The category is 'Memory'
Memory (2)
- All Manufacturers
- Access Time-Max
- Additional Feature
- Clock Frequency-Max (fCLK)
- ECCN Code
- HTS Code
- I/O Type
- Ihs Manufacturer
- JESD-30 Code
- Length
- Memory Density
- Memory Width
- Supply Current-Max
- Supply Current-Max:
0.355 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Data Rate Architecture | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Clock Rate | Maximum Operating Supply Voltage | Minimum Operating Supply Voltage | Mounting | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supplier Package | Supply Voltage-Nom (Vsup) | Timing Type | Typical Operating Supply Voltage | Usage Level | Operating Temperature | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Architecture | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Refresh Cycles | Sequential Burst Length | Interleaved Burst Length | Access Mode | Self Refresh | Length | Width |
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![]() | Mfr Part No H5TQ1G63AFP-G8C | SK Hynix Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 96 | 0.15 ns | 533 MHz | SK HYNIX INC | 67108864 words | 64000000 | 85 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA96,9X16,32 | BGA96,9X16,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Obsolete | BGA | Yes | 1.5 V | EAR99 | AUTO/SELF REFRESH | 8542.32.00.32 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 96 | R-PBGA-B96 | Not Qualified | 1.575 V | OTHER | 1.425 V | 1 | SYNCHRONOUS | 0.355 mA | 64MX16 | 3-STATE | 1.1 mm | 16 | 0.01 A | 1073741824 bit | COMMON | DDR3 DRAM | 8192 | 4,8 | 4,8 | MULTI BANK PAGE BURST | YES | 13 mm | 8 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No GS864218B-250M | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | YES | 119 | 6.5 ns | 250 MHz | SDR | GSI TECHNOLOGY | GSI Technology | GS864218B-250M | 153@Flow-Through/250@Pipelined MHz | 2.7, 3.6 V | 2.3, 3 V | Surface Mount | 18 Bit | 4 MWords | 4000000 | 125 °C | -55 °C | PLASTIC/EPOXY | BGA | BGA, BGA119,7X17,50 | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.43 | No | FBGA | 2.5 V | Synchronous | 2.5, 3.3 V | Military grade | -55 to 125 °C | e0 | No | 3A991.B.2.B | Tin/Lead (Sn/Pb) | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | 2.7 V | 2.5/3.3 V | MILITARY | 2.3 V | 2 | SYNCHRONOUS | 0.355 mA | Flow-Through/Pipelined | 4MX18 | 3-STATE | 1.99 mm | 18 | 22 Bit | 72 Mbit | 0.14 A | 75497472 bit | Military | PARALLEL | COMMON | CACHE SRAM | 2.3 V | 22 mm | 14 mm |

