The category is 'Memory'
Memory (27)
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- I/O Type
- Ihs Manufacturer
- JESD-30 Code
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- Memory IC Type
- Memory Width
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- Number of Words
- Number of Words Code
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- Package Body Material
- Supply Current-Max
- Supply Current-Max:
0.35 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Pins | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | Series | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Note | Number of Ports | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Output Enable | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Access Mode | Self Refresh | Length | Width | Lead Free |
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![]() | Mfr Part No K4H561638H-UCCC | Samsung | Datasheet | 136 | - | Min: 1 Mult: 1 | YES | 66 | 0.65 ns | 200 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4H561638H-UCCC | 3 | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | NOT SPECIFIED | 5.8 | Yes | 2.5 V | e6 | Yes | Tin/Bismuth (Sn97Bi3) | DRAMs | CMOS | DUAL | GULL WING | 260 | 0.635 mm | unknown | R-PDSO-G66 | Not Qualified | 2.5 V | COMMERCIAL | 0.35 mA | 16MX16 | 3-STATE | 16 | 0.004 A | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | |||||||||||||||||||||||||||||
![]() | Mfr Part No K4H561638F-UCB3 | Samsung | Datasheet | 512 | - | Min: 1 Mult: 1 | YES | 66 | 66 | 166 MHz | SAMSUNG SEMICONDUCTOR INC | Samsung Semiconductor | K4H561638F-UCB3 | 3 | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | NOT SPECIFIED | 5.3 | Compliant | Yes | 2.5 V | e6 | Yes | Tin/Bismuth (Sn/Bi) | DRAMs | CMOS | DUAL | GULL WING | 260 | 0.635 mm | unknown | 166 MHz | R-PDSO-G66 | Not Qualified | 2.5 V | COMMERCIAL | 0.35 mA | 16MX16 | 3-STATE | 16 | 268435456 bit | COMMON | DDR DRAM | 8192 | 2,4,8 | 2,4,8 | Lead Free | ||||||||||||||||||||||||||
![]() | Mfr Part No IS43DR16640A-3DBL-TR | ISSI | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 0.45 ns | 333 MHz | INTEGRATED SILICON SOLUTION INC | Integrated Silicon Solution Inc | IS43DR16640A-3DBL-TR | 67108864 words | 64000000 | 70 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA84,9X15,32 | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | 5.84 | Yes | 1.8 V | AUTO/SELF REFRESH | DRAMs | CMOS | BOTTOM | BALL | 1 | 0.8 mm | compliant | R-PBGA-B84 | Not Qualified | 1.9 V | 1.8 V | COMMERCIAL | 1.7 V | 1 | SYNCHRONOUS | 0.35 mA | 64MX16 | 3-STATE | 1.2 mm | 16 | 0.015 A | 1073741824 bit | COMMON | DDR DRAM | 8192 | 4,8 | 4,8 | MULTI BANK PAGE BURST | YES | 13.65 mm | 8 mm | |||||||||||||||||||||||
![]() | Mfr Part No IS43DR16320B-25DBL-TR | ISSI | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 0.4 ns | 400 MHz | INTEGRATED SILICON SOLUTION INC | Integrated Silicon Solution Inc | IS43DR16320B-25DBL-TR | 1 | 33554432 words | 32000000 | 70 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA84,9X15,32 | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | NOT SPECIFIED | 5.84 | Yes | Yes | 1.8 V | - | e3 | Yes | Mounting Kit | Matte Tin (Sn) | AUTO/SELF REFRESH | DRAMs | CMOS | BOTTOM | BALL | 225 | 1 | 0.8 mm | compliant | R-PBGA-B84 | Not Qualified | 1.9 V | 1.8 V | COMMERCIAL | 1.7 V | - | 1 | SYNCHRONOUS | 0.35 mA | 32MX16 | 3-STATE | 1.2 mm | 16 | 0.008 A | 536870912 bit | COMMON | DDR DRAM | 8192 | 4,8 | 4,8 | FOUR BANK PAGE BURST | YES | 13 mm | 10.5 mm | |||||||||||||
