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Memory (27)

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JESD-30 Code
Memory Density
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Supply Current-Max

Supply Current-Max:
0.32 mA

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Factory Lead Time	Mount	Surface Mount	Number of Pins	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Ihs Manufacturer	Manufacturer	Manufacturer Part Number	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supply Voltage-Nom (Vsup)	Packaging	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Max Supply Voltage	Min Supply Voltage	Number of Ports	Nominal Supply Current	Operating Mode	Supply Current-Max	Access Time	Data Bus Width	Organization	Output Characteristics	Seated Height-Max	Memory Width	Address Bus Width	Density	Standby Current-Max	Memory Density	Max Frequency	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Standby Voltage-Min	Output Enable	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Self Refresh	Length	Width	Radiation Hardening	Lead Free
Mfr Part No GS840H36AB-166I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks		YES		119	8.5 ns	166 MHz	GSI TECHNOLOGY	GSI Technology	GS840H36AB-166I	3	131072 words	128000	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA, BGA119,7X17,50	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Active	BGA	NOT SPECIFIED	5.28		No	3.3 V		e0	No	3A991.B.2.B	Tin/Lead (Sn/Pb)			FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	compliant		119	R-PBGA-B119	Not Qualified		3.6 V	2.5/3.3,3.3 V	INDUSTRIAL	3 V					SYNCHRONOUS	0.32 mA			128KX36	3-STATE	2.19 mm	36			0.03 A	4718592 bit			PARALLEL	COMMON	CACHE SRAM	3.14 V							22 mm	14 mm
Mfr Part No GS840H18AGT-166I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks		YES		100	8.5 ns	166 MHz	GSI TECHNOLOGY	GSI Technology	GS840H18AGT-166I	3	262144 words	256000	85 °C	-40 °C	PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Active	QFP	NOT SPECIFIED	5.35		Yes	3.3 V		e3	Yes	3A991.B.2.B	PURE MATTE TIN			FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS	QUAD	GULL WING	260	1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified		3.6 V	2.5/3.3,3.3 V	INDUSTRIAL	3 V					SYNCHRONOUS	0.32 mA			256KX18	3-STATE	1.6 mm	18			0.03 A	4718592 bit			PARALLEL	COMMON	CACHE SRAM	3.14 V							20 mm	14 mm
Mfr Part No GVT71512B18TA-7	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1			YES		100	7.5 ns	117 MHz	CYPRESS SEMICONDUCTOR CORP			3	524288 words	512000	70 °C		PLASTIC/EPOXY	LQFP	14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Obsolete	QFP				No	3.3 V		e0		3A991.B.2.A	TIN LEAD			FLOW-THROUGH ARCHITECTURE	8542.32.00.41			QUAD	GULL WING		1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified		3.63 V		COMMERCIAL	3.135 V					SYNCHRONOUS	0.32 mA			512KX18	3-STATE	1.6 mm	18			0.01 A	9437184 bit			PARALLEL	COMMON	STANDARD SRAM	3.14 V							20 mm	14 mm
Mfr Part No K4M563233D-EN80	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1			YES		90	6 ns	125 MHz	SAMSUNG SEMICONDUCTOR INC			3	8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	LFBGA, BGA90,9X15,32	BGA90,9X15,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA				Yes	3 V				EAR99				AUTO/SELF REFRESH	8542.32.00.24			BOTTOM	BALL	260	1	0.8 mm	compliant		90	R-PBGA-B90	Not Qualified		3.6 V		OTHER	2.7 V			1		SYNCHRONOUS	0.32 mA			8MX32		1.45 mm	32			0.0012 A	268435456 bit				COMMON	SYNCHRONOUS DRAM			4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES	13 mm	11 mm
