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Memory (20)

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Supply Current-Max:
0.36 mA

Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Factory Lead Time	Mount	Mounting Type	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Access Time-Max	Base Product Number	Clock Frequency-Max (fCLK)	Ihs Manufacturer	Manufacturer	Manufacturer Package Code	Manufacturer Part Number	Memory Types	Mfr	Moisture Sensitivity Levels	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supply Voltage-Nom (Vsup)	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Brand Name	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Interface	Max Supply Voltage	Min Supply Voltage	Memory Size	Number of Ports	Nominal Supply Current	Operating Mode	Clock Frequency	Supply Current-Max	Access Time	Memory Format	Memory Interface	Organization	Output Characteristics	Seated Height-Max	Memory Width	Write Cycle Time - Word, Page	Address Bus Width	Density	Standby Current-Max	Memory Density	Screening Level	Parallel/Serial	I/O Type	Sync/Async	Word Size	Memory IC Type	Standby Voltage-Min	Output Enable	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Self Refresh	Memory Organization	Length	Width	Thickness	Radiation Hardening	Lead Free
Mfr Part No CY7C1347D-200AC	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1					YES			100	3 ns			CYPRESS SEMICONDUCTOR CORP	Cypress Semiconductor		CY7C1347D-200AC			3	131072 words	128000	70 °C			PLASTIC/EPOXY	LQFP	14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Obsolete	QFP		30	5.5		No	3.3 V					e0	No	3A991.B.2.A	TIN LEAD (800)			PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS		QUAD	GULL WING	225	1	0.65 mm	compliant			100	R-PQFP-G100	Not Qualified			3.63 V	3.3 V	COMMERCIAL	3.135 V							SYNCHRONOUS		0.36 mA				128KX36	3-STATE	1.6 mm	36				0.01 A	4718592 bit		PARALLEL	COMMON			CACHE SRAM	3.14 V								20 mm	14 mm
Mfr Part No GS832236E-225M	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks				YES			165	7 ns		225 MHz	GSI TECHNOLOGY	GSI Technology		GS832236E-225M				1048576 words	1000000	125 °C	-55 °C		PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Obsolete	BGA			5.66		No	2.5 V							3A991.B.2.B				FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	8542.32.00.41	SRAMs	CMOS		BOTTOM	BALL		1	1 mm	unknown			165	R-PBGA-B165	Not Qualified			2.7 V	2.5/3.3 V	MILITARY	2.3 V							SYNCHRONOUS		0.36 mA				1MX36	3-STATE	1.5 mm	36				0.2 A	36		PARALLEL	COMMON			CACHE SRAM	2.3 V								17 mm	15 mm
