The category is 'Memory'
Memory (3)
- All Manufacturers
- Access Time-Max
- Additional Feature
- ECCN Code
- HTS Code
- I/O Type
- Ihs Manufacturer
- JESD-30 Code
- Length
- Memory Density
- Memory IC Type
- Number of Functions
- Supply Current-Max
- Supply Current-Max:
0.315 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Surface Mount | Number of Pins | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Max Supply Voltage | Min Supply Voltage | Number of Ports | Nominal Supply Current | Operating Mode | Supply Current-Max | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Density | Standby Current-Max | Memory Density | Max Frequency | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Access Mode | Self Refresh | Length | Width | Radiation Hardening | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No IDT7026L20GB | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 84 | 20 ns | INTEGRATED DEVICE TECHNOLOGY INC | 16384 words | 16000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, PGA84M,11X11 | PGA84M,11X11 | SQUARE | GRID ARRAY | Transferred | PGA | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | 16K X 16 DUAL PORT SRAM | 8542.32.00.41 | PERPENDICULAR | PIN/PEG | 1 | 2.54 mm | not_compliant | 84 | S-CPGA-P84 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 2 | ASYNCHRONOUS | 0.315 mA | 16KX16 | 3-STATE | 5.207 mm | 16 | 0.01 A | 262144 bit | MIL-PRF-38535 | PARALLEL | COMMON | MULTI-PORT SRAM | 4.5 V | 27.94 mm | 27.94 mm | |||||||||||||||||||||||||||||||
 | Mfr Part No MT41J256M4JP-15E:F | Micron | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 78 | 78 | 0.125 ns | 667 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT41J256M4JP-15E:F | 268435456 words | 256000000 | 85 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA78,9X13,32 | BGA78,9X13,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | 30 | 5.65 | Compliant | Yes | 1.5 V | e1 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 95 °C | 0 °C | AUTO/SELF REFRESH | 8542.32.00.32 | DRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 78 | R-PBGA-B78 | Not Qualified | 1.5 V | 1.575 V | 1.5 V | OTHER | 1.425 V | 1.575 V | 1.425 V | 1 | 220 mA | SYNCHRONOUS | 0.315 mA | 4 b | 256MX4 | 3-STATE | 1.2 mm | 4 | 17 b | 1 Gb | 1073741824 bit | 1.333 GHz | COMMON | DDR DRAM | 8192 | 8 | 8 | MULTI BANK PAGE BURST | YES | 11.5 mm | 8 mm | No | Lead Free | ||||||||
| Mfr Part No GS8644Z72C-133 | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 209 | 8.5 ns | 133 MHz | GSI TECHNOLOGY | GSI Technology | GS8644Z72C-133 | 3 | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA209,11X19,40 | BGA209,11X19,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | BGA | NOT SPECIFIED | 5.88 | No | 2.5 V | No | 3A991.B.2.B | ALSO OPERATES AT 3.3V SUPPLY; PIPELINED OR FLOW-THROUGH ARCHITECTURE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | 2.7 V | 2.5/3.3 V | COMMERCIAL | 2.3 V | SYNCHRONOUS | 0.315 mA | 1MX72 | 3-STATE | 1.7 mm | 72 | 0.12 A | 75497472 bit | PARALLEL | COMMON | ZBT SRAM | 2.3 V | 22 mm | 14 mm |