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The category is 'Memory'

Memory (15)

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Access Time-Max
ECCN Code
Ihs Manufacturer
JESD-30 Code
Length
Memory Density
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Number of Words Code
Supply Current-Max

Supply Current-Max:
0.37 mA

Image	Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	RoHS	Factory Lead Time	Mount	Package / Case	Surface Mount	Number of Pins	Material	Number of Terminals	Access Time-Max	Clock Frequency-Max (fCLK)	Data Rate Architecture	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Package Code	Manufacturer Part Number	Maximum Clock Frequency	Maximum Clock Rate	Maximum Operating Supply Voltage	Maximum Operating Temperature	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number of I/O Lines	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Timing Type	Typical Operating Supply Voltage	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Subcategory	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Qualification Status	Brand Name	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Max Supply Voltage	Min Supply Voltage	Memory Size	Number of Ports	Nominal Supply Current	Operating Mode	Supply Current-Max	Access Time	Architecture	Data Bus Width	Organization	Output Characteristics	Seated Height-Max	Memory Width	Address Bus Width	Density	Standby Current-Max	Memory Density	Max Frequency	Screening Level	Parallel/Serial	I/O Type	Memory IC Type	Standby Voltage-Min	Refresh Cycles	Sequential Burst Length	Interleaved Burst Length	Access Mode	Self Refresh	Length	Width	Head Height	Radiation Hardening	Lead Free
	Mfr Part No GS832236AD-400I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks		BGA-165	YES			165	4 ns	400 MHz	SDR	GSI TECHNOLOGY	Parallel	GSI Technology		GS832236AD-400I	400 MHz	250@Flow-Through/400@Pipelined MHz	2.7, 3.6 V	+ 85 C	2.3, 3 V	- 40 C		Surface Mount	SMD/SMT	36 Bit	1 MWords	1000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.12		No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	2.5, 3.3 V	Industrial grade	-40 to 100 °C		GS832236AD	e0	No	3A991.B.2.B	Tin/Lead (Sn/Pb)			ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH	8542.32.00.41	SRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant		165	R-PBGA-B165	Not Qualified			2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V			36 Mbit	4		SYNCHRONOUS	0.37 mA	4 ns	Flow-Through/Pipelined		1MX36	3-STATE	1.4 mm	36	20 Bit	36 Mbit	0.04 A	37748736 bit		Industrial	PARALLEL	COMMON	CACHE SRAM	2.3 V						15 mm	13 mm
	Mfr Part No MT47H32M16HR-25:F	Micron	Datasheet	4800 In Stock	-	Min: 1 Mult: 1					YES			84	0.4 ns	400 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc		MT47H32M16HR-25:F											33554432 words	32000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	30	8.42		Yes				1.8 V							e1		EAR99	Tin/Silver/Copper (Sn/Ag/Cu)			AUTO/SELF REFRESH	8542.32.00.28	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	unknown		84	R-PBGA-B84	Not Qualified			1.9 V	1.8 V	OTHER	1.7 V				1		SYNCHRONOUS	0.37 mA				32MX16	3-STATE	1.2 mm	16			0.007 A	536870912 bit				COMMON	DDR DRAM		8192	4,8	4,8	FOUR BANK PAGE BURST	YES	12.5 mm	8 mm