Mfr Part No 709359L9BF	Renesas	Datasheet	-	-	Min: 1 Mult: 1		Surface Mount			YES	100		100	20 ns			INTEGRATED DEVICE TECHNOLOGY INC	Integrated Device Technology Inc	BF100	709359L9BF			3	8000	8000	70 °C			PLASTIC/EPOXY	LFBGA	FPBGA-100	BGA100,10X10,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	CABGA		NOT SPECIFIED	5.91	Compliant	No	5 V					e0	No	EAR99	Tin/Lead (Sn63Pb37)	70 °C	0 °C	FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS		BOTTOM	BALL	225	1	0.8 mm	not_compliant	40 MHz		100	S-PBGA-B100	Not Qualified	Integrated Device Technology	5 V	5.5 V	5 V	COMMERCIAL	4.5 V		5.5 V	4.5 V		2	360 mA	SYNCHRONOUS		0.36 mA	20 ns			8KX18	3-STATE	1.5 mm	18		26 b	144 kb	0.003 A	147456 bit		PARALLEL	COMMON	Synchronous	18 b	DUAL-PORT SRAM	4.5 V								10 mm	10 mm	1.4 mm	No	Contains Lead
Mfr Part No IS46DR16640A-25EBLA1	ISSI	Datasheet	-	-	Min: 1 Mult: 1			Surface Mount	8-SMD, Flat Lead	YES		SNT-8A	84	0.4 ns	S-24C08	400 MHz	INTEGRATED SILICON SOLUTION INC	Integrated Silicon Solution Inc		IS46DR16640A-25EBLA1	Non-Volatile	ABLIC Inc.		67108864 words	64000000	85 °C	-40 °C	Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;	PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	DSBGA	Active	40	5.5		Yes	1.8 V	Automotive grade	-40°C ~ 85°C (TA)		-	e1	Yes	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)			AUTO/SELF REFRESH	8542.32.00.32	DRAMs	EEPROM	1.7V ~ 5.5V	BOTTOM	BALL	260	1	0.8 mm	compliant			84	R-PBGA-B84	Not Qualified			1.9 V	1.8 V	INDUSTRIAL	1.7 V				8Kbit	1		SYNCHRONOUS	1 MHz	0.36 mA	500 ns	EEPROM	I²C	64MX16	3-STATE	1.2 mm	16	5ms			0.015 A	1073741824 bit	AEC-Q100		COMMON			DDR DRAM			8192	4,8	4,8	MULTI BANK PAGE BURST	YES	1K x 8	13.65 mm	8 mm
Mfr Part No 709349L9BF	Integrated Device Technology (IDT)	Datasheet	-	-	Min: 1 Mult: 1					YES			100	20 ns			INTEGRATED DEVICE TECHNOLOGY INC	Integrated Device Technology Inc	BF100	709349L9BF			3	4096 words	4000	70 °C			PLASTIC/EPOXY	LFBGA	FPBGA-100	BGA100,10X10,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Obsolete	CABGA		NOT SPECIFIED	5.91		No	5 V					e0	No	EAR99	Tin/Lead (Sn63Pb37)			FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS		BOTTOM	BALL	225	1	0.8 mm	not_compliant			100	S-PBGA-B100	Not Qualified	Integrated Device Technology		5.5 V	5 V	COMMERCIAL	4.5 V					2		SYNCHRONOUS		0.36 mA				4KX18	3-STATE	1.5 mm	18				0.003 A	73728 bit		PARALLEL	COMMON			DUAL-PORT SRAM	4.5 V								10 mm	10 mm
Mfr Part No IS43DR16640A-25EBL-TR	ISSI	Datasheet	-	-	Min: 1 Mult: 1					YES			84	0.4 ns		400 MHz	INTEGRATED SILICON SOLUTION INC	Integrated Silicon Solution Inc		IS43DR16640A-25EBL-TR				67108864 words	64000000	70 °C			PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete				5.42		Yes	1.8 V											AUTO/SELF REFRESH		DRAMs	CMOS		BOTTOM	BALL		1	0.8 mm	compliant				R-PBGA-B84	Not Qualified			1.9 V	1.8 V	COMMERCIAL	1.7 V					1		SYNCHRONOUS		0.36 mA				64MX16	3-STATE	1.2 mm	16				0.015 A	1073741824 bit			COMMON			DDR DRAM			8192	4,8	4,8	MULTI BANK PAGE BURST	YES		13.65 mm	8 mm