![]() | Mfr Part No IS43DR16640A-3DBLI-TR | ISSI | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 0.45 ns | 333 MHz | INTEGRATED SILICON SOLUTION INC | Integrated Silicon Solution Inc | IS43DR16640A-3DBLI-TR | 67108864 words | 64000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA84,9X15,32 | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | NOT SPECIFIED | 5.84 | Yes | 1.8 V | AUTO/SELF REFRESH | DRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.8 mm | compliant | R-PBGA-B84 | Not Qualified | 1.9 V | 1.8 V | INDUSTRIAL | 1.7 V | 1 | SYNCHRONOUS | 0.35 mA | 64MX16 | 3-STATE | 1.2 mm | 16 | 0.015 A | 1073741824 bit | COMMON | DDR DRAM | 8192 | 4,8 | 4,8 | MULTI BANK PAGE BURST | YES | 13.65 mm | 8 mm | ||||||||||||||||||||
![]() | Mfr Part No IS43DR16640-3DBLI | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 0.45 ns | 333 MHz | INTEGRATED SILICON SOLUTION INC | 67108864 words | 64000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA84,9X15,32 | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | DSBGA | Yes | 1.8 V | e1 | Yes | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | AUTO/SELF REFRESH | 8542.32.00.32 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 84 | R-PBGA-B84 | Not Qualified | 1.9 V | INDUSTRIAL | 1.7 V | 1 | SYNCHRONOUS | 0.35 mA | 64MX16 | 3-STATE | 1.2 mm | 16 | 0.015 A | 1073741824 bit | COMMON | DDR2 DRAM | 8192 | 4,8 | 4,8 | MULTI BANK PAGE BURST | YES | 13.65 mm | 8 mm | |||||||||||||||||||||
![]() | Mfr Part No IC43R16160-6TG | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 66 | 0.7 ns | 166 MHz | INTEGRATED SILICON SOLUTION INC | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | TSOP2, TSSOP66,.46 | TSSOP66,.46 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | Yes | 2.5 V | e3 | EAR99 | MATTE TIN | AUTO/SELF REFRESH | 8542.32.00.24 | DUAL | GULL WING | 260 | 1 | 0.65 mm | compliant | 10 | R-PDSO-G66 | Not Qualified | 2.7 V | COMMERCIAL | 2.3 V | 1 | SYNCHRONOUS | 0.35 mA | 16MX16 | 3-STATE | 1.2 mm | 16 | 268435456 bit | COMMON | DDR1 DRAM | 8192 | 2,4,8 | 2,4,8 | FOUR BANK PAGE BURST | YES | 22.22 mm | 10.16 mm | ||||||||||||||||||||||||
![]() | Mfr Part No MCM63P531TQ7 | Motorola Semiconductor Products | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 7 ns | MOTOROLA INC | 32768 words | 32000 | PLASTIC/EPOXY | LQFP | TQFP-100 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | No | 3.3 V | e0 | 3A991.B.2.B | TIN LEAD | 8542.32.00.41 | QUAD | GULL WING | 1 | 0.65 mm | unknown | R-PQFP-G100 | Not Qualified | 3.6 V | 3.135 V | 1 | SYNCHRONOUS | 0.35 mA | 32KX32 | 3-STATE | 1.6 mm | 32 | 0.065 A | 1048576 bit | PARALLEL | COMMON | CACHE SRAM | 3.14 V | YES | 20 mm | 14 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No MCM62996FN12 | Motorola Mobility LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 52 | 12 ns | MOTOROLA INC | 16384 words | 16000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC52,.8SQ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5 V | e0 | No | EAR99 | TIN LEAD | 8542.32.00.41 | QUAD | J BEND | 1 | 1.27 mm | unknown | 52 | S-PQCC-J52 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.35 mA | 16KX16 | 3-STATE | 4.57 mm | 16 | 0.05 A | 262144 bit | PARALLEL | COMMON | CACHE TAG SRAM | 4.5 V | YES | 19.1262 mm | 19.1262 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No UPD4382361GF-A85 | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 8.5 ns | 100 MHz | RENESAS ELECTRONICS CORP | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK | Obsolete | No | 3.3 V | e0 | 3A991.B.2.A | Tin/Lead (Sn/Pb) | 8542.32.00.41 | QUAD | GULL WING | 0.635 mm | unknown | R-PQFP-G100 | Not Qualified | COMMERCIAL | SYNCHRONOUS | 0.35 mA | 256KX36 | 3-STATE | 36 | 0.01 A | 9437184 bit | PARALLEL | COMMON | STANDARD SRAM | 3.14 V | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS43DR16320B-25EBL-TR | ISSI | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 