	Mfr Part No MT47H32M16BN-25E:D	Micron	Datasheet	1140 In Stock	-	Min: 1 Mult: 1					YES			84	0.4 ns	400 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc		MT47H32M16BN-25E:D											33554432 words	32000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY	Obsolete	BGA	30	5.6		Yes				1.8 V							e1		EAR99	Tin/Silver/Copper (Sn/Ag/Cu)			AUTO/SELF REFRESH	8542.32.00.28	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	unknown		84	R-PBGA-B84	Not Qualified			1.9 V	1.8 V	OTHER	1.7 V				1		SYNCHRONOUS	0.37 mA				32MX16	3-STATE	1.2 mm	16			0.007 A	536870912 bit				COMMON	DDR DRAM		8192	4,8	4,8	FOUR BANK PAGE BURST	YES	12.5 mm	10 mm
	Mfr Part No 7054S20G	Renesas	Datasheet	-	-	Min: 1 Mult: 1					NO		Brass	108	20 ns			INTEGRATED DEVICE TECHNOLOGY INC		Integrated Device Technology Inc	GU108	7054S20G							1				4096 words	4000	70 °C		PLASTIC/EPOXY	PGA	PGA-108	PGA108,12X12	SQUARE	GRID ARRAY	Obsolete	PGA	NOT SPECIFIED	5.81	Non-Compliant	No				5 V							e0	No	EAR99	Tin/Lead (Sn/Pb)			AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE	8542.32.00.41	SRAMs	CMOS	PERPENDICULAR	PIN/PEG	240	1	2.54 mm	not_compliant		108	S-PPGA-P108	Not Qualified	Integrated Device Technology		5.5 V	5 V	COMMERCIAL	4.5 V				4		ASYNCHRONOUS	0.37 mA				4KX8	3-STATE	5.207 mm	8			0.015 A	32768 bit			PARALLEL	COMMON	FOUR-PORT SRAM	4.5 V						30.48 mm	30.48 mm	4.8 mm
	Mfr Part No W632GG6KB15K	Winbond	Datasheet	22000 In Stock	-	Min: 1 Mult: 1					YES			96	0.255 ns	667 MHz		WINBOND ELECTRONICS CORP		Winbond Electronics Corp		W632GG6KB15K											134217728 words	128000000	105 °C	-40 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA96,9X16,32	BGA96,9X16,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	NOT SPECIFIED	5.72		Yes				1.5 V									EAR99				AUTO/SELF REFRESH	8542.32.00.36	DRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	compliant		96	R-PBGA-B96	Not Qualified			1.575 V	1.5 V	INDUSTRIAL	1.425 V				1		SYNCHRONOUS	0.37 mA				128MX16	3-STATE	1.2 mm	16			0.065 A	2147483648 bit				COMMON	DDR DRAM		8192	8	8	MULTI BANK PAGE BURST	YES	13 mm	9 mm
	Mfr Part No IDT70T3399S133BCG	Integrated Device Technology Inc	Datasheet	-	-	Min: 1 Mult: 1					YES			256	4.2 ns	133 MHz		INTEGRATED DEVICE TECHNOLOGY INC											3				131072 words	128000	70 °C		CERAMIC, METAL-SEALED COFIRED	LBGA	LBGA, BGA256,16X16,40	BGA256,16X16,40	SQUARE	GRID ARRAY, LOW PROFILE	Transferred	BGA				Yes				2.5 V							e1	Yes	3A991.B.2.A	Tin/Silver/Copper (Sn/Ag/Cu)			FLOW-THROUGH OR PIPELINED ARCHITECTURE	8542.32.00.41			BOTTOM	BALL	260	1	1 mm	compliant	30	256	S-CBGA-B256	Not Qualified			2.6 V		COMMERCIAL	2.4 V				2		SYNCHRONOUS	0.37 mA				128KX18	3-STATE	1.7 mm	18			0.015 A	2359296 bit			PARALLEL	COMMON	MULTI-PORT SRAM	2.4 V						17 mm	17 mm