Mfr Part No IS43DR16640A-25EBLI-TR	ISSI	Datasheet	-	-	Min: 1 Mult: 1					YES			84	0.4 ns		400 MHz	INTEGRATED SILICON SOLUTION INC	Integrated Silicon Solution Inc		IS43DR16640A-25EBLI-TR				67108864 words	64000000	85 °C	-40 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete				5.42		Yes	1.8 V											AUTO/SELF REFRESH		DRAMs	CMOS		BOTTOM	BALL		1	0.8 mm	compliant				R-PBGA-B84	Not Qualified			1.9 V	1.8 V	INDUSTRIAL	1.7 V					1		SYNCHRONOUS		0.36 mA				64MX16	3-STATE	1.2 mm	16				0.015 A	1073741824 bit			COMMON			DDR DRAM			8192	4,8	4,8	MULTI BANK PAGE BURST	YES		13.65 mm	8 mm
Mfr Part No K7N163631B-PI25	Samsung Semiconductor	Datasheet	-	-	Min: 1 Mult: 1					YES			100	2.6 ns		250 MHz	SAMSUNG SEMICONDUCTOR INC						1	524288 words	512000	85 °C	-40 °C		PLASTIC/EPOXY	QFP	QFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK	Obsolete						Yes						e3	Yes	3A991.B.2.A	MATTE TIN				8542.32.00.41				QUAD	GULL WING			0.635 mm	unknown				R-PQFP-G100	Not Qualified					INDUSTRIAL								SYNCHRONOUS		0.36 mA				512KX36	3-STATE		36				0.13 A	18874368 bit		PARALLEL	COMMON			ZBT SRAM	3.14 V
Mfr Part No MCM67W618FN12	Freescale Semiconductor	Datasheet	-	-	Min: 1 Mult: 1					YES			52	12 ns			MOTOROLA SEMICONDUCTOR PRODUCTS							65536 words	64000	70 °C			PLASTIC/EPOXY	QCCJ	QCCJ, LDCC52,.8SQ	LDCC52,.8SQ	SQUARE	CHIP CARRIER	Obsolete						No	5 V					e0			Tin/Lead (Sn/Pb)								QUAD	J BEND			1.27 mm	unknown				S-PQCC-J52	Not Qualified				5 V	COMMERCIAL								ASYNCHRONOUS		0.36 mA				64KX18	3-STATE		18					1179648 bit		PARALLEL	COMMON			STANDARD SRAM
Mfr Part No IDT70V3389S6PRFI	Integrated Device Technology Inc	Datasheet	-	-	Min: 1 Mult: 1					YES			128	6 ns		83 MHz	INTEGRATED DEVICE TECHNOLOGY INC						3	65536 words	64000	85 °C	-40 °C		PLASTIC/EPOXY	LFQFP	PLASTIC, TQFP-128	QFP128,.63X.87,20	RECTANGULAR	FLATPACK, LOW PROFILE, FINE PITCH	Obsolete	QFP					No	3.3 V					e0	No	3A991.B.2.A	Tin/Lead (Sn85Pb15)			PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE	8542.32.00.41				QUAD	GULL WING	225	1	0.5 mm	not_compliant		30	128	R-PQFP-G128	Not Qualified			3.45 V		INDUSTRIAL	3.15 V					2		SYNCHRONOUS		0.36 mA				64KX18	3-STATE	1.6 mm	18				0.03 A	1179648 bit		PARALLEL	COMMON			MULTI-PORT SRAM	3.15 V								20 mm	14 mm
Mfr Part No MCM62990AFN20	Motorola Semiconductor Products	Datasheet	-	-	Min: 1 Mult: 1					YES			52	20 ns			MOTOROLA INC							16384 words	16000	70 °C			PLASTIC/EPOXY	QCCJ	PLASTIC, LCC-52	LDCC52,.8SQ	SQUARE	CHIP CARRIER	Obsolete						No	5 V					e0		EAR99	TIN LEAD			OUTPUT BUFFER SUPPLY VOLTAGE 5V+/-10% OR 3.3V+/-10%; BYTE WRITE; INPUT DATA LATCH	8542.32.00.41				QUAD	J BEND		1	1.27 mm	unknown				S-PQCC-J52	Not Qualified			5.5 V		COMMERCIAL	4.5 V					1		SYNCHRONOUS		0.36 mA				16KX16	3-STATE	4.57 mm	16				0.07 A	262144 bit		PARALLEL	COMMON			CACHE TAG SRAM	4.5 V	YES							19.1262 mm	19.1262 mm