0.4 ns | 400 MHz | INTEGRATED SILICON SOLUTION INC | Integrated Silicon Solution Inc | IS43DR16320B-25EBL-TR | 1 | 33554432 words | 32000000 | 70 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA84,9X15,32 | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | NOT SPECIFIED | 5.84 | Non-Compliant | Yes | 1.8 V | e3 | Yes | Matte Tin (Sn) | AUTO/SELF REFRESH | DRAMs | CMOS | BOTTOM | BALL | 225 | 1 | 0.8 mm | compliant | R-PBGA-B84 | Not Qualified | 1.9 V | 1.8 V | COMMERCIAL | 1.7 V | 1 | SYNCHRONOUS | 0.35 mA | 32MX16 | 3-STATE | 1.2 mm | 16 | 0.008 A | 536870912 bit | COMMON | DDR DRAM | 8192 | 4,8 | 4,8 | FOUR BANK PAGE BURST | YES | 13 mm | 10.5 mm | ||||||||||||||||
![]() | Mfr Part No MCM62996FN12 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 52 | 12 ns | MOTOROLA SEMICONDUCTOR PRODUCTS | 16384 words | 16000 | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC52,.8SQ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J52 | Not Qualified | 5 V | COMMERCIAL | ASYNCHRONOUS | 0.35 mA | 16KX16 | 3-STATE | 16 | 0.05 A | 262144 bit | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCM63P531TQ7 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 7 ns | MOTOROLA SEMICONDUCTOR PRODUCTS | 32768 words | 32000 | PLASTIC/EPOXY | QFP | QFP, QFP100,.63X.87 | QFP100,.63X.87 | RECTANGULAR | FLATPACK | Obsolete | No | 3.3 V | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 0.635 mm | unknown | R-PQFP-G100 | Not Qualified | 3.3 V | SYNCHRONOUS | 0.35 mA | 32KX32 | 3-STATE | 32 | 0.065 A | 1048576 bit | PARALLEL | COMMON | STANDARD SRAM | 3.14 V | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCM63P737ZP166 | Freescale Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 119 | 3.5 ns | 166 MHz | MOTOROLA SEMICONDUCTOR PRODUCTS | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA119,7X17,50 | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 1.27 mm | unknown | R-PBGA-B119 | Not Qualified | 2.5/3.3,3.3 V | COMMERCIAL | SYNCHRONOUS | 0.35 mA | 128KX36 | 3-STATE | 36 | 0.005 A | 4718592 bit | PARALLEL | COMMON | STANDARD SRAM | 3.14 V | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IS61LV25616-8T | Integrated Circuit Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 8 ns | INTEGRATED CIRCUIT SOLUTION INC | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSOP | TSOP, TSOP44,.46,32 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | No | 3.3 V | e0 | 3A991.B.2.A | Tin/Lead (Sn/Pb) | 8542.32.00.41 | DUAL | GULL WING | 0.8 mm | unknown | R-PDSO-G44 | Not Qualified | COMMERCIAL | ASYNCHRONOUS | 0.35 mA | 256KX16 | 3-STATE | 16 | 0.01 A | 4194304 bit | PARALLEL | COMMON | STANDARD SRAM | 3 V | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 71V3556S166PF | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 3.5 ns | 166 MHz | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | QFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK | Obsolete | No | 3.3 V | e0 | 3A991.B.2.A | TIN LEAD | 8542.32.00.41 | QUAD | GULL WING | 225 | 0.635 mm | not_compliant | 20 | R-PQFP-G100 | Not Qualified | COMMERCIAL | SYNCHRONOUS | 0.35 mA | 128KX36 | 3-STATE | 36 | 0.04 A | 4718592 bit | PARALLEL | COMMON | ZBT SRAM | 3.14 V | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M5M5V5636GP-13I | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 4.2 ns | 133 MHz | RENESAS ELECTRONICS CORP | 1 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | LQFP | 14 X 20 MM, PLASTIC, TQFP-100 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 3.3 V | No | 3A991.B.2.A | PIPELINED ARCHITECTURE | 8542.32.00.41 | QUAD | GULL WING | 1 | 0.65 mm | unknown | 100 | R-PQFP-G100 | Not Qualified | 3.465 V | INDUSTRIAL | 3.135 V | SYNCHRONOUS | 0.35 mA | 512KX36 | 3-STATE | 1.6 mm | 36 | 0.03 A | 18874368 bit | PARALLEL | COMMON | STANDARD SRAM | 3.14 V | 20 mm | 14 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No IS42R32160D-6BL | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 90 | 5.4 ns | 166 MHz | INTEGRATED SILICON SOLUTION INC | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA90,9X15,32 | BGA90,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | DSBGA | Yes | 2.5 V | EAR99 | AUTO/SELF REFRESH | 8542.32.00.28 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 90 | R-PBGA-B90 | Not Qualified | 2.7 V | COMMERCIAL | 2.3 V | 1 | SYNCHRONOUS | 0.35 mA | 16MX32 | 3-STATE | 1.2 mm | 32 | 0.004 A | 536870912 bit | COMMON | SYNCHRONOUS DRAM | 8192 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 13 mm | 8 mm | |||||||||||||||||||||||||
![]() | Mfr Part No IS42R32160D-6BLI | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 90 | 5.4 ns | 166 MHz | INTEGRATED SILICON SOLUTION INC | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA90,9X15,32 | BGA90,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | DSBGA | Yes | 2.5 V | EAR99 | AUTO/SELF REFRESH | 8542.32.00.28 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 90 | R-PBGA-B90 | Not Qualified | 2.7 V | INDUSTRIAL | 2.3 V | 1 | SYNCHRONOUS | 0.35 mA | 16MX32 | 3-STATE | 1.2 mm | 32 | 0.004 A | 536870912 bit | COMMON | SYNCHRONOUS DRAM | 8192 | 1,2,4,8,FP | 1,2,4,8 | FOUR BANK PAGE BURST | YES | 13 mm | 8 mm | ||||||||||||||||||||||||
![]() | Mfr Part No MT47H64M16HR-3IT:E | Micron | Datasheet | 352 | - | Min: 1 Mult: 1 | YES | 84 | 0.45 ns | 333 MHz | MICRON TECHNOLOGY INC | Micron Technology Inc | MT47H64M16HR-3IT:E | 67108864 words | 64000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA84,9X15,32 | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | 30 | 7.88 | Yes | 1.8 V | e1 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | AUTO/SELF REFRESH | 8542.32.00.32 | DRAMs | CMOS | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 84 | R-PBGA-B84 | Not Qualified | 1.9 V | 1.8 V | INDUSTRIAL | 1.7 V | 1 | SYNCHRONOUS | 0.35 mA | 64MX16 | 3-STATE | 1.2 mm | 16 | 0.007 A | 1073741824 bit | COMMON | DDR DRAM | 8192 | 4,8 | 4,8 | MULTI BANK PAGE BURST | YES | 12.5 mm | 8 mm |
K4H561638H-UCCC
Samsung
Package:Memory
Price: please inquire
K4H561638F-UCB3
Samsung
Package:Memory
Price: please inquire
IS43DR16640A-3DBL-TR
ISSI
Package:Memory
Price: please inquire
IS43DR16320B-25DBL-TR
ISSI
Package:Memory
Price: please inquire
IS43DR16640A-3DBLI-TR
ISSI
Package:Memory
Price: please inquire
IS43DR16640-3DBLI
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
IC43R16160-6TG
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
MCM63P531TQ7
Motorola Semiconductor Products
Package:Memory
Price: please inquire
MCM62996FN12
Motorola Mobility LLC
Package:Memory
Price: please inquire
UPD4382361GF-A85
Renesas Electronics Corporation
Package:Memory
Price: please inquire
IS43DR16320B-25EBL-TR
ISSI
Package:Memory
Price: please inquire
MCM62996FN12
Freescale Semiconductor
Package:Memory
Price: please inquire
MCM63P531TQ7
Freescale Semiconductor
Package:Memory
Price: please inquire
MCM63P737ZP166
Freescale Semiconductor
Package:Memory
Price: please inquire
IS61LV25616-8T
Integrated Circuit Solution Inc
Package:Memory
Price: please inquire
71V3556S166PF
Integrated Device Technology Inc
Package:Memory
Price: please inquire
M5M5V5636GP-13I
Renesas Electronics Corporation
Package:Memory
Price: please inquire
IS42R32160D-6BL
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
IS42R32160D-6BLI
Integrated Silicon Solution Inc
Package:Memory
Price: please inquire
MT47H64M16HR-3IT:E
Micron
Package:Memory
Price: please inquire
