718592 bit			PARALLEL	COMMON	CACHE SRAM	3.14 V						20 mm	14 mm
	Mfr Part No GS84036AB-166	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1				YES		119	8.5 ns	166 MHz		GSI TECHNOLOGY	GSI Technology	GS84036AB-166				3			131072 words	128000	70 °C		PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Obsolete	BGA	NOT SPECIFIED	5.73		No		3.3 V					e0	No	3A991.B.2.B	Tin/Lead (Sn/Pb)			FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant	119	R-PBGA-B119	Not Qualified		3.6 V	2.5/3.3,3.3 V	COMMERCIAL	3 V					SYNCHRONOUS	0.31 mA			128KX36	3-STATE	2.19 mm	36			0.02 A	4718592 bit			PARALLEL	COMMON	CACHE SRAM	3.14 V						22 mm	14 mm

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