Mfr Part No IS64VPS204818B-166TQLA3	Integrated Silicon Solution Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		100	3.5 ns	166 MHz	INTEGRATED SILICON SOLUTION INC				2097152 words	2000000	125 °C	-40 °C	PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Active	QFP				Yes	2.5 V				3A991.B.2.A					8542.32.00.41			QUAD	GULL WING		1	0.65 mm	compliant		100	R-PQFP-G100	Not Qualified		2.625 V		AUTOMOTIVE	2.375 V					SYNCHRONOUS	0.32 mA			2MX18	3-STATE	1.6 mm	18			0.115 A	37748736 bit		AEC-Q100	PARALLEL	COMMON	CACHE SRAM	2.38 V							20 mm	14 mm
Mfr Part No MCM69P536ATQ5	Motorola Semiconductor Products	Datasheet	-	-	Min: 1 Mult: 1			YES		100	5 ns		MOTOROLA INC				32768 words	32000	110 °C	20 °C	PLASTIC/EPOXY	LQFP	TQFP-100	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Obsolete					No	3.3 V		e0		3A991.B.2.A	TIN LEAD			BURST COUNTER	8542.32.00.41			QUAD	GULL WING		1	0.65 mm	unknown			R-PQFP-G100	Not Qualified		3.6 V		OTHER	3.135 V			1		SYNCHRONOUS	0.32 mA			32KX36	3-STATE	1.6 mm	36			0.055 A	1179648 bit			PARALLEL	COMMON	CACHE SRAM	3.14 V	YES						20 mm	14 mm
Mfr Part No MCM69P536ATQ5	Freescale Semiconductor	Datasheet	-	-	Min: 1 Mult: 1			YES		100	5 ns		MOTOROLA SEMICONDUCTOR PRODUCTS				32768 words	32000			PLASTIC/EPOXY	QFP	QFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK	Obsolete					No	3.3 V		e0			Tin/Lead (Sn/Pb)							QUAD	GULL WING			0.635 mm	unknown			R-PQFP-G100	Not Qualified			3.3 V							SYNCHRONOUS	0.32 mA			32KX36	3-STATE		36			0.055 A	1179648 bit			PARALLEL	COMMON	STANDARD SRAM	3.14 V
Mfr Part No HY5DU663222Q-7M	SK Hynix Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		100	1.1 ns	143 MHz	SK HYNIX INC				2097152 words	2000000	70 °C		PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Obsolete	QFP				No	2.5 V			No	EAR99				AUTO/SELF REFRESH	8542.32.00.02			QUAD	GULL WING	NOT SPECIFIED	1	0.65 mm	compliant	NOT SPECIFIED	100	R-PQFP-G100	Not Qualified		2.625 V		COMMERCIAL	2.375 V			1		SYNCHRONOUS	0.32 mA			2MX32	3-STATE	1.6 mm	32			0.01 A	67108864 bit				COMMON	DDR1 DRAM				2,4,8	2,4,8	FOUR BANK PAGE BURST	YES	20 mm	14 mm
Mfr Part No LY62L2568RL-45LL	Lyontek Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		32	45 ns		LYONTEK INC			3	262144 words	256000	70 °C		PLASTIC/EPOXY	LSSOP	LSSOP,		RECTANGULAR	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	Contact Manufacturer						3 V		e3		3A991.B.2.A	Tin (Sn)				8542.32.00.41			DUAL	GULL WING	260	1	0.5 mm	compliant	30		R-PDSO-G32			3.6 V		COMMERCIAL	2.7 V					ASYNCHRONOUS	0.32 mA			256KX8		1.25 mm	8				2097152 bit			PARALLEL		STANDARD SRAM								11.8 mm	8 mm
Mfr Part No IDT7005L20JB	Integrated Device Technology Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		68	20 ns		INTEGRATED DEVICE TECHNOLOGY INC			1	8192 words	8000	125 °C	-55 °C	PLASTIC/EPOXY	QCCJ	QCCJ, LDCC68,1.0SQ	LDCC68,1.0SQ	SQUARE	CHIP CARRIER	Transferred	LCC				No	5 V		e0	No	3A001.A.2.C	TIN LEAD				8542.32.00.41			QUAD	J BEND	225	1	1.27 mm	not_compliant	20	68	S-PQCC-J68	Not Qualified		5.5 V		MILITARY	4.5 V			2		ASYNCHRONOUS	0.32 mA			8KX8	3-STATE	4.572 mm	8			0.004 A	65536 bit			PARALLEL	COMMON	MULTI-PORT SRAM	2 V							24.2062 mm	24.2062 mm