Mfr Part No MCM62990AFN20	Freescale Semiconductor	Datasheet	-	-	Min: 1 Mult: 1					YES			52	20 ns			MOTOROLA SEMICONDUCTOR PRODUCTS							16384 words	16000	70 °C			PLASTIC/EPOXY	QCCJ	QCCJ, LDCC52,.8SQ	LDCC52,.8SQ	SQUARE	CHIP CARRIER	Obsolete						No	5 V					e0			Tin/Lead (Sn/Pb)								QUAD	J BEND			1.27 mm	unknown				S-PQCC-J52	Not Qualified				5 V	COMMERCIAL								SYNCHRONOUS		0.36 mA				16KX16	3-STATE		16				0.07 A	262144 bit		PARALLEL	COMMON			STANDARD SRAM	4.5 V
Mfr Part No MCM62995FN25	Motorola Semiconductor Products	Datasheet	-	-	Min: 1 Mult: 1					YES			52	25 ns			MOTOROLA INC							16384 words	16000	70 °C			PLASTIC/EPOXY	QCCJ	QCCJ, LDCC52,.8SQ	LDCC52,.8SQ	SQUARE	CHIP CARRIER	Obsolete						No	5 V					e0		EAR99	TIN LEAD				8542.32.00.41				QUAD	J BEND		1	1.27 mm	unknown				S-PQCC-J52	Not Qualified			5.5 V		COMMERCIAL	4.5 V					1		ASYNCHRONOUS		0.36 mA				16KX16	3-STATE	4.57 mm	16				0.08 A	262144 bit		PARALLEL	COMMON			CACHE TAG SRAM	4.5 V	YES							19.1262 mm	19.1262 mm
Mfr Part No MCM62995FN25	Freescale Semiconductor	Datasheet	-	-	Min: 1 Mult: 1					YES			52	25 ns			MOTOROLA SEMICONDUCTOR PRODUCTS							16384 words	16000	70 °C			PLASTIC/EPOXY	QCCJ	QCCJ, LDCC52,.8SQ	LDCC52,.8SQ	SQUARE	CHIP CARRIER	Obsolete						No	5 V					e0			Tin/Lead (Sn/Pb)								QUAD	J BEND			1.27 mm	unknown				S-PQCC-J52	Not Qualified				5 V	COMMERCIAL								ASYNCHRONOUS		0.36 mA				16KX16	3-STATE		16				0.08 A	262144 bit		PARALLEL	COMMON			STANDARD SRAM	4.5 V
Mfr Part No IDT7009L20PFI	Renesas	Datasheet	-	-	Min: 1 Mult: 1					YES			100	20 ns			INTEGRATED DEVICE TECHNOLOGY INC	Integrated Device Technology Inc		IDT7009L20PFI	RAM, SRAM		3	131072 words	128000	85 °C	-40 °C		PLASTIC/EPOXY	LFQFP	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Obsolete	QFP		20	5.25	Compliant	No	5 V					e0	No	3A991.B.2.A	Tin/Lead (Sn85Pb15)	85 °C	-40 °C		8542.32.00.41	SRAMs	CMOS		QUAD	GULL WING	240	1	0.5 mm	not_compliant			100	S-PQFP-G100	Not Qualified			5.5 V	5 V	INDUSTRIAL	4.5 V	Parallel				2		ASYNCHRONOUS		0.36 mA				128KX8	3-STATE	1.6 mm	8				0.006 A	1048576 bit		PARALLEL	COMMON			DUAL-PORT SRAM	4.5 V								14 mm	14 mm
Mfr Part No IDT71V35761S200BG8	Renesas	Datasheet	-	-	Min: 1 Mult: 1					YES			119	3.1 ns		200 MHz	INTEGRATED DEVICE TECHNOLOGY INC	Integrated Device Technology Inc		IDT71V35761S200BG8	RAM, SRAM		3	131072 words	128000	70 °C			PLASTIC/EPOXY	BGA	BGA-119	BGA119,7X17,50	RECTANGULAR	GRID ARRAY	Obsolete	BGA		NOT SPECIFIED	5.77	Non-Compliant	No	3.3 V			Tape & Reel (TR)		e0		3A991.B.2.A	Tin/Lead (Sn63Pb37)	70 °C	0 °C	PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS		BOTTOM	BALL	NOT SPECIFIED	1	1.27 mm	not_compliant	200 MHz		119	R-PBGA-B119	Not Qualified			3.465 V	3.3 V	COMMERCIAL	3.135 V	Parallel						SYNCHRONOUS		0.36 mA				128KX36	3-STATE	2.36 mm	36				0.03 A	4718592 bit		PARALLEL	COMMON			CACHE SRAM	3.14 V								22 mm	14 mm
