The category is 'Memory'
Memory (1)
- All Manufacturers
- Access Time-Max
- Additional Feature
- Address Bus Width
- Architecture
- Clock Frequency-Max (fCLK)
- Data Rate Architecture
- Density
- ECCN Code
- Factory Lead Time
- HTS Code
- Ihs Manufacturer
- Supply Current-Max
- Supply Current-Max:
0.545 mA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Data Rate Architecture | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Clock Rate | Maximum Operating Supply Voltage | Minimum Operating Supply Voltage | Mounting | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supplier Package | Supply Voltage-Nom (Vsup) | Timing Type | Typical Operating Supply Voltage | Usage Level | Operating Temperature | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Architecture | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Length | Width |
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![]() | Mfr Part No GS8662T09BD-333I | GSI Technology | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | YES | 165 | 0.45 ns | 333 MHz | DDR | GSI TECHNOLOGY | GSI Technology | GS8662T09BD-333I | 333 MHz | 1.9 V | 1.7 V | Surface Mount | 9 Bit | 8 MWords | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA165,11X15,40 | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 5.49 | No | FBGA | 1.8 V | Synchronous | 1.8000 V | Industrial grade | -40 to 100 °C | e0 | No | 3A991.B.2.B | Tin/Lead (Sn/Pb) | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 1 | SYNCHRONOUS | 0.545 mA | Pipelined | 8MX9 | 3-STATE | 1.4 mm | 9 | 22 Bit | 72 Mbit | 0.24 A | 75497472 bit | Industrial | PARALLEL | COMMON | DDR SRAM | 1.7 V | 15 mm | 13 mm |