Mfr Part No IDT71V3576S166PF	Integrated Device Technology Inc	Datasheet	-	-	Min: 1 Mult: 1			YES		100	3.5 ns	166 MHz	INTEGRATED DEVICE TECHNOLOGY INC			3	131072 words	128000	70 °C		PLASTIC/EPOXY	LQFP	14 X 20 MM, PLASTIC, TQFP-100	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Obsolete	QFP				No	3.3 V		e0	No	3A991.B.2.A	Tin/Lead (Sn85Pb15)			ALSO REQUIRES 3.3V I/O SUPPLY	8542.32.00.41			QUAD	GULL WING	225	1	0.65 mm	not_compliant	20	100	R-PQFP-G100	Not Qualified		3.465 V		COMMERCIAL	3.135 V					SYNCHRONOUS	0.32 mA			128KX36	3-STATE	1.6 mm	36			0.02 A	4718592 bit			PARALLEL	COMMON	CACHE SRAM	3.14 V							20 mm	14 mm
Mfr Part No MCM62996FN20	Freescale Semiconductor	Datasheet	-	-	Min: 1 Mult: 1			YES		52	20 ns		MOTOROLA SEMICONDUCTOR PRODUCTS				16384 words	16000	70 °C		PLASTIC/EPOXY	QCCJ	QCCJ, LDCC52,.8SQ	LDCC52,.8SQ	SQUARE	CHIP CARRIER	Obsolete					No	5 V		e0			Tin/Lead (Sn/Pb)							QUAD	J BEND			1.27 mm	unknown			S-PQCC-J52	Not Qualified			5 V	COMMERCIAL						ASYNCHRONOUS	0.32 mA			16KX16	3-STATE		16			0.05 A	262144 bit			PARALLEL	COMMON	STANDARD SRAM	4.5 V
Mfr Part No MCM62996FN20	Motorola Semiconductor Products	Datasheet	-	-	Min: 1 Mult: 1			YES		52	20 ns		MOTOROLA INC				16384 words	16000	70 °C		PLASTIC/EPOXY	QCCJ	PLASTIC, LCC-52	LDCC52,.8SQ	SQUARE	CHIP CARRIER	Obsolete					No	5 V		e0		EAR99	TIN LEAD				8542.32.00.41			QUAD	J BEND		1	1.27 mm	unknown			S-PQCC-J52	Not Qualified		5.5 V		COMMERCIAL	4.5 V			1		ASYNCHRONOUS	0.32 mA			16KX16	3-STATE	4.57 mm	16			0.05 A	262144 bit			PARALLEL	COMMON	CACHE TAG SRAM	4.5 V	YES						19.1262 mm	19.1262 mm
Mfr Part No MT48LC4M32B2TG-6:G	Micron	Datasheet	9 In Stock	-	Min: 1 Mult: 1			YES		86	5.5 ns	166 MHz	MICRON TECHNOLOGY INC	Micron Technology Inc	MT48LC4M32B2TG-6:G		4194304 words	4000000	70 °C		PLASTIC/EPOXY	TSOP2	0.400 INCH, PLASTIC, TSOP2-86	TSSOP86,.46,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	Obsolete	TSOP2	30	8.59		No	3.3 V		e0	No	EAR99	Tin/Lead (Sn/Pb)			AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	DUAL	GULL WING	235	1	0.5 mm	unknown		86	R-PDSO-G86	Not Qualified		3.6 V	3.3 V	COMMERCIAL	3 V			1		SYNCHRONOUS	0.32 mA			4MX32	3-STATE	1.2 mm	32			0.002 A	134217728 bit				COMMON	SYNCHRONOUS DRAM			4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES	22.22 mm	10.16 mm
Mfr Part No W9412G2IB-5	Winbond	Datasheet	2160 In Stock	-	Min: 1 Mult: 1			YES		144	0.7 ns	200 MHz	WINBOND ELECTRONICS CORP	Winbond Electronics Corp	W9412G2IB-5		4194304 words	4000000	70 °C		PLASTIC/EPOXY	LFBGA	LFBGA, BGA144,12X12,32	BGA144,12X12,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	BGA	NOT SPECIFIED	5.72		Yes	2.5 V				EAR99				AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	unknown		144	S-PBGA-B144	Not Qualified		2.7 V	2.5 V	COMMERCIAL	2.3 V			1		SYNCHRONOUS	0.32 mA			4MX32	3-STATE	1.4 mm	32			0.03 A	134217728 bit				COMMON	DDR DRAM			4096	2,4,8	2,4,8	FOUR BANK PAGE BURST	YES	12 mm	12 mm
