The category is 'Memory'

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  • Access Time-Max
  • Additional Feature
  • Address Bus Width
  • Architecture
  • Clock Frequency-Max (fCLK)
  • Data Rate Architecture
  • Density
  • ECCN Code
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  • HTS Code
  • Ihs Manufacturer
  • Supply Current-Max
  • Supply Current-Max:

    0.545 mA

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Factory Lead Time

Surface Mount

Number of Terminals

Access Time-Max

Clock Frequency-Max (fCLK)

Data Rate Architecture

Ihs Manufacturer

Manufacturer

Manufacturer Part Number

Maximum Clock Rate

Maximum Operating Supply Voltage

Minimum Operating Supply Voltage

Mounting

Number of I/O Lines

Number of Words

Number of Words Code

Operating Temperature-Max

Operating Temperature-Min

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Part Package Code

Reflow Temperature-Max (s)

Risk Rank

Rohs Code

Supplier Package

Supply Voltage-Nom (Vsup)

Timing Type

Typical Operating Supply Voltage

Usage Level

Operating Temperature

JESD-609 Code

Pbfree Code

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Terminal Pitch

Reach Compliance Code

Pin Count

JESD-30 Code

Qualification Status

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Number of Ports

Operating Mode

Supply Current-Max

Architecture

Organization

Output Characteristics

Seated Height-Max

Memory Width

Address Bus Width

Density

Standby Current-Max

Memory Density

Screening Level

Parallel/Serial

I/O Type

Memory IC Type

Standby Voltage-Min

Length

Width

GS8662T09BD-333I

Mfr Part No

GS8662T09BD-333I

GSI Technology Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

YES

165

0.45 ns

333 MHz

DDR

GSI TECHNOLOGY

GSI Technology

GS8662T09BD-333I

333 MHz

1.9 V

1.7 V

Surface Mount

9 Bit

8 MWords

8000000

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

LBGA, BGA165,11X15,40

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

Active

BGA

NOT SPECIFIED

5.49

No

FBGA

1.8 V

Synchronous

1.8000 V

Industrial grade

-40 to 100 °C

e0

No

3A991.B.2.B

Tin/Lead (Sn/Pb)

PIPELINED ARCHITECTURE, LATE WRITE

8542.32.00.41

SRAMs

CMOS

BOTTOM

BALL

NOT SPECIFIED

1

1 mm

compliant

165

R-PBGA-B165

Not Qualified

1.9 V

1.5/1.8,1.8 V

INDUSTRIAL

1.7 V

1

SYNCHRONOUS

0.545 mA

Pipelined

8MX9

3-STATE

1.4 mm

9

22 Bit

72 Mbit

0.24 A

75497472 bit

Industrial

PARALLEL

COMMON

DDR SRAM

1.7 V

15 mm

13 mm