Mfr Part No MCM67W618FN12	Motorola Mobility LLC	Datasheet	-	-	Min: 1 Mult: 1					YES			52	12 ns			MOTOROLA INC							65536 words	64000	70 °C			PLASTIC/EPOXY	QCCJ	QCCJ, LDCC52,.8SQ	LDCC52,.8SQ	SQUARE	CHIP CARRIER	Obsolete	LCC					No	5 V					e0	No	3A991.B.2.A	TIN LEAD			ADDRESS LATCH	8542.32.00.41				QUAD	J BEND		1	1.27 mm	unknown			52	S-PQCC-J52	Not Qualified			5.5 V		COMMERCIAL	4.5 V					1		ASYNCHRONOUS		0.36 mA				64KX18	3-STATE	4.57 mm	18					1179648 bit		PARALLEL	COMMON			CACHE TAG SRAM		YES							19.1262 mm	19.1262 mm
Mfr Part No IDT70V3569S6DRI	Integrated Device Technology Inc	Datasheet	-	-	Min: 1 Mult: 1					YES			208	6 ns		83 MHz	INTEGRATED DEVICE TECHNOLOGY INC						3	16384 words	16000	85 °C	-40 °C		PLASTIC/EPOXY	FQFP	PLASTIC, QFP-208	QFP208,1.2SQ,20	SQUARE	FLATPACK, FINE PITCH	Obsolete	QFP					No	3.3 V					e0	No	3A991.B.2.B	Tin/Lead (Sn/Pb)			PIPELINED OUTPUT MODE; SELF TIMED WRITE CYCLE	8542.32.00.41				QUAD	GULL WING	NOT SPECIFIED	1	0.5 mm	not_compliant		NOT SPECIFIED	208	S-PQFP-G208	Not Qualified			3.45 V		INDUSTRIAL	3.15 V					2		SYNCHRONOUS		0.36 mA				16KX36	3-STATE	4.1 mm	36				0.03 A	589824 bit		PARALLEL	COMMON			MULTI-PORT SRAM	3.15 V								28 mm	28 mm
Mfr Part No CY7C09569V-83BBC	Cypress Semiconductor	Datasheet	-	-	Min: 1 Mult: 1					YES			172	18 ns		83 MHz	CYPRESS SEMICONDUCTOR CORP	Cypress Semiconductor		CY7C09569V-83BBC			3	16384 words	16000	70 °C			PLASTIC/EPOXY	LBGA	15 X 15 MM, 1.25 MM HEIGHT, 1 MM PITCH, BGA-172	BGA172,14X14,40	SQUARE	GRID ARRAY, LOW PROFILE	Obsolete	BGA		NOT SPECIFIED	5.81		No	3.3 V					e0		3A991.B.2.B	TIN LEAD			FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41	SRAMs	CMOS		BOTTOM	BALL	220	1	1 mm	not_compliant			172	S-PBGA-B172	Not Qualified			3.465 V	3.3 V	COMMERCIAL	3.135 V					2		SYNCHRONOUS		0.36 mA				16KX36	3-STATE	1.25 mm	36				0.001 A	589824 bit		PARALLEL	COMMON			DUAL-PORT SRAM	3.14 V								15 mm	15 mm
Mfr Part No K4H511638B-UCB0	Samsung	Datasheet	-	-	Min: 1 Mult: 1					YES			66	0.75 ns		133 MHz	SAMSUNG SEMICONDUCTOR INC	Samsung Semiconductor		K4H511638B-UCB0			3	33554432 words	32000000	70 °C			PLASTIC/EPOXY	TSSOP	TSSOP, TSSOP66,.46	TSSOP66,.46	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	Obsolete			NOT SPECIFIED	5.84		Yes	2.5 V						Yes							DRAMs	CMOS		DUAL	GULL WING	260		0.635 mm	compliant				R-PDSO-G66	Not Qualified				2.5 V	COMMERCIAL										0.36 mA				32MX16	3-STATE		16				0.005 A	536870912 bit			COMMON			DDR DRAM			8192	2,4,8	2,4,8

Memory (20)