Mfr Part No MT47H16M16FG-3:B	Micron	Datasheet	78 In Stock	-	Min: 1 Mult: 1		Surface Mount	YES	84	84	0.45 ns	333 MHz	MICRON TECHNOLOGY INC	Micron Technology Inc	MT47H16M16FG-3:B		16777216 words	16000000	105 °C	-40 °C	PLASTIC/EPOXY	TFBGA	8 X 14 MM, FBGA-84	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	30	5.83	Non-Compliant	No	1.8 V		e0		EAR99	Tin/Lead/Silver (Sn/Pb/Ag)	85 °C	0 °C	AUTO/SELF REFRESH	8542.32.00.24	DRAMs	CMOS	BOTTOM	BALL	235	1	0.8 mm	unknown		84	R-PBGA-B84	Not Qualified	1.8 V	1.9 V	1.8 V	INDUSTRIAL	1.7 V	1.9 V	1.7 V	1	215 mA	SYNCHRONOUS	0.32 mA	450 ps	16 b	16MX16	3-STATE	1.2 mm	16	15 b	256 Mb	0.005 A	268435456 bit	667 MHz			COMMON	DDR DRAM			8192	4,8	4,8	FOUR BANK PAGE BURST	YES	14 mm	8 mm	No
Mfr Part No MT41J256M16RE-125:D	Micron	Datasheet	1499 In Stock	-	Min: 1 Mult: 1		Surface Mount	YES	96	96	0.225 ns	800 MHz	MICRON TECHNOLOGY INC	Micron Technology Inc	MT41J256M16RE-125:D		268435456 words	256000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA96,9X16,32	BGA96,9X16,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	30	5.66	Compliant	Yes	1.5 V	Bulk	e1	Yes	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	95 °C	0 °C	AUTO/SELF REFRESH	8542.32.00.36	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	compliant		96	R-PBGA-B96	Not Qualified	1.5 V	1.575 V	1.5 V	OTHER	1.425 V	1.575 V	1.425 V	1	280 mA	SYNCHRONOUS	0.32 mA		16 b	256MX16	3-STATE	1.2 mm	16	18 b	4 Gb	0.02 A	4294967296 bit	1.6 GHz			COMMON	DDR DRAM			8192	8	8	MULTI BANK PAGE BURST	YES	14 mm	10 mm	No	Lead Free
Mfr Part No MT48LC4M32B2F5-7:G	Micron	Datasheet	2400 In Stock	-	Min: 1 Mult: 1			YES		90	5.5 ns	143 MHz	MICRON TECHNOLOGY INC	Micron Technology Inc	MT48LC4M32B2F5-7:G		4194304 words	4000000	70 °C		PLASTIC/EPOXY	VFBGA	VFBGA-90	BGA90,9X15,32	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Obsolete	BGA	30	5.48		No	3.3 V		e0	No	EAR99	Tin/Lead/Silver (Sn/Pb/Ag)			AUTO/SELF REFRESH	8542.32.00.02	DRAMs	CMOS	BOTTOM	BALL	235	1	0.8 mm	unknown		90	R-PBGA-B90	Not Qualified		3.6 V	3.3 V	COMMERCIAL	3 V			1		SYNCHRONOUS	0.32 mA			4MX32	3-STATE	1 mm	32			0.002 A	134217728 bit				COMMON	SYNCHRONOUS DRAM			4096	1,2,4,8,FP	1,2,4,8	FOUR BANK PAGE BURST	YES	13 mm	8 mm
Mfr Part No MT47H16M16FG-3IT:B	Micron	Datasheet	-	-	Min: 1 Mult: 1			YES		84	0.45 ns	333 MHz	MICRON TECHNOLOGY INC	Micron Technology Inc	MT47H16M16FG-3IT:B		16777216 words	16000000	85 °C	-40 °C	PLASTIC/EPOXY	TFBGA	8 X 14 MM, FBGA-84	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	30	5.89		No	1.8 V		e0		EAR99	Tin/Lead/Silver (Sn/Pb/Ag)			AUTO/SELF REFRESH	8542.32.00.24	DRAMs	CMOS	BOTTOM	BALL	235	1	0.8 mm	unknown		84	R-PBGA-B84	Not Qualified		1.9 V	1.8 V	INDUSTRIAL	1.7 V			1		SYNCHRONOUS	0.32 mA			16MX16	3-STATE	1.2 mm	16			0.005 A	268435456 bit				COMMON	DDR DRAM			8192	4,8	4,8	FOUR BANK PAGE BURST	YES	14 mm	8 mm
Mfr Part No CY7C09369V-6AC	Cypress Semiconductor	Datasheet	1219 In Stock	-	Min: 1 Mult: 1			YES	100	100	6.5 ns	100 MHz	CYPRESS SEMICONDUCTOR CORP	Cypress Semiconductor	CY7C09369V-6AC	3	16384 words	16000	70 °C		PLASTIC/EPOXY	LFQFP	PLASTIC, MS-026, TQFP-100	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Obsolete	QFP	30	5.78	Compliant	No	3.3 V		e0		3A991.B.2.B	Tin/Lead (Sn/Pb)	70 °C	0 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS	QUAD	GULL WING	240	1	0.5 mm	not_compliant		100	S-PQFP-G100	Not Qualified	3.3 V	3.6 V	3.3 V	COMMERCIAL	3 V			2		SYNCHRONOUS	0.32 mA			16KX18	3-STATE	1.6 mm	18	28 b	288 kb	0.00025 A	294912 bit			PARALLEL	COMMON	DUAL-PORT SRAM	3 V							14 mm	14 mm

Memory (27)