	Mfr Part No TC55VD1618FF-133	Toshiba America Electronic Components	Datasheet	-	-	Min: 1 Mult: 1					YES			100	4.2 ns	133 MHz		TOSHIBA CORP															1048576 words	1000000	70 °C		PLASTIC/EPOXY	LQFP	LQFP, QFP100,.63X.87	QFP100,.63X.87	RECTANGULAR	FLATPACK, LOW PROFILE	Obsolete	QFP				No				3.3 V							e0		3A991.B.2.A	Tin/Lead (Sn/Pb)				8542.32.00.41			QUAD	GULL WING		1	0.65 mm	unknown		100	R-PQFP-G100	Not Qualified			3.465 V		COMMERCIAL	3.135 V						SYNCHRONOUS	0.37 mA				1MX18	3-STATE	1.7 mm	18			0.01 A	18874368 bit			PARALLEL	COMMON	STANDARD SRAM	3.14 V						20 mm	14 mm
	Mfr Part No IDT7006S20PFI	Integrated Device Technology Inc	Datasheet	-	-	Min: 1 Mult: 1					YES			64	20 ns			INTEGRATED DEVICE TECHNOLOGY INC											3				16384 words	16000	85 °C	-40 °C	PLASTIC/EPOXY	LQFP	LQFP, QFP64,.66SQ,32	QFP64,.66SQ,32	SQUARE	FLATPACK, LOW PROFILE	Transferred	QFP				No				5 V							e0	No	EAR99	TIN LEAD				8542.32.00.41			QUAD	GULL WING	240	1	0.8 mm	not_compliant	30	64	S-PQFP-G64	Not Qualified			5.5 V		INDUSTRIAL	4.5 V				2		ASYNCHRONOUS	0.37 mA				16KX8	3-STATE	1.6 mm	8			0.03 A	131072 bit			PARALLEL	COMMON	MULTI-PORT SRAM	4.5 V						14 mm	14 mm
	Mfr Part No MU9C8480BF-50TBC	Music Semiconductors Inc	Datasheet	-	-	Min: 1 Mult: 1					YES			64	50 ns			MUSIC SEMICONDUCTORS INC											3				8192 words	8000	70 °C		PLASTIC/EPOXY	LQFP	LQFP, QFP64,.6SQ,32	QFP64,.6SQ,32	SQUARE	FLATPACK, LOW PROFILE	Contact Manufacturer	QFP				Yes				3.3 V									EAR99					8542.32.00.41			QUAD	GULL WING	260	1	0.8 mm	unknown		64	S-PQFP-G64	Not Qualified			3.6 V		COMMERCIAL	3 V						SYNCHRONOUS	0.37 mA				8KX64		1.45 mm	64			0.002 A	524288 bit			PARALLEL		CONTENT ADDRESSABLE SRAM							14 mm	14 mm
	Mfr Part No IDT7005S20PFB	Integrated Device Technology Inc	Datasheet	-	-	Min: 1 Mult: 1					YES			64	20 ns			INTEGRATED DEVICE TECHNOLOGY INC											3				8192 words	8000	125 °C	-55 °C	PLASTIC/EPOXY	LQFP	LQFP, QFP64,.66SQ,32	QFP64,.66SQ,32	SQUARE	FLATPACK, LOW PROFILE	Obsolete	QFP				No				5 V							e0	No	3A001.A.2.C	TIN LEAD				8542.32.00.41			QUAD	GULL WING	240	1	0.8 mm	not_compliant	30	64	S-PQFP-G64	Not Qualified			5.5 V		MILITARY	4.5 V				2		ASYNCHRONOUS	0.37 mA				8KX8	3-STATE	1.6 mm	8			0.03 A	65536 bit			PARALLEL	COMMON	MULTI-PORT SRAM	4.5 V						14 mm	14 mm
	Mfr Part No IDT70T3519S133BCG	Integrated Device Technology Inc	Datasheet	-	-	Min: 1 Mult: 1					YES			256	15 ns	133 MHz		INTEGRATED DEVICE TECHNOLOGY INC											3				262144 words	256000	70 °C		PLASTIC/EPOXY	LBGA	LBGA, BGA256,16X16,40	BGA256,16X16,40	SQUARE	GRID ARRAY, LOW PROFILE	Transferred	BGA				Yes				2.5 V							e1	Yes	3A991.B.2.A	Tin/Silver/Copper (Sn/Ag/Cu)			PIPELINED OR FLOW-THROUGH ARCHITECTURE	8542.32.00.41			BOTTOM	BALL	260	1	1 mm	compliant	30	256	S-PBGA-B256	Not Qualified			2.6 V		COMMERCIAL	2.4 V				2		SYNCHRONOUS	0.37 mA				256KX36	3-STATE	1.7 mm	36			0.015 A	9437184 bit			PARALLEL	COMMON	MULTI-PORT SRAM	2.4 V						17 mm	17 mm
	Mfr Part No MT47H32M16HW-25E:F	Micron	Datasheet	-	-	Min: 1 Mult: 1					YES			84	0.4 ns	400 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc		MT47H32M16HW-25E:F											33554432 words	32000000	85 °C		PLASTIC/EPOXY	TFBGA	8 X 12.50 MM, FBGA-84	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	NOT SPECIFIED	5.63		No				1.8 V							e0		EAR99	Tin/Lead (Sn/Pb)			AUTO/SELF REFRESH	8542.32.00.28	DRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	0.8 mm	unknown		84	R-PBGA-B84	Not Qualified			1.9 V	1.8 V	OTHER	1.7 V				1		SYNCHRONOUS	0.37 mA				32MX16	3-STATE	1.2 mm	16			0.007 A	536870912 bit				COMMON	DDR DRAM		8192	4,8	4,8	FOUR BANK PAGE BURST	YES	12.5 mm	8 mm
	Mfr Part No MT47H32M16HR-25EIT:F	Micron	Datasheet	2394 In Stock	-	Min: 1 Mult: 1			Surface Mount		YES	84		84	0.4 ns	400 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc		MT47H32M16HR-25EIT:F											33554432 words	32000000	85 °C	-40 °C	PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	BGA	30	5.63	Compliant	Yes				1.8 V					Bulk		e1		EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	-40 °C	AUTO/SELF REFRESH	8542.32.00.28	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	unknown		84	R-PBGA-B84	Not Qualified		1.8 V	1.9 V	1.8 V	INDUSTRIAL	1.7 V	1.9 V	1.7 V		1	295 mA	SYNCHRONOUS	0.37 mA	400 ps		16 b	32MX16	3-STATE	1.2 mm	16	15 b	512 Mb	0.007 A	536870912 bit	800 MHz			COMMON	DDR DRAM		8192	4,8	4,8	FOUR BANK PAGE BURST	YES	12.5 mm	8 mm		No	Lead Free
	Mfr Part No MT47H32M16BN-25:D	Micron	Datasheet	1540 In Stock	-	Min: 1 Mult: 1			Surface Mount		YES	84		84	0.4 ns	400 MHz		MICRON TECHNOLOGY INC		Micron Technology Inc		MT47H32M16BN-25:D											33554432 words	32000000	85 °C		PLASTIC/EPOXY	TFBGA	TFBGA, BGA84,9X15,32	BGA84,9X15,32	RECTANGULAR	GRID ARRAY	Obsolete	BGA	30	5.61	Compliant	Yes				1.8 V							e1		EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	0 °C	AUTO/SELF REFRESH	8542.32.00.28	DRAMs	CMOS	BOTTOM	BALL	260	1	0.8 mm	unknown		84	R-PBGA-B84	Not Qualified		1.8 V	1.9 V	1.8 V	OTHER	1.7 V	1.9 V	1.7 V		1	295 mA	SYNCHRONOUS	0.37 mA	400 ps		16 b	32MX16	3-STATE	1.2 mm	16	15 b	512 Mb	0.007 A	536870912 bit	800 MHz			COMMON	DDR DRAM		8192	4,8	4,8	FOUR BANK PAGE BURST	YES	12.5 mm	10 mm		No	Lead Free
	Mfr Part No GS8321E36AD-400I	GSI Technology	Datasheet	-	-	Min: 1 Mult: 1		8 Weeks		BGA-165	YES			165	4 ns	400 MHz	SDR	GSI TECHNOLOGY	Parallel	GSI Technology		GS8321E36AD-400I	400 MHz	250@Flow-Through/400@Pipelined MHz	2.7, 3.6 V	+ 85 C	2.3, 3 V	- 40 C		Surface Mount	SMD/SMT	36 Bit	1 MWords	1000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	LBGA, BGA165,11X15,40	BGA165,11X15,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	Active	BGA	NOT SPECIFIED	5.31		No	FBGA	3.6 V	2.3 V	2.5 V	Synchronous	2.5, 3.3 V	Industrial grade	-40 to 100 °C		GS8321E36AD	e0	No	3A991.B.2.B	TIN LEAD			IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE		SRAMs	CMOS	BOTTOM	BALL	NOT SPECIFIED	1	1 mm	compliant		165	R-PBGA-B165	Not Qualified			2.7 V	2.5/3.3 V	INDUSTRIAL	2.3 V			36 Mbit	4		SYNCHRONOUS	0.37 mA	4 ns	Flow-Through/Pipelined		1MX36	3-STATE	1.4 mm	36	20 Bit	36 Mbit	0.04 A	37748736 bit		Industrial	PARALLEL	COMMON	CACHE SRAM	2.3 V						15 mm	13 mm